http://orcid.org/0000-0002-3008-2874
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ABSTRACT
The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.
Disclosure statement
No potential conflict of interest was reported by the authors.
Additional information
Funding
This work was supported by EU Eureka program COMPTIMS, EU Horizon 2020 program ‘Smartherm’, Swedish Foundation for Strategic Research (SSF) Frame Project ‘Carbon Based 3D High Speed GaN Electronics Systems’ with the contract no: (SE13-0061), Swedish National Science Foundation project with the contract No: E0559601, the Production Area of Advance program, Chalmers University of Technology, Sweden, the Natural Science Foundation of China (Contract Nos: 51272153 and 61574088) as well as by Shanghai Municipal Education Commission (Shanghai University High Education Peak Discipline Program).