54
Views
1
CrossRef citations to date
0
Altmetric
Research Papers

Composition and residual stress analysis of Ti-Si/(Ti-Si)xN film on Mg–Al alloy substrate prepared by magnetron sputtering

, &
Pages S5-1268-S5-1271 | Received 20 Oct 2014, Accepted 18 Dec 2014, Published online: 30 May 2015
 

Abstract

Chemical composition, residual stress and crystalline phase of Ti-Si/(Ti-Si)xN films were investigated with X-ray fluorescence and X-ray diffraction, respectively. The results reveal that the TiN phase has a preferential orientation along the crystalline plane (111). The residual stress in films is tensile stress, and the minimum stress reaches about 103 MPa under the deposition parameters of negative bias being 80 V and Ar/N2 flux ratio being 11/4. The element content decreases sharply with the negative bias greater than 80 V and Ar/N2flux ratio greater than 11/4. The composition and residual stress in the film can be controlled effectively by reasonably selecting fabrication parameters.

Log in via your institution

Log in to Taylor & Francis Online

PDF download + Online access

  • 48 hours access to article PDF & online version
  • Article PDF can be downloaded
  • Article PDF can be printed
USD 61.00 Add to cart

Issue Purchase

  • 30 days online access to complete issue
  • Article PDFs can be downloaded
  • Article PDFs can be printed
USD 286.00 Add to cart

* Local tax will be added as applicable

Related Research

People also read lists articles that other readers of this article have read.

Recommended articles lists articles that we recommend and is powered by our AI driven recommendation engine.

Cited by lists all citing articles based on Crossref citations.
Articles with the Crossref icon will open in a new tab.