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Welding International Volume 16, 2002 - Issue 11
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Original Articles

Recent advances in solid‐state bonding of aluminium alloys (report 4)

T Okita Furukawa Denki Kogyo KK,
Pages 860-871 | Published online: 09 Dec 2009

References

Papers on diffusion bonding General aspects of diffusion bonding of aluminium

  • Ohashi , O . 1991 . ‘Joining methods for aluminium and recent progress’ . Proc Symposium on Diffusion Bonding, Jpn Inst Light Met Welded Structures . 1991 . pp. 57 – 66 .
  • Ohashi , O . 1992 . ‘Diffusion bonding’ . J Light Met Weld & Constr , 30 (10) : 494 – 496 .
  • Ohashi , O . 1998 . ‘Diffusion bonding of aluminium’ . J Light Met Weld & Constr , 36 (3) : 105 – 110 .

Diffusion bonding of Al/Al

  • Enjo , T . 1989 . ‘Diffusion bonding of aluminium and its alloys’ . J Jpn Inst Light Met , 39 (1) : 58 – 65 .
  • Tsutsui , M . 1995 . ‘Joint strength of superplastic aluminium alloy A7475 scarf joints produced by diffusion bonding’ . J Jpn Inst Light Met , 45 (10) : 566 – 571 .
  • Derby , B . 1995 . ‘Fundamentals of diffusion bonding’ . DVS Ber (Dtsch Verlag Schweisstech) , : 11 – 13 .
  • Yokota , T . 1995 . ‘Properties of solid‐state bonded joints exploiting interfacial sliding of A3005 aluminium alloy’ . Proc Conf Jpn Inst Light Met , : 291 – 292 .
  • Tokuda , M . 1995 . “ ‘Development of new diffusion bonding method for aluminium alloys using combined loading’ ” . International Interchange Reports 15 Amada Metalworking Machinery Technology Promotion Inc. S ‐ Research Report Summaries, Amada Metalworking Machinery Technology Promotion Inc . (7)
  • Friedrich , H E . 1995 . ‘Forming and bonding techniques for high‐strength aluminium alloys’ . JOM , 47 (2) : 33 – 35 .
  • Kotani , K . 1995 . ‘Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 4). TEM observations of interfacial phases formed during diffusion bonding of Al‐X binary alloys (X = Mg, Si, Zn, Cu, Mn)’ . Proc Nat Conf Jpn Weld Soc , 56 : 282 – 283 .
  • Sunwoo , A . 1995 . ‘Concurrent solid‐state diffusion bonding and superplastic forming of aluminium alloy A7475’ . Superplast Superplast Form , : 251 – 258 .
  • Nishida , T and Kawakami , N . 1995 . ‘Study of solid‐state diffusion bonding of aluminium’ . Bull Occupational Capacity Development Inst, A ‐ Science, Engineering, and Skills , 24 : 1 – 7 .
  • Hirohashi , M . 1995 . ‘Superplastic forming and bonding of aluminium alloy plates’ . Proc Spring Conf Jpn Soc Technol Plast , : 399 – 400 . (1995)
  • Sunwoo , A and Lum , R . 1995 . ‘Superplastic deformation enhanced diffusion bonding of aluminium alloy A7475’ . Scr Metall Mater , 35 (4) : 630 – 644 .
  • Kotani , K . 1996 . ‘Interfacial phases formed during diffusion bonding of Al‐X binary alloys (X = Si, Mn, Zn, Cu) using Al‐Mg inserts. Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 5) . Proc Nat Conf Jpn Weld Soc , 59 : 256 – 257 .
  • Kotani , K . 1996 . ‘Interfacial phases formed during diffusion bonding of Al‐Ca binary alloys. Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 6) . Proc Nat Conf Jpn Weld Soc , 59 : 258 – 259 .
  • Iwasaki , H . 1996 . ‘Structural refinement and mechanical properties of Al alloys by foil metallurgy process’ . Proc Conf Jpn Soc Mech Eng , 74 (2) : 35 – 36 .
  • Kotani , K . 1996 . ‘Transmission electron microscopic study of interfacial phases in diffusion bonding of aluminium alloys’ . Bull Aichi Pref Industrial Technology Centre , 32 : 99 – 104 .
  • Campbell , G H . 1996 . ‘A high‐resolution electron microscopy study of the S11(113)/[110] symmetric tilt grain boundary in pure Al and Al‐1.5wt%Cu’ . US DOE Rep , : 8
  • Ikeuchi , K . 1996 . ‘Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 1). Behaviour of oxides in diffusion bonding interface of Al‐Mg‐Si 6063 alloy’ . Q J Jpn Weld Soc , 14 (1) : 122 – 128 .
  • Kotani , K . 1996 . ‘Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 2). interfacial phases formed during diffusion bonding of actually used aluminium alloys’ . Q J Jpn Weld Soc , 14 (2) : 382 – 388 .
  • Urena , A . 1996 . ‘Latest developments for microstructural and chemical characterisation of diffusion bonding in 8090 Al‐Li superplastic alloys’ . J Mater Res , 11 (1) : 63 – 71 .
  • Kotani , K . 1996 . ‘Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 3). Effect of bonding temperature on interfacial phases formed during diffusion bonding of A6063, A5005, and A7N01’ . Q J Jpn Weld Soc , 14 (2) : 389 – 397 .
  • Church , S . 1996 . ‘Diffusion bonding of metals and alloys’ . Mater World , 4 (7) : 385 – 386 .
  • Reitz , W . . ‘Review of surface engineering to enhance diffusion bonding’ . 9th International Conference on Surface Modification Technologies . Cleveland, Ohio.
  • Urena , A . 1996 . ‘Diffusion bonding of an aluminium‐lithium alloy (AA8090) using aluminium‐copper alloy interlayers (part I)’ . J Mater Sci , 31 (3) : 807 – 817 .
