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Molecular Simulation Volume 47, 2021 - Issue 7: Materials Studio 20 Years Anniversary; Guest Editor: Marc Meunier
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Articles

Molecular simulation of thermoset curing: application to 3D printing materials

Márk Jeneia Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, UKView further author information
,
Reinier L. C. Akkermansb Dassault Systèmes BIOVIA, Cambridge, UKORCID Iconhttps://orcid.org/0000-0003-0182-6587View further author information
ORCID Icon,
Struan Robertsonb Dassault Systèmes BIOVIA, Cambridge, UKView further author information
&
James A. Elliotta Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, UKCorrespondence[email protected]
ORCID Iconhttps://orcid.org/0000-0002-4887-6250View further author information
ORCID Icon
Pages 575-585 | Received 20 Jul 2020, Accepted 15 Sep 2020, Published online: 21 Oct 2020

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