Investigation on constitution of electrical conductive adhesives fitting for UV–thermal dual curing

References

• Yim MJ, Paik KW. Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications. Int. J. Adhes. Adhes. 2006;26:304–313.10.1016/j.ijadhadh.2005.04.004
   Web of Science ®Google Scholar
• Li Y, Wong CP. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Mater. Sci. Eng. 2006;51:1–35.10.1016/j.mser.2006.01.001
   Google Scholar
• Wang L, Wan C, Wang H, Chen H, Zhu XM, Li M. Electrical property improvement of dicyandiamide-cured electrically conductive adhesives through in situ replacement by difunctional acids and the impact on storage. Int. J. Adhes. Adhes. 2013;45:132–137.10.1016/j.ijadhadh.2013.05.006
   Web of Science ®Google Scholar
• Zemen Y, Schulz SC, Trommler H, Buschhorn ST, Bauhofer W, Schulte K. Comparison of new conductive adhesives based on silver and carbon nanotubes for solar cells interconnection. Sol. Energy Mater. Sol. Cells. 2013;109:155–159.10.1016/j.solmat.2012.10.020
   Web of Science ®Google Scholar
• Mir I, Kumar D. Recent advances in isotropic conductive adhesives for electronics packaging applications. Int. J. Adhes. Adhes. 2008;28:362–371.10.1016/j.ijadhadh.2007.10.004
   Web of Science ®Google Scholar
• Gao H, Hu G, Zhou J, Zou J, Qian J. Study on the properties of conductive adhesives in various curing manners for MCM applications. J. Adhes. Sci. Technol. 2014;28:1881–1893.10.1080/01694243.2014.925388
   Web of Science ®Google Scholar
• Seppälä A, Ristolainen E. Study of adhesive flip chip bonding process and failure mechanisms of ACA joints. Microelectron. Reliab. 2004;44:639–648.10.1016/j.microrel.2003.07.003
   Web of Science ®Google Scholar
• Melida C, Kaushik I, Jake HS. Prediction of electrical contact resistance for anisotropic conductive adhesive assemblies. IEEE Trans. Compon. Packag. Technol. 2004;27:317–326.
   Web of Science ®Google Scholar
• Lu DQ, Wong CP. Isotropic conductive adhesives filled with low-melting-point alloy fillers. IEEE Trans. Electron. Packag. Manuf. 2000;23:185–190.10.1109/6104.873246
   Web of Science ®Google Scholar
• Ngee HL, Hiroshi N, Naohide N, Tadashi T, Koichi M, Masakazu F, Koyu O. Effects of trace elements in copper fillers on the electrical properties of conductive adhesives. J. Electron. Mater. 2010;39:115–123.
   Web of Science ®Google Scholar
• Rongwei Z, Wei L, Kyoung-Sik M, Qizhen L, Chingping W. Highly reliable copper-based conductive adhesives using an amine curing agent for in situ oxidation/corrosion prevention. IEEE Trans. Compon. Packag. Manuf. Technol. 2011;1:25–32.
   Web of Science ®Google Scholar
• Chang C, Li W, Ruilin L, Guohua J, Haojie Y, Tao C. Effect of silver nanowires on electrical conductance of system composed of silver particles. J. Mater. Sci. 2007;42:3172–3176.
   Web of Science ®Google Scholar
• Xianxue L, Bingyun Z, Limei X, Dandan W, Zonglin L, Huichai Z. Study on properties of conductive adhesive prepared with silver nanoparticles modified by silane coupling agent. Rare Met. Mater. Eng. 2012;41:24–27.10.1016/S1875-5372(12)60024-1
   Web of Science ®Google Scholar
• Youliang G, Xu C, Fengqin L. Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive. Int. J. Adhes. Adhes. 2010;30:80–88.
   Web of Science ®Google Scholar
• Haiping W, Xijun W, Jinfang L, Youwen W, Xiaoming T. Properties of isotropical conductive adhesives filled with carbon nanotubes. Acta Materiae Compositae Sinica. 2006;23:9–13.
