290
Views
9
CrossRef citations to date
0
Altmetric
Articles

Intelligent sampling decision scheme based on the AVM system

, , , &
Pages 2073-2088 | Received 15 Apr 2014, Accepted 11 Aug 2014, Published online: 10 Sep 2014

References

  • Bousetta, A., and A. J. Cross. 2005. Adaptive Sampling Methodology for Inline Defect Inspection. In Proceedings of IEEE, SEMI Advanced Semiconductor Manufacturing Conference, 25–31. Munich: IEEE, April 11–12.
  • Carpenter, G. A., and S. Grossberg. 1987. “ART 2: Self-organization of Stable Category Recognition Codes for Analog Input Patterns.” Applied Optics 26 (23): 4919–4930.10.1364/AO.26.004919
  • Chen, C.-F., F.-T. Cheng, C.-C. Wu, and H.-H. Huang. 2014. Preliminary Study of an Intelligent Sampling Decision Scheme for the AVM System. In IEEE International Conference on Robotics and Automation, 3496–3501. Hong Kong: IEEE, May 31–June 7.
  • Cheng, F.-T., Y.-T. Chen, Y.-C. Su, and D.-L. Zeng. 2008. “Evaluating Reliance Level of a Virtual Metrology System.” IEEE Transactions on Semiconductor Manufacturing 21 (1): 92–103.10.1109/TSM.2007.914373
  • Cheng, F.-T., and Y.-C. Chiu. 2013. “Applying the Automatic Virtual Metrology System to Obtain Tube-to-tube Control in a PECVD Tool.” IIE Transactions 45 (6): 670–681.10.1080/0740817X.2012.725507
  • Cheng, F.-T., H.-C. Huang, and C.-A. Kao. 2007. “Dual-phase Virtual Metrology Scheme.” IEEE Transactions on Semiconductor Manufacturing 20 (4): 566–571.10.1109/TSM.2007.907633
  • Cheng, F.-T., H.-C. Huang, and C.-A. Kao. 2012. “Developing an Automatic Virtual Metrology System.” IEEE Transactions on Automation Science and Engineering 9 (1): 181–188.10.1109/TASE.2011.2169405
  • Cheng, F.-T., C.-F. Chen, and W.-H. Tsai. Submitted for publication. “Applying the AVM System for TFT-LCD Manufacturing.” IEEE Transactions on Semiconductor Manufacturing.
  • Chien, C.-F., K.-H. Chang, and C.-P. Chen. 2003. “Design of a Sampling Strategy for Measuring and Compensating for Overlay Errors in Semiconductor Manufacturing.” International Journal of Production Research 41 (11): 2547–2561.10.1080/0020754031000087256
  • Holfeld, A., R. Barlović, and R. P. Good. 2007. “A Fab-wide APC Sampling Application.” IEEE Transactions on Semiconductor Manufacturing 20 (4): 393–399.10.1109/TSM.2007.907613
  • Huang, Y.-T., and F.-T. Cheng. 2011. “Automatic Data Quality Evaluation for the AVM System.” IEEE Transactions on Semiconductor Manufacturing 24 (3): 445–454.10.1109/TSM.2011.2154910
  • Kao, C.-A., F.-T. Cheng, W.-M. Wu, F.-W. Kong, and H.-H. Huang. 2013. “Run-to-run Control Utilizing Virtual Metrology with Reliance Index.” IEEE Transactions on Semiconductor Manufacturing 26 (1): 69–81.10.1109/TSM.2012.2228243
  • Kurz, D., C. De Luca, and J. Pilz. 2012. Sampling Decision System in Semiconductor Manufacturing Using Virtual Metrology. In Proceedings of 2012 IEEE International Conference on Automation Science and Engineering (CASE 2012), 74–79. Seoul: IEEE, 20–24 August.
  • Kurz, D., C. De Luca, and J. Pilz. 2013. Monitoring Virtual Metrology Reliability in a Sampling Decision System. In Proceedings of 2013 IEEE International Conference on Automation Science and Engineering (CASE 2013), 20–25. Madison, WI: IEEE, 17–21 August 2013.
  • Lee, J. H. 2002. “Artificial Intelligence-based Sampling Planning System for Dynamic Manufacturing Process.” Expert Systems with Applications 22: 117–133.10.1016/S0957-4174(01)00049-5
  • Nduhura-Munga, J., S. Dauzère-Pérès, P. Vialletelle, and C. Yugma. 2011. Dynamic Management of Controls in Semiconductor Manufacturing. In: Proceedings of IEEE/SEMI Advanced Semiconductor Manufacturing Conference, 1–6. Saratoga Springs, NY: IEEE/SEMI, 16–18 May 2011.
  • Nduhura-Munga, J., G. Rodriguez-Verjan, S. Dauzère-Pérès, C. Yugma, P. Vialletelle, and J. Pinaton. 2013. “A Literature Review on Sampling Techniques in Semiconductor Manufacturing.” IEEE Transactions on Semiconductor Manufacturing 26 (2): 188–195.10.1109/TSM.2013.2256943
  • Weber. 2007. “Virtual Metrology and Your Technology Watch List: Ten Things You Should Know about This Emerging Technology.” Future Fab International 22 (4): 52–54.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.