Moisture and temperature degradation of double cantilever beam adhesive joints

References

• Banea MD, da Silva LFM, Campilho RDSG, et al. Smart adhesive joints: an overview of recent developments. J Adhes. 2014;90:16–40.10.1080/00218464.2013.785916
   Web of Science ®Google Scholar
• Banea MD, da Silva LFM. Adhesively bonded joints in composite materials: an overview. Proc Inst Mech Eng Part L J Mater Des Appl. 2009;223:1–18.10.1243/14644207JMDA219
   PubMed Web of Science ®Google Scholar
• Costa M, Viana G, da Silva LFM, et al. Environmental effect on the fatigue degradation of adhesive joints: A review. J Adhes. 2016;93:127–146.
   Web of Science ®Google Scholar
• Sugiman S, Crocombe AD, Aschroft IA. Experimental and numerical investigation of the static response of environmentally aged adhesively bonded joints. Int J Adhes Adhes. 2013;40:224–237.10.1016/j.ijadhadh.2012.08.007
   Web of Science ®Google Scholar
• Hua Y, Crocombe AD, Wahab MA, et al. Modelling environmental degradation in EA9321-bonded joints using a progressive damage failure model. J Adhes. 2006;82:135–160.10.1080/00218460600559557
   Web of Science ®Google Scholar
• Barbosa AQ, da Silva LFM, Ochsner A. Hygrothermal aging of an adhesive reinforced with microparticles of cork. J Adhes Sci Technol. 2015;29:1714–1732.10.1080/01694243.2015.1041358
   Web of Science ®Google Scholar
• Lin YC, Chen X. Moisture sorption-desorption-resorption characteristics and its effect on the mechanical behavior of the epoxy system. Polymer. 2005;46:11994–12003.10.1016/j.polymer.2005.10.002
   Web of Science ®Google Scholar
• Fernandes P, Viana G, Carbas R, et al. The influence of water on the fracture envelope of an adhesive joint. Theor Appl Fract Mech. 2017. Available from http://dx.doi.org/10.1016/j.tafmec.2017.01.001
   Web of Science ®Google Scholar
• Costa M, Viana G, da Silva LFM, et al. Determination of the fracture envelope of an adhesive joint as a function moisture. Materialwiss Werkstofftech. Submitted for publication.
   Web of Science ®Google Scholar
• Loh WK, Crocombe AD, Wahab MMA, et al. Modelling anomalous moisture uptake, swelling and thermal characteristics of a rubber toughened epoxy adhesive. Int J Adhes Adhes. 2005;25:1–12.10.1016/j.ijadhadh.2004.02.002
   Web of Science ®Google Scholar
• Mubashar A, Ashcroft IA, Critchlow GW, et al. Moisture absorption-desorption effects in adhesive joints. Int J Adhes Adhes. 2009;29:751–760.10.1016/j.ijadhadh.2009.05.001
   Web of Science ®Google Scholar
• Ameli A, Datla NV, Papini M, et al. Hygrothermal properties of highly toughened epoxy adhesives. J Adhes. 2010;86:698–725.10.1080/00218464.2010.482405
   Web of Science ®Google Scholar
• Liljedahl CDM, Crocombe AD, Gauntlett FE, et al. Characterising moisture ingress in adhesively bonded joints using nuclear reaction analysis. Int J Adhes Adhes. 2009;29:356–360.10.1016/j.ijadhadh.2008.07.005
   Web of Science ®Google Scholar
• Vanlandingham MR, Eduljee RF, Gillespie JW. Moisture diffusion in epoxy systems. J Appl Polym Sci. 1999;71:787–798.10.1002/(ISSN)1097-4628
   Web of Science ®Google Scholar
• Suh DW, Ku MK, Nam JD, et al. Equilibrium water uptake of epoxy/carbon fiber composites in hygrothermal environmental conditions. J Compos Mater. 2001;35:264–278.10.1177/002199801772662253
   Web of Science ®Google Scholar
• Shanahan MER, Auriac Y. Water absorption and leaching effects in cellulose diacetate. Polymer. 1998;39:1155–1164.10.1016/S0032-3861(97)00277-2
   Web of Science ®Google Scholar
