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Research Article
The effects of pressure, temperature, and depth/diameter ratio on the microvia filling performance of Ag-coated Cu micro-nanoparticles for advanced electronic packaging
Guannan Yanga State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, Guangdong, China;b Jihua Laboratory, Foshan, Guangdong, ChinaCorrespondence[email protected]
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Shaogen Luoa State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, Guangdong, ChinaView further author information
, Bo Luoa State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, Guangdong, ChinaView further author information
, Yan Zuoa State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, Guangdong, ChinaView further author information
, Shiwo Tac State Key Laboratory of Advanced Materials and Electronic Components, Fenghua Advanced Technology Co. Ltd, Zhaoqing, Guangdong, ChinaView further author information
, Tingyu Lind Guangdong Fozhixin Microelectronics Technology Research Co. Ltd, Foshan, Guangdong, ChinaView further author information
, Zhaohui Zhaoe Beijing Compo Advanced Technology Co. Ltd, Beijing, ChinaView further author information
, Yu Zhanga State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, Guangdong, China;b Jihua Laboratory, Foshan, Guangdong, ChinaView further author information
& Chengqiang Cuia State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, Guangdong, China;b Jihua Laboratory, Foshan, Guangdong, ChinaCorrespondence[email protected]
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Pages 543-560
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Received 07 May 2022, Accepted 24 Jul 2022, Published online: 02 Aug 2022
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