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Materials Science and Technology Volume 23, 2007 - Issue 1
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Articles

Effect of Ti on TLP bonding of SiCp/2618Al composites using interlayers of mixed Al–Ag–Cu system powders

J. H. Huang
,
Y. Wan
,
H. T. Zhao
,
D. H. Cheng
&
H. Zhang
Pages 87-91 | Published online: 19 Jul 2013

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