Multiscale perspectives of interface delamination in microelectronic packaging applications

References

• Yuan , C.A. , Van Der Sluis , O. , Zhang , G.Q. , Ernst , L.J. , Van Driel , W. and Van Silfhout , R.B.R. 2007 . Molecular simulation on the material/interfacial strength of the low-dielectric materials . Microelectr. Reliabil. , 47 : 1483 – 1491 .
   Web of Science ®Google Scholar
• Buehler , M.J. 2008 . Atomistic Modeling of Materials Failure , New York : Springer .
   Google Scholar
• Liu , W.K. , Karpov , E.G. , Zhang , S. and Park , H.S. 2004 . An introduction to computational nanomechanics and materials . Comput. Methods Appl. Mech. Eng. , 193 : 1529 – 1578 .
   Web of Science ®Google Scholar
• Fish , J. 2006 . Bridging the scales in nano engineering and science . J. Nanoparticle Res. , 8 : 577 – 594 .
   Web of Science ®Google Scholar
• Curtin , W.A. and Miller , R.E. 2003 . Atomistic/continuum coupling in computational materials science . Model. Simulat. Mater. Sci. Eng. , 11 : R33 – R68 .
   Web of Science ®Google Scholar
• V. Yamakov, E. Saether, and E.H. Glaessgen, A new concurrent multiscale methodology for coupling molecular dynamics and finite element analyses, NASA TM-2008-215328 (2008)
   Google Scholar
• Yamakov , V. , Saether , E. , Phillips , D.R. and Glaessgen , E.H. 2006 . Molecular-dynamics simulation-based cohesive zone representation of intergranular fracture processes in aluminum . J. Mech. Phys. Solids , 54 : 1899 – 1928 .
   Web of Science ®Google Scholar
• Hao , S. , Liu , W.K. , Moran , B. , Vernerey , F. and Olson , G.B. 2004 . Multi-scale constitutive model and computational framework for the design of ultra-high strength, high toughness steels . Comput. Methods Appl. Mech. Eng. , 193 : 1865 – 1908 .
   Web of Science ®Google Scholar
• Andrienko , D. , Leon , S. , Delle Site , L. and Kremer , K. 2005 . Adhesion of polycarbonate blends on a nickel surface . Macromolecules , 38 : 5810 – 5816 .
   Web of Science ®Google Scholar
• Delle Site , L. , Abrams , C.F. , Alavi , A. and Kremer , K. 2002 . Polymers near metal surfaces; selective adsorption and global conformations . Phys. Rev. Lett. , 89 ( 15 ) : 156103
   Google Scholar
• B. Wunderle, E. Dermitzaki, O. Hölck, J. Bauer, H. Walter, Q. Shaik, K. Rätzke, F. Faupel, B. Michel, and H. Reichl, Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling, 59th Electronic Components and Technology Conference, ECTC 2009, 2009, pp. 1404–1413.
   Google Scholar
• O. Hölck, E. Dermitzaki, B. Wunderle, J. Bauer, B. Michel, and H. Reichl, Molecular modeling of a 3D-crosslinked epoxy resin and its interface to native SiO2 – property prediction in microelectronic packaging, in Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th, 2010, pp. 135–143
   Google Scholar
• K. Jansen, L. Wang, D. Yang, C. van't Hof, L. Ernst, H. Bressers, and G. Zhang, Constitutive modeling of moulding compounds [electronic packaging applications], 54th Electronic Components and Technology Conference, 2004. Proceedings, Vol. 1, 2004, pp. 890–894.
   Google Scholar
• Yarovsky , I. 1997 . Atomistic simulation of interfaces in materials: Theory and applications . Aust. J. Phys. , 50 : 407 – 424 .
   Google Scholar
• Yarovsky , I. and Evans , E. 2002 . Computer simulation of structure and properties of crosslinked polymers: Application to epoxy resins . Polymer , 43 : 963 – 969 .
   Web of Science ®Google Scholar
• Harkins , W.D. and Feldman , A. 1922 . Films. The spreading of liquids and the spreading coefficient . J. Am. Chem. Soc. , 44 ( 12 ) : 2665 – 2685 .
   Google Scholar
• Nielsen , S.O. , Lopez , C.F. , Srinivas , G. and Klein , M.L. 2004 . Coarse grain models and the computer simulation of soft materials . J. Phys Condens. Mater , 16 : R481 – R512 .
   Web of Science ®Google Scholar
• N. Iwamoto, Mechanical properties of an epoxy modeled using particle dynamics, as parameterized through molecular modeling, 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Bordeaux, 2010.
   Google Scholar
• Iwamoto , N. 2002 . Understanding modulus trends in ultra low k dielectric materials through the use of molecular modeling . : 1318 – 1322 . Proceedings of the 52nd Electronic Components and Technology Conference 2002, 28–31 May, San Diego, CA
   Google Scholar
• Noijen , S.P.M. , van der Sluis , O. , Timmermans , P.H.M. and Zhang , G.Q. 2009 . Numerical prediction of failure paths at a roughened metal/polymer interface . Microelectr. Reliabil. , 49 : 1315 – 1318 .
   Web of Science ®Google Scholar
• Yao , Q. and Qu , J. 2002 . Interfacial versus cohesive failure on polymer-metal interfaces in electronic packaging – Effects of interface roughness . J. Electr. Packag. , 124 : 127 – 134 .
   Web of Science ®Google Scholar
• He , M.Y. and Hutchinson , J.W. 1989 . Crack deflection at an interface between dissimilar elastic materials . Int. J. Solids Struct. , 25 ( 9 ) : 1053 – 1067 .
   Web of Science ®Google Scholar
• S.P.M. Noijen, O. van der Sluis, P.H.M. Timmermans, and G.Q. Zhang, Meso-scale analysis of interface roughness effect on delamination of polymer/metal interfaces, 18th European Conference on Fracture, Proceedings, 2010.
   Google Scholar