393
Views
0
CrossRef citations to date
0
Altmetric
Research Article

Anomaly detection of semiconductor processing equipment using equipment behaviour

ORCID Icon, , , & ORCID Icon
Pages 332-337 | Received 17 Jul 2023, Accepted 31 Oct 2023, Published online: 13 Nov 2023

Figures & data

Figure 1. Schematic diagram of deposition equipment.

Figure 1. Schematic diagram of deposition equipment.

Figure 2. Scatter plots of oxygen concentration and pressure in the monitoring section: (a) normal equipment and (b) anomalous equipment.

Figure 2. Scatter plots of oxygen concentration and pressure in the monitoring section: (a) normal equipment and (b) anomalous equipment.

Figure 3. Oxygen concentration change during N2 purge.

Figure 3. Oxygen concentration change during N2 purge.

Table 1. Measurements and preprocessing used for feature extraction.

Figure 4. Image of displacement from the first quartile interval to the fourth quartile interval.

Figure 4. Image of displacement from the first quartile interval to the fourth quartile interval.

Table 2. Two-dimensional distribution table of OX and PR10MA,d.

Table 3. Features calculated from data acquired from the equipment.

Table 4. Comparison of AUC for univariate detection models.

Table 5. Comparison of detection ability of models made with two features.

Table 6. Comparison of detection ability of models made with three features.

Table 7. Comparison of detection ability of models made with four features.

Table 8. Anomaly detection result by a single variable model (using F06).

Table 9. Anomaly detection result by two variables model (using F06, F16).

Table 10. Anomaly detection result by three variables model (using F06, F10, F11).