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Review Article

The polishing methods for large area CVD diamond wafer

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Article: 2246495 | Received 13 May 2023, Accepted 06 Aug 2023, Published online: 16 Aug 2023

Figures & data

Figure 1. Mechanical polishing (MP): (a) Schematic diagram of the setup for MP experiments; (b) Optical images of MP [Citation56]; (c) Typical AFM roughness image of MP [Citation49]; (d) Scanning electron microscope images of MP [Citation19].

Figure 1. Mechanical polishing (MP): (a) Schematic diagram of the setup for MP experiments; (b) Optical images of MP [Citation56]; (c) Typical AFM roughness image of MP [Citation49]; (d) Scanning electron microscope images of MP [Citation19].

Table 1. Evaluation of different polishing methods for polycrystalline CVD diamond wafer.

Figure 2. Chemical mechanical polishing (CMP): (a) Schematic diagram of the setup for CMP experiments (Adapted from ref. [Citation43]); (b) Typical AFM roughness image of CMP [Citation41]; (c) Surface optical images of CMP [Citation41].

Figure 2. Chemical mechanical polishing (CMP): (a) Schematic diagram of the setup for CMP experiments (Adapted from ref. [Citation43]); (b) Typical AFM roughness image of CMP [Citation41]; (c) Surface optical images of CMP [Citation41].

Figure 3. Thermo-chemical polishing (TCP): (a) Schematic diagram of the setup for TCP experiments. (Adapted from ref. [Citation58]); (b) Typical AFM roughness image of TCP [Citation85]; (c) Surface optical images of TCP [Citation85].

Figure 3. Thermo-chemical polishing (TCP): (a) Schematic diagram of the setup for TCP experiments. (Adapted from ref. [Citation58]); (b) Typical AFM roughness image of TCP [Citation85]; (c) Surface optical images of TCP [Citation85].

Figure 4. Dynamic friction polishing (DFP): (a) Schematic diagram of the setup for DFP. (Adapted from ref. [Citation86]); (b) Typical AFM roughness image of DFP [Citation67]; (c) Scanning electron microscope images of DFP [Citation87].

Figure 4. Dynamic friction polishing (DFP): (a) Schematic diagram of the setup for DFP. (Adapted from ref. [Citation86]); (b) Typical AFM roughness image of DFP [Citation67]; (c) Scanning electron microscope images of DFP [Citation87].

Figure 5. Laser polishing (LP): (a) Schematic diagram of the setup for LP (Adapted from ref. [Citation89]); (b) Typical AFM roughness image of LP [Citation88]; (c) Scanning electron microscope images of LP [Citation90].

Figure 5. Laser polishing (LP): (a) Schematic diagram of the setup for LP (Adapted from ref. [Citation89]); (b) Typical AFM roughness image of LP [Citation88]; (c) Scanning electron microscope images of LP [Citation90].

Figure 6. Ion beam polishing (IBP): (a) An ion beam machining apparatus equipped with a high-voltage discharge-type ion source (Adapted from ref. [Citation92]); (b) Typical AFM roughness image of IBP [Citation93]; (c) Scanning electron microscope images of IBP [Citation91].

Figure 6. Ion beam polishing (IBP): (a) An ion beam machining apparatus equipped with a high-voltage discharge-type ion source (Adapted from ref. [Citation92]); (b) Typical AFM roughness image of IBP [Citation93]; (c) Scanning electron microscope images of IBP [Citation91].

Figure 7. Plasma assisted polishing (PAP): (a) Plasma polishing system with parallel stainless steel rods (Adapted from ref. [Citation26]); (b) Optical images of PAP [Citation9]; (c) Typical AFM roughness image of PAP [Citation49]; (d) Scanning electron microscope images of PAP [Citation9].

Figure 7. Plasma assisted polishing (PAP): (a) Plasma polishing system with parallel stainless steel rods (Adapted from ref. [Citation26]); (b) Optical images of PAP [Citation9]; (c) Typical AFM roughness image of PAP [Citation49]; (d) Scanning electron microscope images of PAP [Citation9].

Table 2. Comparison of various methods for polishing diamond materials.

Figure 8. K values depending on polishing parameters in DFP: (a) K vs polishing time; (b) K vs polishing load; (c) K vs polishing plate linear velocity [Citation86].

Figure 8. K values depending on polishing parameters in DFP: (a) K vs polishing time; (b) K vs polishing load; (c) K vs polishing plate linear velocity [Citation86].

Figure 9. (a) Polishing load vs. K; (b) Polishing plate linear velocity vs. K. (MP: [Citation80, Citation95], CMP: [Citation43], DFP: [Citation86], TCP: [Citation23, Citation32, Citation72]).

Figure 9. (a) Polishing load vs. K; (b) Polishing plate linear velocity vs. K. (MP: [Citation80, Citation95], CMP: [Citation43], DFP: [Citation86], TCP: [Citation23, Citation32, Citation72]).

Figure 10. (a) K of each polishing method calculated based on data in references; (b) CI of each polishing method calculated based on data in references. (MP: [Citation19, Citation56, Citation80–82], CMP: [Citation41, Citation43, Citation84], TCP: [Citation23, Citation32, Citation58, Citation72], DFP: [Citation38, Citation42], LP: [Citation58, Citation63], IBP: [Citation59, Citation69, Citation91], PAP: [Citation94]).

Figure 10. (a) K of each polishing method calculated based on data in references; (b) CI of each polishing method calculated based on data in references. (MP: [Citation19, Citation56, Citation80–82], CMP: [Citation41, Citation43, Citation84], TCP: [Citation23, Citation32, Citation58, Citation72], DFP: [Citation38, Citation42], LP: [Citation58, Citation63], IBP: [Citation59, Citation69, Citation91], PAP: [Citation94]).