REFERENCES
- BSS 3888, Copper clad synthetic resin bonded laminated sheet.
- BSS 4025, The general requirements and methods of test for printed circuits.
- G P O Spec M 467, Printed wiring phenolic resin bonded boards for telecommunications equipment.
- M. Clarke and J. M. Leeds, Trans IMF 1965, 43, 50–62.
- K. G. Ashurst and R. W. Neale, Trans I M F 1967, 45, 75–82.
- H. V. Noonan, Plating. Apr 1966—461-470.
- W. N. Green, Plating 1961 48.1095.
- F. J. Conrad and B. T. Kenner, Plating, June 1966.
- D E F 5028, Printed wiring boards having plated through holes and plated up wiring.
- D E F 1053, Standard methods of testing paint, varnish, lacquer and related products.
- S. A. Dinuzzo and R. H. Ganger, Reliability of plated through holes in Multilayer Boards, Hazeltine Corp, New York.
- Inst Printed Circuits IPC-ML-9.50/ January 1966, Performance specification for multilayer printed circuit boards.