An innovative manifold microchannel heat sink for thermal management of high-power chips with multiple hotspots

Abstract

In this study, we propose an innovative manifold microchannel heat sink (MMCHS) featuring perforated baffle structures, which is specifically engineered to address the thermal management challenges associated with chips that exhibit multiple hotspots. By enhancing the conventional Z-shaped MMCHS, we designed a cost-effective and efficient cooling solution tailored specifically for precise temperature regulation across multiple hotspots. We employed numerical simulation techniques to analyze the flow dynamics and heat transfer properties of the optimized manifold microchannel heat sink (OMMCHS) across various baffle configurations and perforation densities. The findings reveal that the OMMCHS significantly outperforms the traditional Z-shaped MMCHS, establishing it as a superior option for cooling of high-power chips with multiple hotspots. Notably, the OMMCHS configuration equipped with I-type baffles and a 50% perforation rate yields the most favorable results, ensuring temperature homogeneity across the hotspots at an inlet velocity of 1.9 m/s. Compared to the MMCHS, the OMMCHS reduces pump power consumption by up to 77.8% while maintaining the same peak temperature, highlighting its efficiency and effectiveness in thermal management.

Keywords:

• manifold microchannel heat sink
• multiple hotspots
• thermal management
• structural optimization
• baffle

Disclosure statement

The authors declare that they have no competing financial interests or personal relationships that could appear to influence the work reported in this article.

Additional information

Funding

This work was financially supported by the National Natural Science Foundation of China (NSFC) [grant number 52006095] and the Major Science and Technology Research and Development Project of Jiangxi Province, China [grant number 20223AAE02012].