An Overview of Three-Dimensional Fillers-Polymer Composites: Fabrications and Applications for Electronics and Energy Storage

Abstract

Three-dimensional (3D) fillers are a new hotspot in the development of polymer composites. The 3D microstructure is capable of effectively solving the agglomeration problem of low dimensional microstructure and forming 3D network in the polymer matrix at a very low percolation threshold. This could assist to transfer the charge carrier and heat as well as disperse the stress, further greatly improving the electrical conductivity, thermal conductivity, and mechanical properties of polymer composites. Starting from the different types of fillers, this review discusses the various methods including vapor deposition technology, template method, directional freezing method, and 3D printing technology for preparation of 3D carbon-based fillers, 3D inorganic fillers, and 3D organic-inorganic hybrid fillers in recent years, which will facilitate researchers to inspire the preparation of 3D fillers/polymer composites. Besides, this article also reviews the applications of 3D fillers/polymer composites in the fields of electronics and energy storage such as electromagnetic interference (EMI) shielding materials, thermally conductive materials, organic phase change materials, shape-memory materials, piezoresistive materials, and batteries as well as capacitors in detail. The relevant knowledge can boost researchers to fabricate the diverse 3D fillers/polymer composites and promote the development of related research on the 3D fillers/polymer composites.

Graphical Abstract

Keywords:

• 3D fillers
• polymer composites
• fabrication
• electronics
• energy storage

Author contribution

H. Gu designs this review and F. Yao performed the draft-writing. H. Gu is devoted to the writing-edit. All authors reviewed the manuscript.

Disclosure statement

No potential conflict of interest was reported by the author(s).

Data availability statement

All the data are available in the online version.

Correction Statement

This article has been corrected with minor changes. These changes do not impact the academic content of the article.

Additional information

Funding

The authors are grateful for the Fundamental Research Funds for the Central Universities. This work is supported by Shanghai Science and Technology Commission [19DZ2271500].