A new material platform of Si photonics for implementing architecture of dense wavelength division multiplexing on Si bulk wafer

Ziyi ZhangDepartment of Materials Engineering, University of Tokyo, Bunkyo, Japan

Motoki YakoDepartment of Materials Engineering, University of Tokyo, Bunkyo, Japan

Kan JuDepartment of Materials Engineering, University of Tokyo, Bunkyo, Japan

Naoyuki KawaiDepartment of Materials Engineering, University of Tokyo, Bunkyo, Japan

Papichaya ChaisakulDepartment of Materials Engineering, University of Tokyo, Bunkyo, Japan

Tai TsuchizawaNanophotonics Center and NTT Device Technology Laboratories, Nippon Telegraph and Telephone Corporation, Atsugi, Japan

Makoto HikitaNTT-Advanced Technology, Mitaka, Japan

Koji YamadaNanophotonics Center and NTT Device Technology Laboratories, Nippon Telegraph and Telephone Corporation, Atsugi, Japan

Yasuhiko IshikawaDepartment of Materials Engineering, University of Tokyo, Bunkyo, Japan

Kazumi WadaDepartment of Materials Engineering, University of Tokyo, Bunkyo, Japan;Massachusetts Institute of Technology, Cambridge, MA, USACorrespondence[email protected]

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A new material platform of Si photonics for implementing architecture of dense wavelength division multiplexing on Si bulk wafer

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A new material platform of Si photonics for implementing architecture of dense wavelength division multiplexing on Si bulk wafer

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