367
Views
8
CrossRef citations to date
0
Altmetric
Articles

Damping analysis of a quad beam MEMS piezoresistive accelerometer

ORCID Icon, &
Pages 256-264 | Received 14 Mar 2019, Accepted 22 Feb 2020, Published online: 15 Mar 2020

References

  • Fang XW, An Huang Q, Tang JY. Modelling of MEMS reliability in shock environments. Beijing, China: Solid-State and Integrated Circuits Technology IEEE. 2005;860–863.
  • Wang J, Li X. Package-friendly piezoresistive pressure sensors with on-chip integrated packaging-stress-suppressed suspension (PS3) technology. J Micromech Microengg. 2013;23:1–6.
  • Liu L, Zhou HC, Lic W, et al. Structure design and optimization of high-g piezoresistive accelerometer. Electron Mech Eng Inf Technol. 2011;9:4508–4511.
  • Grace Jency J, Sekar M, Ravi Sankar A. Packaging in MEMS piezoresistive accelerometers: a review. Int J Mech Eng Technol. 2017;8:685–693.
  • Mathew R, Ravi Sankar A. Design of a triangular platform piezoresistive affinity microcantilever sensor for biochemical sensing applications. J Phy D App Phy. 2015;48:1–14.
  • Vetrivel Sankar S, Mathew R, Ravi Sankar A. Design and optimization of a doubly clamped piezoresistive acceleration sensor with an integrated silicon nanowire piezoresistor. Microsyst Technol. 2017;23(8):1–12.
  • Matthew R, Ravi Sankar A. In silico modeling and investigation of self-heating effects in composite nano cantilever biosensors with integrated piezoresistors. Biomed Phys Eng Express. 2016;2:1–16.
  • Meena KV, Matthew R, leelavathi J, et al. Performance comparison of single element piezoresistor with a half-active wheatstone bridge for miniaturized pressure sensors. Measurement. 2017;111:1–22.
  • Song J, Changde H, Wang R, et al. A mathematical model of a piezoresistive eight beam three axis accelerometer with simulation and experimental validation. Sensors. 2018;18:1–19.
  • Narasimhan V, Li H, Jianmin M. Micromachined high-g accelerometers: a review. J Micromech Microengg. 2015;25:1–19.
  • Chen H, Bao M, Zhu H, et al. A piezoresistive accelerometer with a novel vertical beam structure. Sens Actuators. 1997;63:19–25.
  • Henrion W, Di Sanza L, Matthew I, et al. Wide dynamic range direct accelerometer. Hilton Head Island: Solid-State Sens Actuator. 1990;153–157.
  • Barth PW, Pourahmadi FJ, Mayer R, et al. A monolithic silicon accelerometer with integral air damping and over range protection. Hilton Head Island: Solid-State Sensor and Actuator Workshop IEEE. 1998;35–38.
  • Andrew R, Atwell R, Okojie S, et al. fabrication and testing of bulk micromachined 6H-SiC high-g piezoresisitive accelerometers. Sens Actuators. 2003;A 104:11–18.
  • Henrey V, Allen SC, Terry S, et al. Accelerometer systems with self testable features. Sens Actuators. 1989;20:153–161.
  • Van Kampen RV, Wolffenbuttel RF. Modeling the mechanical behavior of bulk-micromachined silicon accelerometers. Sens Actuators. 1998;A 64:137–150.
  • Grace Jency J, Sekar M, Ravi Sankar A. Etch time optimization in bulk silicon MEMS devices using a novel compensation structure. In: Anguera J, Satapathy S, Bhateja V, et al., editors. Microelectronics, electromagnetics and telecommunications. Lecture notes in electrical engineering. Vol. 471. Singapore: Springer; 2017. p. 33–40.
  • Ravi Sankar A, Lahari SK, Das S. Performance enhancement of a silicon MEMS piezoresistive single axis accelerometer with electroplated gold on a proof mass. J Micromech Microeng. 2009;19:1–9.
  • Ravi Sankar A, Grace Jency J, Ashwini J, et al. Realization of silicon piezoresistive accelerometer with proof-mass-edge-aligned-flexures using wet anisotropic etching. IET Micro Nano Lett. 2012;7:118–121.
  • Ravi Sankar A, Das S. A very- low cross axis sensitivity piezoresistive accelerometer with an electroplated gold layer atop a thickness reduced proof mass. Sens Actuators A. 2013;189:125–133.
  • Ravi SA, Grace Jency J, Das S. Design, fabrication and testing of a high performance silicon piezoresistive Z-axis accelerometer with proof mass-edge-aligned flexures. Microsyst Technol. 2011;18(15):9–23.
  • Bao M, Yang H. Squeeze film air damping in MEMS. Sens Actuators. 1998;A 136:3–27.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.