  • Urena , A . 1996 . ‘TEM characterisation of diffusion bonding obtained superplastic 8090 Al‐Li alloy’ . Scr Mater , 34 (4) : 617 – 623 .
  • Kotani , K . 1996 . ‘Behaviour of interfacial phases in diffusion bonding of commercial aluminium alloys by transmission electron microscopy’ . Trends Weld Res , 0 : 791 – 796 .
  • Kotani , K . 1996 . ‘Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 4). Interfacial phases formed during diffusion bonding of Al‐Mg binary alloys’ . Q J Jpn Weld Soc , 14 (3) : 551 – 562 .
  • Ikeuchi , K . 1996 . ‘TEM observations of interaction between oxide film and Ca during diffusion bonding of Al‐Ca alloys’ . Proc Conf Jpn Inst Light Met , 91 : 261 – 262 .
  • Kotani , K . 1996 . ‘Interfacial phases formed during diffusion bonding of Al‐Ca binary alloys. Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 6) . Proc Nat Conf Jpn Weld Soc , 59 : 258 – 259 .
  • Kotani , K . 1997 . ‘Interfacial phases formed during diffusion bonding of Al‐Li alloys. Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 7) . Proc Nat Conf Jpn Weld Soc , 60 : 168 – 169 .
  • Kotani , K . 1997 . ‘Oxides in interface of Al‐Li alloys. Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 8) . Proc Nat Conf Jpn Weld Soc , 61 : 236 – 237 .
  • Ikeuchi , K . 1997 . ‘Advances in welding technology ‐ towards new developments ‐ from macro to micro’ . Proc Nat Conf Jpn Weld Soc. ‘Materials science view of joining’ J Jpn Weld Soc , 66 (1) : 42 – 45 .
  • Kotani , K . 1997 . ‘Behaviour of interfacial oxide during diffusion bonding of aluminium alloys and its influence on joint strength’ . Trans JWRI , 26 (2) : 13 – 22 .
  • Song , F . 1997 . ‘Studies on SPF/DB technology of aluminiumlithium alloys’ . Mater Sci Forum , : 701 – 709 .
  • Debbouz , O and Navaie , F . 1997 . ‘Mechanical characterisation by dynamical tensile loading of 2017 aluminium alloy joints welded by diffusion bonding. New results and SEM observations of the failure surfaces’ . J Mater Sci , 32 (2) : 475 – 482 .
  • Church , S R . 1997 . ‘Surface modification of Al‐Li alloys for diffusion bonding’ . ATB Metall , 37 (2/4) : 338 – 343 .
  • Nakamura , Y . 1997 . ‘Recent trends in joining and composites. Recent study of deformation flow bonding’ . J Jpn Soc Technol Plast , 38 (441) : 888 – 890 .
  • Gratiot , E and Surdon , G . 1997 . ‘Industrial applications of superplastic forming with aluminium alloys’ . Mater Sci Forum , : 239 – 242 .
  • Kotani , K . 1997 . ‘Interfacial phases formed during diffusion bonding of Al‐X binary alloys (X = Mg, Si, Mn, Zn, Cu). Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 5) . Q J Jpn Weld Soc , 15 (2) : 352 – 358 .
  • Church , S R . 1997 . ‘Surface modification of Al‐Li alloys for diffusion bonding’ . ECASIA , 97 : 101 – 104 .
  • Shiyou , G . 1997 . ‘Investigation of SPF/DB processing of zincified alloy Ly11’ . Conf Proc 1st Int Non‐Ferr Process Technol Conf . 1997 . pp. 149 – 152 . (1997)
  • Kotani , K and Ikeuchi , K . 1998 . ‘Interfacial phases formed during diffusion bonding of pure Al and Al‐X binary alloys (X = Si, Zn, Cu) using Al‐Li binary alloy inserts. Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (Report 9) . Proc Nat Conf Jpn Weld Soc , 62 : 194 – 195 .
  • Kotani , K . 1998 . ‘Interfacial oxide in diffusion‐bonded joints of Al binary alloys by transmission electron microscopy’ . Trans JWRI , 27 (2) : 37 – 45 .
  • Hopper , M A and Bieler , T R . 1998 . ‘High‐rate superplastic forming and diffusion bonding’ . Superplast Superplast Form , : 305 – 312 .
  • Huang , Y . 1998 . ‘Diffusion bonding of hot‐rolled 7075 aluminium alloy’ . Mater Sci Technol , 14 (5) : 405 – 410 .
  • Kotani , K and Ikeuchi , K . 1998 . ‘Effect of Al‐Mg insert on oxides in diffusion bonding interface. Investigation of diffusion bonding mechanisms of Al alloys by transmission electron microscopy (10th report) . Proc Nat Conf Jpn Weld Soc , 63 : 380 – 381 .
  • Wu , H‐Y . 1998 . ‘Solid‐state bonding of iron‐based alloys, steel‐brass, and aluminium alloys’ . J Mater Process Technol , 75 (1/3) : 173 – 179 .
  • Zuruzi , A S . 1999 . ‘Diffusion bonding of aluminium alloy 6061 in air using an interface treatment technique’ . Mater Sci Eng A , A259 (1) : 145 – 148 .
  • Huang , Y . 1999 . ‘Diffusion bonding of superplastic 7075 aluminium alloy’ . Mater Sci Eng A , A266 (1/2) : 295 – 302 .
  • Zuruzi , A S . 1999 . ‘Effects of surface roughness on the diffusion bonding of Al alloy A6061 in air’ . Mater Sci Eng A , A270 (2) : 244 – 248 .
  • Kotani , K . 1999 . ‘Effect of oxide morphology on bond strength of diffusion‐bonded interfaces of Al alloys’ . Trans JWRI , 28 (2) : 27 – 37 .
  • Hayashi , T . 2000 . ‘Effect of interfacial sliding on diffusion bonding strength of aluminium alloy’ . Bull Tomakomai Spec Industrial College , 35 : 13 – 16 .

