Experimental investigation and analysis of EMI in stacked I/O connectors of PCB

References

• Mark I. Montrose, printed circuit board design techniques for EMC compliance. New York (NY): IEEE Press; 1996.
   Google Scholar
• Archambeault BR. PCB design for real-world EMI control. New York (NY): Kluwer Academic Publishers; 2002.10.1007/978-1-4757-3640-3
   Google Scholar
• Mark I. Montrose, printed circuit board design for EMC compliance. New York (NY): IEEE Press; 1996.
   Google Scholar
• Mark I. Montrose, EMC and the printed circuit board: design, theory, and layout made simple. New York (NY): IEEE Press; 1999.
   Google Scholar
• Robertson CT. Printed circuit board designer’s reference: basics. New Jersey (NJ): Prentice Hall; Oct 16, 2003.
   Google Scholar
• Coombs CF. Printed circuit handbook. 3rd ed. New York (NY): McGraw Hill; 1988.
   Google Scholar
• Reusch D, Strydom J. Understanding the effect of PCB layout on circuit performance in a high-frequency gallium-nitride-based point of load converter. IEEE Trans. Power Electron. 2014;29:2008–2015.10.1109/TPEL.2013.2266103
   Web of Science ®Google Scholar
• Dankovic D, Vracar L, Prijic A, Prijic Z. An electromechanical approach to a printed circuit board design course. Educ. IEEE Trans. 2013;56:470–477.10.1109/TE.2013.2257784
   Web of Science ®Google Scholar
• Archambeault B, Connor S, Halligan MS, Drewniak JL, Ruehli AE. Electromagnetic radiation resulting from PCB/high-density connector interfaces. Electromagn. Compat. IEEE Trans. 2013;55:614–623.10.1109/TEMC.2013.2261736
   Web of Science ®Google Scholar
• Paul CR. Introduction to electromagnetic compatibility. New York (NY): John Wiley & Sons; 1992.
   Google Scholar
• Goedbloed JJ. Electromagnetic compatibility. New Jersey (NJ): Prentice Hall; 1992.
   Google Scholar
• Prasad Kodali V. Engineering electromagnetic compatibility. New York (NY): IEEE Press; 2001.10.1109/9780470544556
   Google Scholar
• Prasad Kodali V. Engineering electromagnetic compatibility. New York (NY): IEEE Press; 1996.
   Google Scholar
• Babb SM, Kolb LE, Davis B, et al. Method for manufacturing a printed circuit board having conformal EMI shield. U.S. Patent No. 8,156,644. 17 Apr, 2012.
   Google Scholar
• Devabhaktuni V, Bunting CF, Green D, Kvale D, Mareddy L, Rajamani V. A new ANN-based modeling approach for rapid EMI/EMC analysis of PCB and shielding enclosures. Electromagn. Compat. IEEE Trans. 2013;55:385–394.10.1109/TEMC.2012.2214223
   Web of Science ®Google Scholar
• Zhao, W-J, Wang B-F, Liu E-X, et al. An effective and efficient approach for radiated emission prediction based on amplitude-only near-field measurements. Electromagn. Compat. IEEE Trans. 2012;54:1186–1189.10.1109/TEMC.2012.2215874
   Web of Science ®Google Scholar
• Montrose MI, Nakauchi EM. Testing for EMC compliance. New York (NY): IEEE Press; 2004.10.1002/047164465X
   Google Scholar
• Mardiguian M. EMI troubleshooting techniques. New York (NY): McGraw-Hill; 1999.
   Google Scholar
• Woodyard JP, King JJ. PCB management handbook. New York (NY): Executive Enterprises Publications; 1992.
   Google Scholar
• FCC CFR47 Part 15-Radio Frequency Devices. Annual reports of the FCC to congress. FCC record of orders and decisions. Feb 16, 2006.
   Google Scholar
• CISPR 22. Information technology equipment radio disturbance characteristics limits and methods of measurement, International Electrotechnical Commission, 4th ed. April, 2003.
   Google Scholar
• Zhang J, Li Y. The study of the standards architecture and the standards attributes based on EMC standards and TEMPEST standards in computer system. Computer science & education (ICCSE), 2013 8th international conference on. IEEE; 26–28 April 2013; pp. 224–227.
   Google Scholar
• Williams T. EMC for product designers. Oxford (UK): Newnes; 2011.
   Google Scholar
• Mardiguian M. Interference control in computers and microprocessor-based equipment. Warrenton (VA): Don White Consultants; 1984.
   Google Scholar
• Mardiguian M. Controlling radiated emissions by design. 2nd ed. Berlin: Springer; 2000.
   Google Scholar
• Ott HW. Noise reduction techniques in electronic systems. 2nd ed. New York (NY): Wiley; 1988.
   Google Scholar
• Spiazzi G, Zuccato A. EMI course notes. Padova: University of Padova; 2001.
   Google Scholar
• Lei X, Sun J. Conducted common-mode EMI reduction by impedance balancing. Power Electron. IEEE Trans. 2012;27:1084–1089.10.1109/TPEL.2011.2176750
   Web of Science ®Google Scholar
• Archambeault B, Connor S, Halligan MS, Drewniak JL, Ruehli AE. Electromagnetic radiation resulting from PCB/high-density connector interfaces. Electromagn. Compat. IEEE Trans. 2013;55:614–623.
   Web of Science ®Google Scholar
• Hayashi Y-I, KAYANO Y, Mizuki T, Sone H, Inoue H. Contact conditions in connectors that cause common mode radiation. IEICE Trans. Electron. 2011;94:1369–1374.10.1587/transele.E94.C.1369
   Web of Science ®Google Scholar
• Hall SH, Hall GW, McCall JA. High-speed digital system design: a handbook of interconnect theory and design practices. New York (NY): Wiley; 2000.
   Google Scholar
• Johnson HW, Graham M. High-speed signal propagation: advanced black magic. New Jersey (NJ): Prentice Hall; 2003.
   Google Scholar
• Brooks D. Signal integrity issues and printed circuit board design. New Jersey (NJ): Prentice Hall; 2003.
   Google Scholar
• Johnson HW, Graham M. High-speed digital design: a handbook of black magic. New Jersey (NJ): Prentice Hall; 1993.
   Google Scholar
• Lou X, Zhao y, Chen X, Zhang y, He X. Radiated EMI noise mitigation based on signal integrity applied for PCB. J. Nanjing Normal Univ. (Eng. Technol. Ed.) 2012;2:28–31.
   Google Scholar
• Le W, Pei D, Cui C. PCB design and simulation of high-speed data acquisition memorizer based on signal integrity. Electron. Test. 2011;11:76–80.
   Google Scholar
• Chou H-H, Tuan S-C, Chou H-T, et al. Investigation of electromagnetic interferences caused by the stacked I/O connectors. Antennas and propagation (APSURSI), 2011 IEEE international symposium; 3–8 Jul, 2011. p. 1889–1892.
   Google Scholar
• Kuo L-R, Chou H-T, Lee Y-S, et al. Electromagnetic interferences caused by the common-mode noises from stacked I/O connectors and their treatments. Wireless information technology and systems (ICWITS), 2010 IEEE international conference; Aug. 28 2010–Sept. 3 2010. p. 1–4.
   Google Scholar
• Ansoft Corporation. High frequency structure simulator (HSFF) user manual. Pittsburgh, PA: Ansoft Corporation; 2001.
   Google Scholar