References
- Herzog D, Seyda V, Wycisc E, et al. Additive manufacturing of metals. Acta Mater. 02016;117:371–392.
- Sames WJ, List FA, Pannala S, et al. The metallurgy and processing science of metal additive manufacturing. Int Mater Rev. 2016;61(5):315–360.
- Liu R R, Wang Z, Liou F, et al. Aerospace applications of laser additive manufacturing. In: Brandt M, editor. Laser Additive Manufacturing, Elsevier; 2017 p. 351–371.
- Leal R, Barreiros FM, Alves L, et al. Additive manufacturing tooling for the automotive industry. Int JAdv Manuf Technol. 2017;92(5–8):1671–1676.
- Harrysson OL, Marcellin-Little DJ, Horn TJ. Applications of metal additive manufacturing in veterinary orthopedic surgery. Miner Met Mater Soc. 2015;67(3):646–654.
- Neugebauer R, Müller B, Töppel T. Additive manufacturing boosts efficiency of heat transfer components. Assem Autom. 2011;31(4):344–347.
- Joseph G, Kundig K. Copper – its trade, manufacture, use, and environmental status. Ohio: Materials Park; 1999.
- Lykov PA, Safonov EV, Akhmedianov AM. Selective laser melting of copper. Mater Sci Forum. 2016;843:284–288.
- Jadhav SD, Dadbakhsh S, Goossens L, et al. Influence of selective laser melting process parameters on texture evolution in pure copper. J Mater Process Technol. 2019;270:47–58.
- Kaden L, Seyfarth B, Ullsperger T, et al. Selective laser melting of copper using ultrashort laser pulses at different wavelengths. Proceedings of SPIE Conference; 2018 Jan 29; San Francisco, p. 6.
- Gu DD, Shen YF. Development and characterisation of direct laser sintering multicomponent Cu based metal powder. Powder Metall. 2006;49(3):258–264.
- Zhang S, Zhu H, Hu Z, et al. Selective laser melting of Cu 10Zn alloy powder using high laser power. Powder Technol. 2019;342:613–620.
- Bai Y. An exploration of binder jetting of copper. Rapid Prototyp J. 2015;21:177–185.
- Ott J, Burghardt A, Britz D, et al. Free-sintering study of pressure-less manufactured green bodies made of fine Cu powder for electronic applications. Proceedings of Euro PM2020 Conference; 2019 Oct 14–16; Maastricht.
- Aivazov MI, Domashnev IA. Influence of porosity on the conductivity of hot-pressed titanium-nitride specimens. Sov Powder Metall Met Ceram. 1968;7(9):708–710.
- Mayr G, Hendorfer G, Gruber J, et al. Quantitative betsimmung von porositäten in kohlefaserverstärkten kunststoffen mittels pulsthermographie. Proceeding of Thermographie-Kolloquium Conference; 2011 Sep 29–30; Stuttgart.
- Maxwell JC. A treatise on electricity and magnetism. Oxford: The Clarendon Press, 1873. p. 360
- Wiegemann A, Zemitis A. A fast explicit jump harmonic averaging solver for the effective heat conductivity of composite materials. Proceeding of Fraunhofer ITWM; 2006; Kaiserslautern.
- Kuczinsky GC, Sargent GA, Kolar D, et al. Interaction of pores with grain boundaries. J Mater Sci Lett. 1985;4(8):933–935.
- Ichnose H, Kuczynski GC. Role of grain boundaries in sintering. Acta Metall. 1962;10(3):209–213.
- Sun J. A model for shrinkage of a spherical void in the center of a grain: influence of lattice diffusion. J Mater Eng Perform. 2002;11(3):322–331.
- Kang S. Sintering: densification, grain growth and microstructure. Oxford: Elsevier Ltd; 2005.
- Moore JP, McElroy DL, Graves RS. Thermal conductivity and electrical resistivity of high-purity copper from 78 to 400 °K. Can J Phys. 1967;45(12):3849–3865.
- Ye XB, He ZH, Pan BC. The thermal conductivity of defected copper at finite temperatures. J Mater Sci. 2020;55(10):4453–4463.
- ‘copperalliance.org.uk,’ Copper Development Association, [Online]. Available: https://copperalliance.org.uk/uploads/2018/06/element-conductivity.png. [Accessed 2020 Apr 28].
- Brett J, Seigle L. Shrinkage of voids in copper. Acta Metall. 1963;11(5):467–474.