851
Views
37
CrossRef citations to date
0
Altmetric
Heat in History

Brief Historical Perspective in Thermal Management and the Shift Toward Management at the Nanoscale

&

References

  • G. Chen, Nanoscale Energy Transport and Conversion: A Parallel Treatment of Electrons, Molecules, Phonons, and Photons, New York: Oxford University Press, 2005.
  • D. R. Hartree, “The ENIAC, an electronic computing machine,” Nature, vol. 158, no. 4015, pp. 500–506, 1946.
  • A. Bergles, “Evolution of cooling technology for electrical, electronic, and microelectronic equipment,” IEEE Trans. Compon. Packag. Technol., vol. 26, no. 1, pp. 6–15, 2003.
  • R. Chu, R. Simons, M. Ellsworth, R. Schmidt, and V. Cozzolino, “Review of cooling technologies for computer products,” IEEE Trans. Device Mater. Reliab., vol. 4, no. 4, pp. 568–585, 2004.
  • “ENIAC: Celebrating Penn engineering history,” Available: http://www.seas.upenn.edu/about-seas/eniac/operation.php, (Accessed April 9, 2014).
  • K. Kempf, “Electronic computers within the ordnance corps.” Available: http://ftp.arl.mil/mike/comphist/61ordnance, (Accessed May 9, 2014).
  • R. R. Schmidt and B. D. Notohardjono, “High-end server low-temperature cooling,” IBM J. Res. Devlop., vol. 46, no. 6, p. 739, 2002.
  • R. Chu, R. Simons, and G. Chrysler, “Experimental investigation of an enhanced thermosyphon heat loop for cooling of a high performance electronics module,” in Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE, San Diego, CA, USA, March 9–11, 1999, pp. 1–9.
  • G. Moore, “Cramming more components onto integrated circuits,” Electronics, vol. 38, no. 8, pp. 114–117, 1965.
  • G. Moore, “Progress in digital integrated electronics,” in 1975 International Electron Devices Meeting, Washington, DC, Dec 1–3, vol. 21, 1975, pp. 11–13.
  • C. Isci, “Workload adaptive power management with live phase monitoring and prediction,” Ph.D. dissertation, Princeton University, Princeton, 2007.
  • M. Roser, “Technological progress,” Available: https://ourworldindata.org/technological-progress/, 2016.
  • K. Rupp, “40 sources of microprocessor trend data,” Available: https://www.karlrupp.net/2015/06/40-sources-of-microprocessor-trend-data/, 2015.
  • R. Leadbetter, “Inside the next Xbox: Project Scorpio Tech Revealed,” Available: http://www.eurogamer.net/articles/digitalfoundry-2017-project-scorpio-tech-revealed, 2017.
  • I. Cutress, “AMD launches Ryzen: 52% more IPC, eight cores for under $330, pre-order today, on sale March 2nd,” Available: http://www.anandtech.com/show/11143/amd-launch-ryzen-52-more-ipc-eight-cores-for-under-330-preorder-today-on-sale-march-2nd, 2017.
  • A. Vassighi and M. Sachdev, Thermal and Power Management of Integrated Circuits, USA: Springer, 2006.
  • E. Pop, S. Sinha, and K. E. Goodson, “Heat generation and transport in nanometer-scale transistors,” Proc. IEEE, vol. 94, no. 8, pp. 1587–1601, 2006.
  • E. Pop, “Energy dissipation and transport in nanoscale devices,” Nano Res., vol. 3, no. 3, pp. 147–169, 2010.
  • M. B. Giles, and I. Reguly, “Trends in high-performance computing for engineering calculations,” Philos. Trans. R. Soc. Lond. A Math. Phys. Eng. Sci., vol. 372, no. 2022, pp. 1–14, 2014.
  • B.-G. Nam, “Digital architectures & systems (DAS) 2017 trends,” in ISSCC 2017 Trends, San Francisco, California, 2017.
  • M. Pedram and S. Nazarian, “Thermal modeling, analysis, and management in vlsi circuits: principles and methods,” Proc. IEEE, vol. 94, no. 8, pp. 1487–1501, 2006.
