1,971
Views
65
CrossRef citations to date
0
Altmetric
Using Big Data to Make Better Decisions in the Digital Economy

Analysing semiconductor manufacturing big data for root cause detection of excursion for yield enhancement

ORCID Icon, &
Pages 5095-5107 | Received 08 Dec 2014, Accepted 09 Oct 2015, Published online: 17 Nov 2015

References

  • Barnett, V., and T. Lewis. 1994. Outliers in Statistical Data. 3rd ed., New York, NY: Wiley.
  • Breiman, L. 2001. “Random Forest.” Machine Learning 45: 5–32.10.1023/A:1010933404324
  • Chen, Y., and D. Liginlal. 2008. “A Maximum Entropy Approach to Feature Selection in Knowledge-based Authentication.” Decision Support Systems 46 (1): 388–398.10.1016/j.dss.2008.07.008
  • Chen, A., J. Blue, T.-C. Chou, and T.-K. Yang. 2009. “Recipe-independent Indicator for Tool Health Diagnosis and Predictive Maintenance.” IEEE Transactions on Semiconductor Manufacturing 22 (4): 522–535.10.1109/TSM.2009.2028215
  • Chien, C.-F., and S. Chuang. 2014. “A Framework for Root Cause Detection of Sub-batch Processing System for Semiconductor Manufacturing Big Data Analytics.” IEEE Transactions on Semiconductor Manufacturing 27 (4): 475–488.10.1109/TSM.2014.2356555
  • Chien, C.-F., and C.-Y. Hsu. 2006. “A Novel Method for Determining Machine Subgroups and Backups with an Empirical Study for Semiconductor Manufacturing.” Journal of Intelligent Manufacturing 17 (4): 429–439.10.1007/s10845-005-0016-7
  • Chien, C.-F., and C.-Y. Hsu. 2011. “UNISON Analysis to Model and Reduce Step-and-scan Overlay Errors for Semiconductor Manufacturing.” Journal of Intelligent Manufacturing 22 (3): 399–412.10.1007/s10845-009-0298-2
  • Chien, C.-F., T. Lin, Q.-W. Liu, C. Peng, S. C. Hsu, and C. Huang. 2002. “Developing a Data Mining Method for Wafer Binmap Clustering and an Empirical Study in a Semiconductor Manufacturing Fab.” Journal of the Chinese Institute of Industrial Engineers 19 (2): 23–38.10.1080/10170660209509189
  • Chien, C.-F., K. Chang, and C. Chen. 2003. “Design of a Sampling Strategy for Measuring and Compensating for Overlay Errors in Semiconductor Manufacturing.” International Journal of Production Research 41 (11): 2547–2561.10.1080/0020754031000087256
  • Chien, C.-F., W. Wang, and J. Cheng. 2007. “Data Mining for Yield Enhancement in Semiconductor Manufacturing and an Empirical Study.” Expert Systems with Applications 33 (1): 192–198.10.1016/j.eswa.2006.04.014
  • Chien, C.-F., S. Dauzere-Peres, H. Ehm, J. W. Fowler, Z. Jiang, S. Krishnaswamy, T. Lee, L. Monch, and R. Uzsoy. 2011. “Modelling and Analysis of Semiconductor Manufacturing in a Shrinking World: Challenges and Successes.” European Journal of Industrial Engineering 5 (3): 254–271.10.1504/EJIE.2011.041616
  • Chien, C.-F., S. C. Hsu, and Y. J. Chen. 2013. “A System for Online Detection and Classification of Wafer Bin Map Defect Patterns for Manufacturing Intelligence.” International Journal of Production Research 51 (8): 2324–2338.10.1080/00207543.2012.737943
  • Chien, C.-F., Y.-J. Chen, and C.-Y. Hsu. 2015. “A Novel Approach to Hedge and Compensate the Critical Dimension Variation of the Developed-and-etched Circuit Patterns for Yield Enhancement in Semiconductor Manufacturing.” Computers & Operations Research 53: 309–318.
  • Devijver, P. A., and J. Kittler. 1982. Pattern Recognition: A Statistical Approach. Englewood Cliffs, NJ: Prentice Hall.
  • Fung, G., and J. Stoeckel. 2007. “SVM Feature Selection for Classification of SPECT Images of Alzheimer’s Disease using Spatial Information.” Knowledge and Information Systems 11 (2): 243–258.10.1007/s10115-006-0043-5
  • Guyon, I., and A. Elisseeff. 2003. “An Introduction to Variable and Feature Selection.” Journal of Machine Learning Research 3: 1157–1182.
  • Hawkins, D. M. 1980. Identification of Outliers. London: Chapman and Hall.10.1007/978-94-015-3994-4
  • Hodge, V. J., and J. Austin. 2004. “A Survey of Outlier Detection Methodologies.” Artificial Intelligence Review 22: 85–126.10.1023/B:AIRE.0000045502.10941.a9
  • Hsu, S.-C., and C.-F. Chien. 2007. “Hybrid Data Mining Approach for Pattern Extraction from Wafer Bin Map to Improve Yield in Semiconductor Manufacturing.” International Journal of Production Economics 107: 88–103.10.1016/j.ijpe.2006.05.015
  • Hu, T., and S. Y. Sung. 2004. “A Trimmed Mean Approach to Finding Spatial Outliers.” Intelligent Data Analysis 8 (1): 79–95.
