REFERENCES
- C. Rosenstein, Metal Finishing, 88, (1990) 17.
- Thomas M. Tam, J. Electrochem. Soc., 133, (1986) 1792.
- D. Radovic, Plating and Surface Finishing, 76, (1989) 52.
- P. A. Kohl, J. Electrochem. Soc., 129, (1982) 1196.
- C. H. Chandler, U.S. Patent 1,373,488 (1921).
- J. W. Andrews, U.S. Patent 2,633,450 (1953).
- F. L. Clifton, U.S. Patent 2,489,523 (1949).
- J. R. Stack, U.S. Patent 2,313,371 (1943).
- R. Narayan and G. Devraj, Surface Tech., 18, (1983) 77.
- W. A. Proell, Ind. Eng. Chem., 40, (1948) 1129.
- L. Deresh, Metal Finishing, 88, (1990) 23.
- T. Cheng and H. Y. Cheh, Abstracts, Vol. 83–2, Washington, D.C, Oct. 9–14,1983.
- P. A. Kohl, Plating and Surface Finishing, 68, (1981) 45.
- W. J. Ward, AIChE. J., 16, (1970) 405.
- W. L. Hsueh and C. C. Wan, J. of The Chin.I.Ch.E., 20, (1989) 43.
- W. L. Hsueh and C. C. Wan, Bulletin of Electrochem., 6, (1990) 790.
- M. I. Smirnov and K. M. Tyutina and A. N. Popov, Russ. J. of Electrochemistry, 31, (1995) 498.
- Y. N. Sadana and Z. H. Zhang, Surface and Coatings Tech., 34, (1988) 109.
- Y. N. Sadana and Z. H. Zhang, Surface and Coatings Tech., 38, (1989) 299.
- C. J. Chen and C. C. Wan, Proc. Natl. Sci. Counc. ROC (A), 12, (1988) 191.
- J. S. Newman, “Electrochemical Systems”, Prentice-Hall, Canada (1973).
- R. B. Bard, W. E. Stewart, and E. N. Lightfoot, “Transport Phenomena”, John Wiley & Sons, Singapore, (1971), p. 85.
- A. J. Bard and L. R. Faulkner, “Electrochemical Methods”, John Wiley & Sons, Singapore, (1980), p.284.
- Ramona Y. Ying, J. Electrochem. Soc., 135, (1988) 295.