Assembly of N type Bi₂(Te, Se)₃ thermoelectric modules by low temperature bonding

Abstract

Solid liquid interdiffusion technique is employed to attach N type Bi₂(Te_0·92Se_0·08)₃ thermoelectric material to alumina substrate. The surface finishes of the bonding surfaces for Bi₂(Te_0·92Se_0·08)₃ and alumina are Ni and Ag respectively. The bonding layer is pure Sn. The growth kinetic of intermetallic compounds and their microstructure evolution during aging at 200°C was established. The success of this bonding technique provides a cost effective way to assemble thermoelectric modules at a low temperature for higher temperature applications.

Keywords:

• Thermoelectric
• Intermetallic compounds
• Thermal stability
• Solder

This work is financially supported by National Science Council of Taiwan through grant NSC101-2221-E-002-162-MY3, National Taiwan University through Grant 10R80920-04, and Industrial Technology Research Institute of Electronics and Optoelectronics Research Laboratories.