   Google Scholar
• Yasmin A, Luo J, Daniel IM. Processing of expanded graphite reinforced polymer nanocomposites. Compos. Sci. Technol. 2006;66:1182–1189.10.1016/j.compscitech.2005.10.014
   Web of Science ®Google Scholar
• Dou S, Qi J, Guo X, Yu C. Preparation and adhesive performance of electrical conductive epoxy-acrylate resin containing silver-plated graphene, J. Adhes. Sci. Technol. 2014;28:1556–1567.10.1080/01694243.2014.904766
   Web of Science ®Google Scholar
• Juguo Z, Qiuya F. Research of silver plating copper filled conductive adhesive. Surf. Technol. 2007;36:28–30.
   Google Scholar
• Shuo D, Wen L, Zhenming Y, Chaosheng Y. Study on preparation and properties of PU/silver plating nano-graphite electrically conductive adhesive. China Adhes. 2012;21:37–40.
   Google Scholar
• Zhang R, Lin W, Lawrence K, Wong CP. Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications. Int. J. Adhes. Adhes. 2010;30:403–407.10.1016/j.ijadhadh.2010.01.004
   Web of Science ®Google Scholar
• Czech Z, Kowalczyk A, Shao L, Cheng XQ, Quan S, Bai YP. Novel acrylic pressure-sensitive adhesive (PSA) containing silver particles. J. Adhes. Sci. Technol. 2013;27:1446–1454.10.1080/01694243.2012.742402
   Web of Science ®Google Scholar
• Shang Q, Hao S, Wang W, Fu D, Ma T. Preparation and characterization of antistatic coatings with modified BaTiO3 powders as conductive fillers. J. Adhes. Sci. Technol. 2013;27:2642–2652.10.1080/01694243.2013.798926
   Web of Science ®Google Scholar
• Bo Z, Zhimin D. Preparation and performance of epoxy resin conductive adhesive with fast- curing feature at low temperature. Acta Materiae Compositae Sinica. 2011;28:34–40.
   Google Scholar
• Tongxiang L, Wenyou M, Maosheng C. Effect of SiO2 nano-particles on adhesive strength of copper conductive adhesives. Polym. Mater. Sci. Eng. 2005;21:225–228.
   Google Scholar
• Ying C, Yanjun L. Study on UV-curable electrically conductive adhesives. Adhes. China. 2006;27:1–4.
   Google Scholar
• Shihu Z, Demei Y. Research and applications of UV-curable conductive polymer materials. New Chemi. Mater. 2011;39:40–43.
   Google Scholar
• Golaz B, Michaud V, Leterrier Y, Månson JAE. UV intensity, temperature and dark-curing effects in cationic photo-polymerization of a cycloaliphatic epoxy resin. Polymer. 2012;53:2038–2048.10.1016/j.polymer.2012.03.025
   Web of Science ®Google Scholar
• Huaidong M, Jinxiang Y, Tianshu L, Xiaoyin H. Study on cationic and hybrid photopolymerization systems used in stereolithgraphy. J. Radiat. Res. Radiat. Process. 2000;18:19–24.
   Google Scholar
• Noh SM, Lee JW, Nam JH, Byun KH, Park JM, Jung HW. Dual-curing behavior and scratch characteristics of hydroxyl functionalized urethane methacrylate oligomer for automotive clearcoats. Prog. Org. Coat. 2012;74:257–269.10.1016/j.porgcoat.2012.01.002
   Web of Science ®Google Scholar
• Hedreul C, Galy J, Dupuy J, Delmotte M, More C. Kinetics modeling of a modified epoxy-amine formulation cured by thermal and microwave energy. J. Appl. Polym. Sci. 1998;68:543–552.10.1002/(ISSN)1097-4628
   Web of Science ®Google Scholar
• Hideyuki I, Atsushi K, Tadatomi N. Synthesis of new hybrid monomers and oligomers containing cationic and radical Polymerizable vinyl groups and their photoinitiated polymerization. J. Polym. Sci. Part A: Polym. Chem. 1996;34:217–225.
   Web of Science ®Google Scholar