  • R. Mahajan, R. Nair, V. Wakharkar, J. Swan, J. Tang, and G. Vandentop, “Emerging directions for packaging technologies,” Intel Technol. J., vol. 6, no. 2, pp. 62–75, 2002.
  • R. Mahajan, C. Pin Chiu, and G. Chrysler, “Cooling a microprocessor chip,” Proc. IEEE, vol. 94, no. 8, pp. 1476–1486, 2006.
  • V. P. Atluri, R. V. Mahajan, P. R. Patel, D. Mallik, J. Tang, V. S. Wakharkar, G. M. Chrysler, C.-P. Chiu, G. N. Choksi, and R. S. Viswanath, “Critical aspects of high-performance microprocessor packaging,” MRS Bull., vol. 28, no. 1, pp. 21–34, 2003.
  • E. Pop, C. On Chui, R. Dutton, S. Sinha, and K. Goodson, “Electro-thermal comparison and performance optimization of thin-body SOI and GOI MOSFETs,” in IEEE International Electron Devices Meeting, San Francisco, CA, USA, Dec 13–15, 2004, pp. 411–414.
  • C. Fiegna, Y. Yang, E. Sangiorgi, and A. G. O’Neill, “Analysis of self-heating effects in ultrathin-body SOI MOSFETs by device simulation,” IEEE Trans. Electron Devices, vol. 55, no. 1, pp. 233–244, 2008.
  • S. Reda, R. J. Cochran, and A. N. Nowroz, “Improved thermal tracking for processors using hard and soft sensor allocation techniques,” IEEE Trans. Comput., vol. 60, no. 6, pp. 841–851, 2011.
  • A. Bar-Cohen and P. Wang, “Thermal management of on-chip hot spot,” J. Heat Transf., vol. 134, no. 5, pp. 051017 (1–11), 2012.
  • A. Shakouri and Y. Zhang, “On-chip solid-state cooling for integrated circuits using thin-film microrefrigerators,” IEEE Trans. Compon. Packag. Technol., vol. 28, no. 1, pp. 65–69, 2005.
  • D. Brooks, R. Dick, R. Joseph, and L. Shang, “Power, thermal, and reliability modeling in nanometer-scale microprocessors,” IEEE Micro, vol. 27, no. 3, pp. 49–62, 2007.
  • M. Patterson, “The effect of data center temperature on energy efficiency,” in 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, USA, May 28–31, 2008, pp. 1167–1174.
  • J. R. Black, “Electromigration - a brief survey and some recent results,” IEEE Trans. Electron Devices, vol. 16, no. 4, pp. 338–347, 1969.
  • K. Banerjee, M. Pedram, and A. H. Ajami, “Analysis and optimization of thermal issues in high-performance VLSI,” in Proceedings of the 2001 International Symposium on Physical Design, ISPD ’01, ACM, New York, NY, USA, 2001, pp. 230–237.
  • R. Singh, D. Sahu, N. K. Shukla, P. Bhatnagar, Geetanjali, and A. Goel, “Analysis of the effect of temperature variations on sub-threshold leakage current in P3 and P4 SRAM cells at deep sub-micron CMOS technology,” Int. J. Comput. Appl., vol. 35, no. 5, pp. 8–13, 2011.
  • B. Urban, V. Shmakova, B. Lim, and K. Roth, “Energy consumption of consumer electronics in U.S. homes 2013”, Boston, Massachusetts: Fraunhofer USA Center for Sustainable Energy Systems, 2014.
  • S. Brain, “YouTube company statistics,” Available: http://www.statisticbrain.com/youtube-statistics/, 2016.
  • S. Arman, S. Smith, D. A. Sartor, R. E. Brown, M. Herrlin, J. G. Koomey, E. R. Masanet, N. Horner, I. Azevedo, and W. Lintner, “United States Data Center Energy Usage Report” Lawrence Berkeley National Laboratory, Berkeley, California, Report no. BNL-1005775, 2016.
  • I. L. Stats, “Internet users,” Available: http://www.internetlivestats.com/internet-users/#definitions, 2016.
