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Welding International Volume 10, 1996 - Issue 9

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Effects of bonding conditions and surface state on bondability: Study of Cu wire stitch bonding (1st Report)

K Fujimoto Osaka University,

S Nakata Osaka University,

T Manabe Osaka University, ; Iwatani Sangyo KK,

A Fujii Sumitomo Denki Kogyo KK,

Pages 705-710 | Published online: 09 Dec 2009

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https://doi.org/10.1080/09507119609549074

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