http://orcid.org/0000-0002-9058-0031
References
- Bhusari D, Hayden H, Tanikella R. et al. Plasma treatment and surface analysis of polyimide films for electroless copper buildup process. J Electrochem Soc. 2005;152(10):F162–F170.
- Kim H, Cho SH, Lee NE. et al. Adhesion properties of Cu/Cr films on polyimide substrate treated by dielectric barrier discharge plasma. Surf Coat Technol. 2005;193:101–106.
- Yang CH, Lee SC, Wu JM, et al. The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment. Appl Surf Sci. 2005;252:1818–1825.
- Kim HW, Kim JH, Kim DJ, et al. Adhesion enhancement of electroless-deposited Cu on flexible polyimide substrate treated by O2 and N2/H2 inductively coupled plasmas. J Electrochem Soc. 156(12):D525–D530.
- Ma Q, Zhao WX, Li XR, et al. Study of an environment-friendly surface pretreatment of ABS-polycarbonate surface for adhesion improvement. Int J Adhes Adhes. 2013;44:243–249.
- Wang Z, Furaya A, Yasuda K, et al. Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage. J Adhes Sci Technol. 2002;16:1027–1040.
- Park SJ, Lee HY. Effect of atmospheric-pressure plasma on adhesion characteristics of polyimide film. J Colloid Interf Sci. 2005;285:267–272.
- Osaka T, Wakatsuki S, Masuda T, et al. A wet process for forming an adhesive copper layer on polyimide film. Electrochemistry. 2008;76(3):191–196
- Zhang Y, Tan KL, Yang GH, et al. Electroless plating of copper and nickel via a Sn-free process on polyimide films modified by surface graft copolymerization with 1-vinylimidazole. J Electrochem Soc. 2001;148(9): C574–C582.
- Geng XY, Qiang Q, Zhao J, et al. The effect of TiO2 morphology on the surface modification of poly (ethylene terephthalate) for electroless plating. J Adhes Sci Technol. 2015;29(8):705–715.
- Zhao WX, Ma Q, Li LS, et al. Surface modification of ABS by photocatalytic treatment for electroless copper plating. J Adhes Sci Technol. 2014;28:499–511.
- Magallón-Cacho L, Pérez-Bueno JJ, Meas-Vong Y, et al. Surface modification of acrylonitrile-butadiene-styrene (ABS) with heterogeneous photocatalysis (TiO2) for the substitution of the etching stage in the electroless process. Surf Coat Technol. 2011;206:1410–1415.
- Kim GG, Kang JA, Kim JH, et al. Photocatalytic pretreatment of acrylonitrile-butadiene-styrene polymer for electroless plating. Scripta Mater. 2007;56:349–351.
- Zhao WX, Wang ZL. Adhesion improvement of electroless copper to PC substrate by a low environmental pollution MnO2–H3PO4–H2SO4–H2O system. Int J Adhes Adhes. 2013;41:50–56.
- Wang ZL, Li ZX, He Y, et al. Study of an environmentally friendly surface etching system of ABS for improving adhesion of electroless Cu film. J Electrochem Soc. 2011;158(11):D664–D670.
- Wang ZL, Yaegashi O, Sakaue H, et al. Suppression of native oxide growth in sputtered TaN films and its application to Cu electroless J Appl Phys. 2003;7:4697–4701.
- Hansen CM., editor. Hansen Solubility Parameters—A User’s Handbook, CRC Press, Boca Raton, FL, 1999.
- Chastain J, Handbook of X-ray Photoelectron Spectroscopy. Eden Prairie (MN): Perkin- Elmer Corporation, Physical Electronics Division, 1992. p. 182–192.
- Zhao WX, Ding J, and Wang ZL. Improvement in the etching performance of the acrylonitrile-butadiene-styrene resin by MnO2–H3PO4–H2SO4 Colloid. Langmuir. 2013; 29: 5968–5973.