  • S. V. Garimella, L.-T. Yeh, and T. Persoons, “Thermal management challenges in telecommunication systems and data centers,” IEEE Trans. Compon. Packag. Manufa. Technol., vol. 2, no. 8, pp. 1307–1316, 2012.
  • Z. Li, and S. G. Kandlikar, “Current status and future trends in data-center cooling technologies,” Heat Transf. Eng., vol. 36, no. 6, pp. 523–538, 2015.
  • S. Yeo, M. M. Hossain, J.-C. Huang, and H.-H. S. Lee, “Atac: Ambient temperature-aware capping for power efficient datacenters,” in Proceedings of the ACM Symposium on Cloud Computing, SOCC ’14, ACM, New York, NY, USA, 2014, pp. 17:1–17:14.
  • X. Tong, “Thermal management fundamentals and design guides in electronic packaging,” in Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics), vol. 30, New York, NY: Springer, 2011, pp. 1–58.
  • H. Hamann, A. Weger, J. Lacey, Z. Hu, P. Bose, E. Cohen, and J. Wakil, “Hotspot-limited microprocessors: Direct temperature and power distribution measurements,” IEEE J. Solid-State Circ., vol. 42, no. 1, pp. 56–65, 2007.
  • R. Viswanath, V. Wakharkar, A. Watwe, and V. Lebonheur, “Thermal performance challenges from silicon to systems,” Intel Technology Journal, vol. 4, pp. 1–16, 2000.
  • X.-G. Liang and Z.-Y. Guo, “The scaling effect on the thermal processes at mini/microscale,” Heat Transf. Eng., vol. 27, no. 4, pp. 30–40, 2006.
  • J. B. Marcinichen, J. A. Olivier, N. Lamaison, and J. R. Thome, “Advances in electronics cooling,” Heat Transf. Eng., vol. 34, no. 5–6, pp. 434–446, 2013.
  • I. Mihai, C. Prghie, and V. Zegrean, “Research regarding heat exchange through nanometric polysynthetic thermal compound to CoolerCPU interface,” Heat Transf. Eng., vol. 31, no. 1, pp. 90–97, 2010.
  • I. Savija, J. R. Culham, M. M. Yovanovich, and E. E. Marotta, “Review of thermal conductance models for joints incorporating enhancement materials,” J. Thermophy. Heat Transf., vol. 17, no. 1, pp. 43–52, 2003.
  • R. Prasher, “Thermal interface materials: historical perspective, status, and future directions,” Proc. IEEE, vol. 94, no. 8, pp. 1571–1586, 2006.
  • R. S. Prasher, “Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials,” J. Heat Transf., vol. 123, no. 5, pp. 969–975, 2001.
  • R. S. Prasher, J. Shipley, S. Prstic, P. Koning, and Lin J. Wang, “Thermal resistance of particle laden polymeric thermal interface materials,” J. Heat Transf., vol. 125, no. 6, pp. 1170–1177, 2003.
  • F. Sarvar, D. Whalley, and P. Conway, “Thermal interface materials - A review of the state of the art,” in Electronics System-Integration Technology Conference, vol. 2, Dresden, Germany, Sept. 5–7, 2006, pp. 1292–1302.
  • V. Goyal and A. A. Balandin, “Thermal properties of the hybrid Graphene-metal nano-micro-composites: Applications in thermal interface materials,” Appl. Phys. Lett., vol. 100, no. 7, pp. 073113 (1–4), 2012.
  • E. C. Samson, S. V. Machiroutu, J.-Y. Chang, I. Santos, J. Hermerding, A. Dani, R. Prasher, and D. Song, “Interface material selection and a thermal management technique in second-generation platforms built on Intel Centrino mobile technology,” Intel Technol. J., vol. 9, no. 1, p. 75, 2005.
  • S. Narumanchi, M. Mihalic, K. Kelly, and G. Eesley, “Thermal interface materials for power electronics applications,” in 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Orlando, FL, USA, May 28–31, 2008, pp. 395–404.
  • J. Gwinn and R. Webb, “Performance and testing of thermal interface materials,” Microelectron. J., vol. 34, no. 3, pp. 215–222, 2003.
