Effects of Cu particle size on CuSnFeNi/diamond composite processed using hybrid microwave sintering

ABSTRACT

The paper investigates the effects of Cu particle size on diamond composites experimentally. The hybrid microwave sintering process is proposed to obtain the particle size microstructure throughout the rapid heating. The effects of Cu particles on the hardness, flexural strength, and thermal conductivity are experimentally investigated. The experimental results indicate that the Cu particle size has a significant impact on the physical and mechanical properties of the CuSnFeNi/diamond composites. The smaller the Cu particle size, the larger thermal conductivity, the hardness, and flexural strength are obtained. This study provides an effective means to enhance the mechanical properties of the CuSnFeNi/diamond composite by adjusting the Cu particle size.

KEYWORDS:

• Particle size
• thermal conductivity
• mechanical properties
• metal matrix composites

Disclosure statement

No potential conflict of interest was reported by the authors.

Notes on contributors

Jianwu Yu, Professor, College of Mechanical & Vehicle Engineering, Hunan University. Research areas: Non-traditional Machining, Precision Machining, Advanced Manufacturing Technology, Microwave Sintering.

Liang Huang, Ph.D. candidate, College of Mechanical & Vehicle Engineering, Hunan University. Research areas: Precision Machining, Microwave Sintering.

Hong Luo, Ph.D. candidate, College of Mechanical & Vehicle Engineering, Hunan University. Research areas: Non-traditional Machining, Precision Machining, Glass Molding Press.

ORCID

Liang Huang http://orcid.org/0000-0002-6299-2522

Hong Luo http://orcid.org/0000-0002-4811-7764

Additional information

Funding

This work was supported by National Natural Science Foundation of China: [Grant Number No. 51575174].