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Original Articles

Model reduction techniques for speeding up the thermal simulation of printed circuit boards

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Pages 731-740 | Received 30 Jul 1999, Accepted 12 Apr 2000, Published online: 03 Mar 2011

References

  • Celik , M. , Ocali , O. , Tan , M. A. and Atalar , A. “Improving AWE Accuracy Using Multipoint Pade Approximation,” . IEEE IEEE International Symposium on Circuits and Systems . Vol. 1 , pp. 379 – 382 . ISCAS'94
  • Chen , J. E. and Yip , G. “SPICE Models for Thermal and Vibration Analysis of Printed Circuit Boards,” . Proc. of the 27th Intersociety Energy Conversion Engineering Conf. pp. 287 – 292 .
  • Chiprout , Eli and Nalhla , Michel S. 1994 . A Symptotic Waveform Evaluation and Moment Matching for Interconnect Analysis. , Massachusetts : Kluwer Academic Publishers .
  • Funk , J. N. , Menguc , M. P. , Tagavi , K. A. and Cremers , C. J. “A Semi‐Analytical Method to Predict Printed Circuit Board Package Temperatures,” . IEEE SEMI_THERM VII Proceedings . pp. 7 – 14 .
  • Funk , J. M. , Menguc , M. P. , Tagavi , K. A. and Cremers , C. J. Oct. 1992 . “A Semi‐Analytical Method to Predict Printed Circuit Board Package Temperatures,” . In IEEE Trans. On Components , Vol. 15 , Oct. , 675 – 684 . Hybrids, and Manufacturing Technology . No. 5
  • Godfrey , W. M. , Tagavi , K. A. , Cremers , C. J. and Menguc , M. P. 1993 . “Interactive Thermal Modeling of Electronic Circuit Boards,” . IEEEE Trans. On Components, Hybrids, and Manufacturing Technology , 16 ( 8 ) Dec. : 978 – 985 .
  • Lee , J. Y. , Huang , X. and Rohrer , R. A. “Efficient Pole Zero Sensitivity Calculation in AWE,” . IEEE International Symposium onCircuits and Systems, . Vol. 1 , pp. 379 – 382 . ISCAD‐90
  • Liu , D. G. , Phanilatha , V. , Zhang , Q. J. and Nakhla , M. S. Dec. 1995 . “Asymptotic Thermal Analysis of Electronic Package and Printed‐Cir‐cuit Boards,” . In IEEE Transactions on Components, Packages, and Manufacturing Technology‐ Part A Vol. 18 , Dec. , 781 – 787 . No. 4
  • Pinto , E. J. and Mikic , B.B . 1986 . “Temperature Prediction on Substrates and Integrated Circuits Chips,” . Heat Transfer in Electronic Equipment , 57 : 199 – 208 . HTD‐
  • Pokala , R. P. and Divekar , D. “Thermal Analysis in SPICE,” . IEEE International Conference on Computer‐Aided Design . Nov . pp. 256 – 259 . ICCAD‐89
  • Schaller , A. “Finite Element Analysis of Microelectronic Components‐State of the Art,” . Electronic Manufacturing Technology Symposium, Fourth . pp. 57 – 61 .
  • Vinke , H. and Lasance , C.J.M. “Recent Achievements in the Thermal Characterization of Electronic Devices by Means of Boundary Condition Independent Compact Models,” . In Thirteenth IEEE SEMI‐THERM Symposium . pp. 32 – 39 .
  • Correspondence addressee

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