• Xiao GZ, Shanahan MER. Water absorption and desorption in an epoxy resin with degradation. J Polym Sci Part B Polym Phys. 1997;35:2659–2670.10.1002/(ISSN)1099-0488
   Web of Science ®Google Scholar
• Lin YC, Chen X. Moisture sorption–desorption–resorption characteristics and its effect on the mechanical behavior of the epoxy system. Polymer. 2005;11994–12003.10.1016/j.polymer.2005.10.002
   Web of Science ®Google Scholar
• Liljedahl CDM, Crocombe AD, Wahab MA, et al. The effect of residual strains on the progressive damage modelling of environmentally degraded adhesive joints. J Adhes Sci Technol. 2005;19:525–547.10.1163/1568561054352513
   Web of Science ®Google Scholar
• Zhou JM, Lucas JP. Hygrothermal effects of epoxy resin. Part II: variations of glass transition temperature. Polymer. 1999;40:5513–5522.10.1016/S0032-3861(98)00791-5
   Web of Science ®Google Scholar
• Zhou JM, Lucas JP. Hygrothermal effects of epoxy resin. Part I: the nature of water in epoxy. Polymer. 1999;40:5505–5512.10.1016/S0032-3861(98)00790-3
   Web of Science ®Google Scholar
• Adamson MJ. Thermal-expansion and swelling of cured epoxy-resin used in graphite-epoxy composite-materials. J Mater Sci. 1980;15:1736–1745.10.1007/BF00550593
   Web of Science ®Google Scholar
• Xiao GZ, Shanahan MER. Swelling of DGEBA/DDA epoxy resin during hygrothermal ageing. Polymer. 1998;39:3253–3260.10.1016/S0032-3861(97)10060-X
   Web of Science ®Google Scholar
• Chiang MYM, Fernandez-Garcia M. Relation of swelling and Tg depression to the apparent free volume of a particle-filled, epoxy-based adhesive. J Appl Polym Sci. 2003;87:1436–1444.10.1002/(ISSN)1097-4628
   Web of Science ®Google Scholar
• Banea MD, de Sousa FSM, da Silva LFM, et al. Effects of temperature and loading rate on the mechanical properties of a high temperature epoxy adhesive. J Adhes Sci Technol. 2011;25:2461–2474.10.1163/016942411X580144
   Web of Science ®Google Scholar
• Banea MD, da Silva LFM, Campilho RDSG. Mode I fracture toughness of adhesively bonded joints as a function of temperature: experimental and numerical study. Int J Adhes Adhes. 2011;31:273–279.10.1016/j.ijadhadh.2010.09.005
   Web of Science ®Google Scholar
• Pethrick RA. Design and ageing of adhesives for structural adhesive bonding – a review. Proc IMechE Part L J Mater Des Appl. 2015;229:349–379.
   Web of Science ®Google Scholar
• Deb A, Malvade I, Biswas P, et al. An experimental and analytical study of the mechanical behaviour of adhesively bonded joints for variable extension rates and temperatures. Int J Adhes Adhes. 2008;28:1–15.10.1016/j.ijadhadh.2007.02.004
   Web of Science ®Google Scholar
• Banea MD, Silva LFM. Mechanical characterization of flexible adhesives. J Adhes. 2009;85:261–285.10.1080/00218460902881808
   Web of Science ®Google Scholar
• Srivastava VK. Characterization of adhesive bonded lap joints of C/C-SiC composite and Ti-6Al-4V alloy under varying conditions. Int J Adhes Adhes. 2003;23:59–67.10.1016/S0143-7496(02)00082-9
   Web of Science ®Google Scholar
• Grant LDR, Adams RD, da Silva LFM. Effect of the temperature on the strength of adhesively bonded single lap and T joints for the automotive industry. Int J Adhes Adhes. 2009;29:535–542.10.1016/j.ijadhadh.2009.01.002
   Web of Science ®Google Scholar
• Marques EAS, da Silva LFM, Banea MD, et al. Adhesive joints for low- and high-temperature use: an overview. J Adhes. 2015;91:556–585.10.1080/00218464.2014.943395
   Web of Science ®Google Scholar
• Banea MD, da Silva LFM. The effect of temperature on the mechanical properties of adhesives for the automotive industry. Proc IMechE Part L J Mater Des Appl. 2010;224:51–62.