Diffusion bonding of Al/Fe and carbon steel

  • Fujii , Y . 1996 . ‘Bonding between Fe/Al using insert material and analysis of interfacial phenomena’ . Proc Conf Jpn Inst Light Met , 90 : 121 – 122 .
  • Fujimoto , M and Shibata , T . 1996 . ‘Measurements and evaluations in electrochemistry. Measurements and evaluations of corrosion and corrosion protection (3). Method for measurement of local corrosion (scanning oscillating electrode) . Denki Kagaku oyobi Kogyo Butsuri Kagaku (Jpn J Electrochemistry and Industrial Physical Chemistry) , 64 (9) : 967 – 991 .
  • Oyokawa , H . 1997 . ‘Formation and growth of intermetallic compounds in interface of diffusion‐bonded joints produced from Fe sheets/Al sheets’ . Tetsu to Hagane (J Iron Steel Inst Jpn) , 83 (10) : 641 – 646 .
  • Momono , M . 1997 . ‘Effects of base metal alloying elements on diffusion bonding ability of cast iron and aluminium’ . Proc Conf Jpn Inst Casting , 131 : 12
  • Fujimaki , H . 1998 . ‘Effects of base metal elements on reaction phase growth in diffusion bonding interface of ferrous metals and aluminium’ . Proc Nat Conf Jpn Weld Soc , 63 : 366 – 367 .
  • Momono , M . 1998 . ‘Effects of Si and Mg on diffusion bonding interface of ferrous metals and aluminium alloys’ . Proc Conf Jpn Inst Casting , 132 : 87

