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Journal of Microwave Power and Electromagnetic Energy Volume 49, 2015 - Issue 2
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Original Articles

Detection of Surface Crack on the Substrate under Thermal Barrier Coatings Using Microwave Non-Destructive Evaluation

Song GuorongCollege of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology,China
,
Yan TiantingCollege of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology,China
,
He CunfuCollege of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology,China
,
Yang ShenCollege of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology,China
,
Lu YanCollege of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology,China
&
Wu BinCollege of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology,China
Pages 69-75 | Received 04 Dec 2014, Accepted 01 Mar 2015, Published online: 09 May 2016

References

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  • Yang Y., He C., and Wu B. (2012a) “Simulation for Microwave Nondestructive Detection of Thickness and Delamination in Layered-Dielectric in Metallic Substrate”. Advanced Materials Research. 346, pp. 764771.
  • Yang Yu’e, He Cunfu, and Wu Bin (2012b) “Optimization of Detecting Thermal Barrier Coatings Using Waveguide Probe”. Journal of Beijing University of Technology, 38(10), pp. 1456–1461.
  • Yang Yu’e, He Cunfu, and Wu Bin. (2013) “Optimization of evaluating surface crack on the substrate under thermal barrier coatings using microwave”. Acta Materiae Compositae Sinica, 30(3), pp. 149–153.

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