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Corrosion Engineering, Science and Technology

The International Journal of Corrosion Processes and Corrosion Control

Volume 48, 2013 - Issue 6: Corrosion reliability of electronic devices

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Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

V. VerdingovasMaterials and Surface Engineering Department of Mechanical Engineering, Technical University of Denmark, DK-2800 Kgs. Lyngby, DenmarkCorrespondence[email protected]

M. S. JellesenMaterials and Surface Engineering Department of Mechanical Engineering, Technical University of Denmark, DK-2800 Kgs. Lyngby, Denmark

R. AmbatMaterials and Surface Engineering Department of Mechanical Engineering, Technical University of Denmark, DK-2800 Kgs. Lyngby, Denmark

Pages 426-435 | Received 02 Oct 2012, Accepted 18 Jan 2013, Published online: 18 Nov 2013

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https://doi.org/10.1179/1743278213Y.0000000078

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