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Research Article

Influence of the preparation processes on the residual stresses in PCD and PcBN tools

ORCID Icon, ORCID Icon & ORCID Icon
Article: 2350936 | Received 13 Nov 2023, Accepted 29 Apr 2024, Published online: 08 Jun 2024

Figures & data

Table 1. Measurement settings for Raman spectroscopy

Figure 1. Measuring positions Raman spectroscopy.

Figure 1. Measuring positions Raman spectroscopy.

Figure 2. Raman-spectra of cBN and diamond.

Figure 2. Raman-spectra of cBN and diamond.

Figure 3. Influence of grinding on PCD peak position.

Figure 3. Influence of grinding on PCD peak position.

Figure 4. Influence of grinding on cBN peak position LO-Mode.

Figure 4. Influence of grinding on cBN peak position LO-Mode.

Figure 5. Setup and determination of the conversion factors.

Figure 5. Setup and determination of the conversion factors.

Table 2. Conversion parameters C and stress-free wavenumber ω0.

Figure 6. Residual stresses converted from Raman spectra after grinding and brushing PcBN.

Figure 6. Residual stresses converted from Raman spectra after grinding and brushing PcBN.

Figure 7. Mean residual stresses converted from Raman spectra after grinding PCD.

Figure 7. Mean residual stresses converted from Raman spectra after grinding PCD.