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Research Article

Development of Microwave Components Using Additive Manufacturing: A Review

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Published online: 17 Jun 2024
 

Abstract

In modern telecommunication, there is a growing demand for lightweight, low-cost, and compact microwave components with high transmission functionalities, especially for applications requiring multiple high-performance antennas to provide multi-beam capabilities. Additive manufacturing (AM), also known as three-dimensional (3D) printing, has emerged as a promising solution to meet these demands due to its simplicity, fast prototyping capabilities, and enhanced fabrication accuracy. AM technology has found widespread adoption across various industries, including space-borne, satellite, handheld wireless systems, biomedical, mechanical, electrical, optical, and environmental applications. In particular, AM-based microwave components offer significant advantages, including reduced weight compared to traditional aluminum prototypes, with savings of up to two-thirds of the weight. This paper presents a comprehensive review of the AM process, materials used, and microwave components developed using AM technology. The review encompasses various aspects, including fabrication techniques, performance characteristics, and applications of AM-based microwave components, providing insights into the advancements, and potential future directions of this innovative approach.

Disclosure statement

No potential conflict of interest was reported by the author(s).

Additional information

Notes on contributors

A. Taksala Devapriya

Taksala Devapriya Amalraj received a BE degree in electronics and communication engineering and an ME degree in communication systems from Anna University, Chennai, Tamil Nadu, India. She has more than 10 years of experience in teaching and her research interests include microwave antennae and frequency selective surfaces. Corresponding author. Email: [email protected]

S. Robinson

S Robinson received a BE degree in electronics and communication engineering from Bharathidasan University, Tamil Nadu, India and an ME degree in optical communication from Alagappa Chettiar College of Engineering and Technology, Karaikudi, Tamilnadu, India, in 2004 and 2008, respectively. He completed PG Dip. VLSI and MBA (Human resource management) in Annamalai University in 2009 and 2010, respectively. He completed his doctoral degree in the department of electronics engineering, School of Engineering and Technology, Pondicherry University, Puducherry in 2013. He is currently working as a professor and head of department of electronics and communication engineering, at Mount Zion College of Engineering and Technology, Pudukkottai, Tamil Nadu, India. He has published more than 100 papers in International Journals and also presented more than 100 papers at International and National Conferences in India and foreign countries. He published one book and four book chapters. He has given various invited talks, guest lectures, and keynote addresses in seminars, workshops, and conferences in India and Foreign countries. He is the reviewer of around 25 referred journals like IEEE, SPIE, Elsevier, Springer, and PIER Journals. He is a life member of ISTE, IETE, CSI, IE(I), and member of IEEE. He attended 50 workshops and organized 20 programmes. His current research interests are in the areas of optical communication, photonic crystals, photonicIntegrated circuits, optical devices, microwave communication, microwave devices, electromagnetic radiation, and optical networks.. Email: [email protected]

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