  • Knorr, E. M., R. T. Ng, and V. Tucakov. 2000. “Distance-based Outliers: Algorithms and Applications.” The VLDB Journal the International Journal on Very Large Data Bases 8: 237–253.10.1007/s007780050006
  • Kudo, M., and J. Sklansky. 2000. “Comparison of Algorithms that Select Features for Pattern Classifiers.” Pattern Recognition 33: 25–41.10.1016/S0031-3203(99)00041-2
  • Kumar, N., K. Kennedy, K. Gildersleeve, R. Abelson, C. M. Mastrangelo, and D. C. Montgomery. 2006. “A Review of Yield Modelling Techniques for Semiconductor Manufacturing.” International Journal of Production Research 44 (23): 5019–5036.10.1080/00207540600596874
  • Leachman, R. C., and D. A. Hodges. 1996. “Benchmarking Semiconductor Manufacturing.” IEEE Transactions on Semiconductor Manufacturing 9 (2): 158–169.10.1109/66.492810
  • Leachman, R. C., S. Ding, and C.-F. Chien. 2007. “Economic Efficiency Analysis of Wafer Fabrication.” IEEE Transactions on Automation Science and Engineering 4 (4): 501–512.10.1109/TASE.2007.906142
  • Lin, S.-W., S.-C. Chen, W.-J. Wu, and C.-H. Chen. 2009. “Parameter Determination and Feature Selection for Back-propagation Network by Particle Swarm Optimization.” Knowledge and Information Systems 21 (2): 249–266.10.1007/s10115-009-0242-y
  • Liu, C.-W., and C.-F. Chien. 2013. “An Intelligent System for Wafer Bin Map Defect Diagnosis: An Empirical Study for Semiconductor Manufacturing.” Engineering Applications of Artificial Intelligence 26 (5–6): 1479–1486.10.1016/j.engappai.2012.11.009
  • Mitra, P. 2002. “Unsupervised Feature Selection using Feature Similarity.” IEEE Transactions on Pattern Analysis and Machine Intelligence 24 (3): 301–312.10.1109/34.990133
  • Moore, G. E. 1965. “Cramming more Components onto Integrated Circuits.” Electronics Magazine 38 (8): 114–117.
  • Nelder, J. A., and R. W. M. Wedderburn. 1972. “Generalized Linear Models.” Journal of the Royal Statistical Society. Series A (General) 135 (3): 370–384.10.2307/2344614
  • Piramuthu, S. 1996. “Feed-forward Neural Networks and Feature Construction with Correlation Information: An Integrated Framework.” European Journal of Operational Research 93: 418–427.10.1016/0377-2217(96)83599-5
  • Rousseeuw, P., and A. Leroy. 1996. Robust Regression and Outlier Detection. 3rd ed.  New York, NY: Wiley.
  • Saha, S. K., S. Sarkar, and P. Mitra. 2009. “Feature Selection Techniques for Maximum Entropy Based Biomedical Named Entity Recognition.” Journal of Biomedical Informatics 42 (5): 905–911.10.1016/j.jbi.2008.12.012
  • Shi, J., and S. Zhou. 2009. “Quality Control and Improvement for Multistage Systems: A Survey.” IIE Transactions 41: 744–753.10.1080/07408170902966344
  • Shindo, W., R. K. Nurani, and A. J. Strojwas. 1998. “Effects of Defect Propagation/Growth on In-line Defect-based Yield Prediction.” IEEE Transactions on Semiconductor Manufacturing 11 (4): 546–551.10.1109/66.728550
  • Skinner, K. R., D. C. Montgomery, G. C. Runger, J. W. Fowler, D. R. McCarville, T. R. Rhoads, and J. D. Stanley. 2002. “Multivariate Statistical Methods for Modeling and Analysis of Wafer Probe Test Data.” IEEE Transactions on Semiconductor Manufacturing 15 (4): 523–530.10.1109/TSM.2002.804901
  • Terwiesch, C., and R. E. Bohn. 2001. “Learning and Process Improvement during Production Ramp-up.” International Journal of Production Economics 70 (1): 1–19.10.1016/S0925-5273(00)00045-1
  • Turkey, J. W. 1977. Exploratory Data Analysis. Menlo Park, CA: Addison-Wesley.
  • Verikas, A., A. Gelzinis, and M. Bacauskiene. 2011. “Mining Data with Random Forests: A Survey and Results of New Tests.” Pattern Recognition 44: 330–349.10.1016/j.patcog.2010.08.011
  • Wang, C. H., W. Kuo, and H. Bensmail. 2006a. “Detection and Classification of Defect Patterns on Semiconductor Wafers.” IIE Transactions 38: 1059–1068.10.1080/07408170600733236
  • Wang, C. H., S. J. Wang, and W. D. Lee. 2006b. “Automatic Identification of Spatial Defect Patterns for Semiconductor Manufacturing.” International Journal of Production Research 44 (23): 5169–5185.10.1080/02772240600610822
  • Woodall, W. H., and D. C. Montgomery. 1993. “Research Issues and Ideas in Statistical Process Control.” Journal of Quality Technology 31 (4): 376–386.
  • Zhang, Z., and N. Ye. 2011. “Locality Preserving Multimodal Discriminative Learning for Supervised Feature Selection.” Knowledge and Information Systems 27 (3): 473–490.10.1007/s10115-010-0306-z

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.