  • Y. Fu, N. Nabiollahi, T. Wang, S. Wang, Z. Hu, B. Carlberg, Y. Zhang, X. Wang, and J. Liu, “A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity,” Nanotechnology, vol. 23, no. 4, pp. 045304 (1–7), 2012.
  • S. V. Garimella, A. Fleischer, J. Y. Murthy, A. Keshavarzi, R. Prasher, C. Patel, S. Bhavnani, R. Venkatasubramanian, R. Mahajan, Y. Joshi, B. Sammakia, B. Myers, L. Chorosinski, M. Baelmans, P. Sathyamurthy, and P. Raad, “Thermal challenges in next-generation electronic systems,” IEEE Trans. Compon. Packag. Technol., vol. 31, no. 4, pp. 801–815, 2008.
  • V. Fan, D. Harman, J. Jewett, B. Leet, and D. Speranza, “Evaluation process for semiconductor fabrication materials that are better for the environment,” Intel Technol. J., vol. 12, no. 1, pp. 69–76, 2008.
  • M. Yovanovich, “Four decades of research on thermal contact, gap, and joint resistance in microelectronics,” IEEE Trans. Compon. Packag. Technol., vol. 28, no. 2, pp. 182–206, 2005.
  • E. T. Swartz and R. O. Pohl, “Thermal boundary resistance,” Rev. Mod. Phys., vol. 61, no. 3, pp. 605–668, 1989.
  • D. G. Cahill, W. K. Ford, K. E. Goodson, G. D. Mahan, A. Majumdar, H. J. Maris, R. Merlin, and S. R. Phillpot, “Nanoscale thermal transport,” Journal of Appl. Phys., vol. 93, no. 2, pp. 793–818, 2003.
  • A. Majumdar and P. Reddy, “Role of electron–phonon coupling in thermal conductance of metal–nonmetal interfaces,” Appl. Phys. Lett., vol. 84, no. 23, pp. 4768–4770, 2004.
  • B. C. Gundrum, D. G. Cahill, and R. S. Averback, “Thermal conductance of metal-metal interfaces,” Phys. Rev. B, vol. 72, no. 24, p. 245426, 2005.
  • P. Singh, M. Seong, and S. Sinha, “Detailed consideration of the electron-phonon thermal conductance at metal-dielectric interfaces,” Appl. Phys. Lett., vol. 102, no. 18, pp. 181906 (1–4), 2013.
  • M. Battabyal, O. Beffort, S. Kleiner, S. Vaucher, and L. Rohr, “Heat transport across the metal-diamond interface,” Diam. Relat. Mater., vol. 17, no. 710, pp. 1438–1442, 2008.
  • W. Kim, R. Wang, and A. Majumdar, “Nanostructuring expands thermal limits,” Nano Today, vol. 2, no. 1, pp. 40–47, 2007.
  • W. S. Capinski, H. J. Maris, T. Ruf, M. Cardona, K. Ploog, and D. S. Katzer, “Thermal conductivity measurements of GaAs/AlAs superlattices using a picosecond optical pump-and-probe technique,” Phys. Rev. B, vol. 59, no. 12, pp. 8105–8113, 1999.
  • K. E. Goodson and Y. S. Ju, “Heat conduction in novel electronic films,” Ann. Rev. Mater. Sci., vol. 29, no. 1, pp. 261–293, 1999.
  • G. Chen, “Size and interface effects on thermal conductivity of superlattices and periodic thin-film structures,” J. Heat Transf., vol. 119, no. 2, pp. 220–229, 1997.
  • C. Dames and G. Chen, “Theoretical phonon thermal conductivity of Si/Ge superlattice nanowires,” J. Appl. Phys., vol. 95, no. 2, pp. 682–693, 2004.
  • S. P. Hepplestone and G. P. Srivastava, “Phononic gaps in thin semiconductor superlattices,” J. Appl. Phys., vol. 107, no. 4, pp. 043504 (1–9), 2010.
  • A. Lops, V. Spagnolo, and G. Scamarcio, “Thermal modeling of GaInAs/AlInAs quantum cascade lasers,” J. Appl. Phys., vol. 100, no. 4, pp. 043109 (1–5), 2006.