   Web of Science ®Google Scholar
• Viana G, Costa M, Banea M. A review on the temperature and moisture degradation of adhesive joints. Proc Inst Mech Eng Part L J Mater Des Appl. 2016. DOI: 10.1177/1464420716671503.
   Google Scholar
• Costa M, Viana G, da Silva LFM, et al. Environmental effect on the fatigue degradation of adhesive joints: a review. The Journal of Adhesion. 2016;93:127–146. DOI:10.1080/00218464.2016.1179117.
   Web of Science ®Google Scholar
• Campilho RDSG, Moura DC, Banea MD, et al. Adherend thickness effect on the tensile fracture toughness of a structural adhesive using an optical data acquisition method. Int J Adhes Adhes. 2014;53:15–22.10.1016/j.ijadhadh.2014.01.015
   Web of Science ®Google Scholar
• Costa M, Viana G, Canto C, et al. Effect of the size reduction on the bulk tensile and double cantilever beam specimens used in cohesive zone models. Proc Inst Mech Eng Part L J Mater Des Appl. 2016;230:968–982.10.1177/1464420715610248
   Web of Science ®Google Scholar
• Winston PW, Bates DH. Saturated solutions for the control of humidity in biological research. Ecology. 1960;41:232–237.10.2307/1931961
   Web of Science ®Google Scholar
• Zannideffarges MP, Shanahan MER. Diffusion of water into an epoxy adhesive – comparison between bulk behavior and adhesive joints. Int J Adhes Adhes. 1995;15:137–142.10.1016/0143-7496(95)91624-F
   Web of Science ®Google Scholar
• Viana G, Costa M, Banea MD, et al. Water diffusion in double cantilever beam adhesive joints. Lat Am J Solids Struct. 2017;14:188–201.
   Web of Science ®Google Scholar
• de Moura MFSF, Campilho RDSG, Goncalves JPM. Crack equivalent concept applied to the fracture characterization of bonded joints under pure mode I loading. Compos Sci Technol. 2008;68:2224–2230.10.1016/j.compscitech.2008.04.003
   Web of Science ®Google Scholar
• Barbosa AQ, da Silva LFM, Banea MD, et al. Methods to increase the toughness of structural adhesives with micro particles: an overview with focus on cork particles. Materialwiss Werkstofftech. 2016;47:307–325.10.1002/mawe.v47.4
   Web of Science ®Google Scholar
• Banea MD, da Silva LFM, Campilho RDSG. Effect of temperature on tensile strength and mode I fracture toughness of a high temperature epoxy adhesive. J Adhes Sci Technol. 2012;26:939–953.
   Web of Science ®Google Scholar
• Goglio L, Rezaei M. Effect of different substrate pre-treatments on the resistance of aluminium joints to moist environments. J Adhes. 2013;89:769–784.10.1080/00218464.2012.759883
   Web of Science ®Google Scholar
• Kinloch AJ, Little MSG, Watts JF. The role of the interphase in the environmental failure of adhesive joints. Acta Mater. 2000;48:4543–4553.10.1016/S1359-6454(00)00240-8
   Web of Science ®Google Scholar
• Humfeld GR, Dillard DA. Residual stress development in adhesive joints subjected to thermal cycling. J Adhes. 1998;65:277–306.10.1080/00218469808012250
   Web of Science ®Google Scholar
• Kang SG, Kim MG, Kim CG. Evaluation of cryogenic performance of adhesives using composite-aluminum double-lap joints. Compos Struct. 2007;78:440–446.10.1016/j.compstruct.2005.11.005
   Web of Science ®Google Scholar