References
- Chung, S. H., W. L. Pearn, and Y. S. Yang. 2007. A comparison of two methods for transforming non-normal manufacturing data. The International Journal of Advanced Manufacturing Technology 31 (9-10):957–68. doi:https://doi.org/10.1007/s00170-005-0279-3.
- Curran-Everett, D. 2018. Explorations in statistics: The log transformation. Advances in Physiology Education 42 (2):343–7. doi:https://doi.org/10.1152/advan.00018.2018.
- Efron, B. 1979. Bootstrap methods: Another look at the Jackknife. The Annals of Statistics 7 (1):1–26. doi:https://doi.org/10.1214/aos/1176344552.
- Freeman, J., and R. Modarres. 2006. Efficiency of t-Test and Hotelling’s T2- test after Box-Cox transformation. Communications in Statistics - Theory and Methods 35 (6):1109–22. doi:https://doi.org/10.1080/03610920600672203.
- Hosseinifard, S. Z., B. Abbasi, S. Ahmad, and M. Abdollahian. 2009. A transformation technique to estimate the process capability index for non-normal processes. The International Journal of Advanced Manufacturing Technology 40 (5-6):512–7. doi:https://doi.org/10.1007/s00170-008-1376-x.
- Kane, V. E. 1986. Process capability indices. Journal of Quality Technology 18 (1):41–52. doi:https://doi.org/10.1080/00224065.1986.11978984.
- Khor, C. Y., M. Z. Abdullah, and M. A. Mujeebu. 2012. Influence of gap height in flip chip underfill process with non-Newtonian flow between two parallel plates. Journal of Electronic Packaging 134 (1):11003. doi:https://doi.org/10.1115/1.4005914.
- Lee, K. J., and J. B. Carlin. 2017. Multiple imputation in the presence of non-normal data. Statistics in Medicine 36 (4):606–17. doi:https://doi.org/10.1002/sim.7173.
- Lin, G. H., and W. L. Pearn. 2003. Distributions of the estimated process capability index Cpk. Economic Quality Control 18 (2):263–79. doi:https://doi.org/10.1515/EQC.2003.263.
- Luo, W., J. J. Liang, Y. Zhang, and H. M. Zhou. 2016. The effect of gap height on non-Newtonian underfill flow in chip packaging: Experiments and simulations. 17th International Conference on Electronic Packaging Technology, China, 1387–1390.
- Pearn, W. L., and C. S. Chang. 2006. Precision measures for processes with multiple manufacturing lines. The International Journal of Advanced Manufacturing Technology 30 (11-12):1202–10. doi:https://doi.org/10.1007/s00170-005-0145-3.
- Pearn, W. L., and Y. T. Tai. 2016. Group supplier selection for multiple-line gold bumping processes. IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (10):1576–81. doi:https://doi.org/10.1109/TCPMT.2016.2607781.
- Pearn, W. L., Y. T. Tai, and C. H. Wu. 2016. A note on production yield measure for multiple lines. Quality Technology & Quantitative Management 13 (4):394–402. doi:https://doi.org/10.1080/16843703.2016.1191150.
- Pearn, W. L., Y. T. Tai, and S. C. Tseng. 2019. An analytical closed-form solution for multiple line supplier selection problem. Quality Technology & Quantitative Management 16 (4):377–88. doi:https://doi.org/10.1080/16843703.2018.1430522.
- Pearn, W. L., Y. T. Tai, and Y. T. Chiu. 2018b. Production yield for multiple line processes: Product acceptance determination. Journal of Testing and Evaluation 46 (1):340–50.
- Pearn, W. L., Y. T. Tai, Y. W. Wu, and Y. A. Wang. 2018a. Power analysis for group supplier selection with multiple production lines. Quality and Reliability Engineering International 34 (8):1530–43. doi:https://doi.org/10.1002/qre.2328.
- Tai, Y. T. 2015. Manufacturing yield for multiple lines gold bumping processes with asymmetric tolerances. IEEE Transactions on Semiconductor Manufacturing 28 (4):557–62. doi:https://doi.org/10.1109/TSM.2015.2487538.
- Tang, L. C., and S. E. Than. 1999. Computing process capability indices for non-normal data: A review and comparative study. Quality and Reliability Engineering International 15 (5):339–53. doi:https://doi.org/10.1002/(SICI)1099-1638(199909/10)15:5<339::AID-QRE259>3.0.CO;2-A.
- Wang, K., Y. Wang, and W. Zhu. 2018. Prediction of filling time in capillary-driven underfill process through 3D numerical analysis. 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, France, 1–5.
- Wu, C. H., W. L. Pearn, and Y. T. Tai. 2019. An improved manufacturing yield measure for gold bumping processes with very low nonconformities. IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (5):991–7. doi:https://doi.org/10.1109/TCPMT.2019.2893264.
- Wu, C. W., M. H. Shu, and F. T. Cheng. 2009. Generalized confidence intervals for assessing process capability of multiple production lines. Quality and Reliability Engineering International 25 (6):701–6. doi:https://doi.org/10.1002/qre.996.