  • Y. Ezzahri, S. Grauby, S. Dilhaire, J. M. Rampnoux, and W. Claeys, “Cross-plan Si/SiGe superlattice acoustic and thermal properties measurement by picosecond ultrasonics,” J. Appl. Phys., vol. 101, no. 1, pp. 013705 (1–7), 2007.
  • M. A. Panzer, G. Zhang, D. Mann, X. Hu, E. Pop, H. Dai, and K. E. Goodson, “Thermal properties of metal-coated vertically aligned single-wall nanotube arrays,” J. Heat Transf., vol. 130, no. 5, pp. 052401 (1–9), 2008.
  • B. A. Cola, X. Xu, and T. S. Fisher, “Increased real contact in thermal interfaces: A carbon nanotube/foil material,” Appl. Phys. Lett., vol. 90, no. 9, pp. 093513 (1–3), 2007.
  • J. Reifenberg, D. Kencke, and K. Goodson, “The impact of thermal boundary resistance in phase-change memory devices,” IEEE Elect. Devi. Lett., vol. 29, no. 10, pp. 1112 –1114, 2008.
  • J. Reifenberg, K.-W. Chang, M. Panzer, S. Kim, J. Rowlette, M. Asheghi, H.-S. Wong, and K. Goodson, “Thermal boundary resistance measurements for phase-change memory devices,” IEEE Electr. Devi. Lett., vol. 31, no. 1, pp. 56–58, 2010.
  • J. Cho, E. Bozorg-Grayeli, D. Altman, M. Asheghi, and K. Goodson, “Low thermal resistances at GaN-SiC interfaces for HEMT technology,” IEEE Elect. Devi. Lett., vol. 33, no. 3, pp. 378–380, 2012.
  • R. J. Stoner and H. J. Maris, “Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K,” Phys. Rev. B, vol. 48, no. 22, pp. 16373–16387, 1993.
  • R. J. Stevens, A. N. Smith, and P. M. Norris, “Measurement of thermal boundary conductance of a series of metal-dielectric interfaces by the transient thermoreflectance technique,” J. Heat Transf., vol. 127, no. 3, pp. 315–322, 2005.
  • H.-K. Lyeo and D. G. Cahill, “Thermal conductance of interfaces between highly dissimilar materials,” Phys. Rev. B, vol. 73, no. 14, pp. 144301 (1–6), 2006.
  • S. Pettersson and G. D. Mahan, “Theory of the thermal boundary resistance between dissimilar lattices,” Phys. Rev. B, vol. 42, no. 12, pp. 7386–7390, 1990.
  • C.-J. Twu and J.-R. Ho, “Molecular-dynamics study of energy flow and the Kapitza conductance across an interface with imperfection formed by two dielectric thin films,” Phys. Rev. B, vol. 67, no. 20, pp. 205422 (1–8), 2003.
  • R. J. Stevens, L. V. Zhigilei, and P. M. Norris, “Effects of temperature and disorder on thermal boundary conductance at solid-solid interfaces: Nonequilibrium molecular dynamics simulations,” Int. J. Heat Mass Transf., vol. 50, no. 19–20, pp. 3977–3989, 2007.
  • P. E. Hopkins and P. M. Norris, “Thermal boundary conductance response to a change in Cr/Si interfacial properties,” Appl. Phys. Lett., vol. 89, no. 13, pp. 131909 (1–3), 2006.
  • P. E. Hopkins, P. M. Norris, R. J. Stevens, T. E. Beechem, and S. Graham, “Influence of interfacial mixing on thermal boundary conductance across a chromium/silicon interface,” J. Heat Trans., vol. 130, no. 6, pp. 062402 (1–10), 2008.
  • T. S. English, J. C. Duda, J. L. Smoyer, D. A. Jordan, P. M. Norris, and L. V. Zhigilei, “Enhancing and tuning phonon transport at vibrationally mismatched solid-solid interfaces,” Phys. Rev. B, vol. 85, pp. 035438 (1–14), 2012.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.