Diffusion bonding of Al/SUS

  • Ito , T . 1995 . ‘Diffusion bonding of Al‐Sn alloys and SUS in air’ . Proc Conf Jpn Inst Light Met , 89 : 65 – 66 .
  • Daglilar , S . 1995 . ‘Diffusion bonding of stainless steel with an Al‐Mg‐Sn alloy’ . Prakt Metallogr , 32 (10) : 496 – 505 .
  • Nishimoto , K . 1997 . ‘Microstructural analysis of diffusion bonds in Al/stainless steel. Study of diffusion bonding of Al/stainless steel (Report 1)’ . Proc Conf Jpn Inst Light Met , 61 : 292 – 293 .
  • Mano , I . 1997 . ‘Effects of bonding conditions on properties of Al/stainless steel diffusion‐bonded joints using insert metal’ . Proc Nat Conf Jpn Weld Soc , 61 : 294 – 295 .
  • Hwang , Y‐H . 1997 . ‘Effects of process parameters on properties of aluminium/stainless steel fibre metal matrix composites made by diffusion bonding’ . Mater Sci Technol , 13 (12) : 982 – 988 .
  • Bagnato , O R . 1998 . ‘Interface joint of AISI 316 and AlSi 12 by diffusion bonding’ . Electron Microsc , : 595 – 596 .
  • Nishimoto , K . 1998 . ‘Microstructural analysis of diffusion bonds in Al/stainless steel using insert metals. Study of diffusion bonding of Al/stainless steel (Report 2)’ . Proc Conf Jpn Inst Light Met , 63 : 374 – 375 .
  • Mano , I . 1998 . ‘Investigation of appropriate range of conditions for diffusion bonding of Al/stainless steel’ . Proc Conf Jpn Inst Light Met , 63 : 372 – 373 .
  • Nishimoto , K . 1999 . ‘Improvement of diffusion bonding by surface‐activation precoated insert metal. Study of diffusion bonding of Al/stainless steel (Report 3) . Proc Conf Jpn Inst Light Met , 64 : 192 – 193 .
  • Kuroda , S . 1999 . ‘Study of diffusion bonding of aluminium alloys and stainless steel (1). microstructure and properties of A6061/ SUS316 direct diffusion bond’ . Q J Jpn Weld Soc , 17 (3) : 484 – 489 .
  • Kuroda , S . 1999 . ‘Study of diffusion bonding of aluminium alloys and stainless steel (2). Improvement of diffusion bonding ability of A6061/SUS316 by Ag insert metal and its quantitative evaluation by numerical technique’ . Q J Jpn Weld Soc , 17 (4) : 519 – 525 .
  • Nishimoto , K . 2000 . ‘Study of diffusion bonding of Al/stainless steel (Report 4). Reaction between SUS and precoated insert metal in bond interface’ . Proc Conf Jpn Inst Light Met , 66 : 186 – 187 .
  • Nishimoto , K . 2000 . ‘Study of diffusion bonding of Al/stainless steel (Report 5). Reaction kinetics investigation of A6061 and Ag, Cu, Ni interfacial reaction layers’ . Proc Conf Jpn Inst Light Met , 66 : 188 – 189 .

Diffusion bonding of Al/Cu

  • Kawakatsu , I . 1976 . ‘Study of diffusion bonding of aluminium and copper’ . J Light Met Weld & Constr , 14 (9) : 415 – 420 .
  • Ito , T . 1996 . ‘Diffusion bonding of Cu‐Sn alloys and Al‐Sn alloys in air’ . Jpn J Wrought Copper Technol , 35 : 126 – 131 .
  • Celik , S . 1997 . ‘Diffusion bonding of pure copper and aluminium in argon gas atmosphere’ . Prakt Metallogr , 34 (8) : 417 – 429 .
  • Yamada , H . 1997 . ‘Identification of Cu‐Zn‐Al intermetallic compounds by inclined composition diffusion couples’ . Jpn J Wrought Copper Technol , 36 : 120 – 124 .
  • Kikuchi , S . 1998 . ‘Production of ultra‐laminates and their mechanical properties’ . Netsushori (Jpn J Heat Treatment) , 38 (2) : 75 – 79 .
  • Ito , T . 1999 . ‘Diffusion bonding of Cu‐SAl alloys and Al‐Sn alloys in air’ . Jpn J Wrought Copper Technol , 38 : 66 – 69 .
  • Debbouz , O and Navaie , F . 1999 . ‘Non‐destructive testing of A2017 copper alloy diffusion‐bonded joints by an automatic ultrasonic system’ . Mater Eval , 57 (12) : 1261 – 1267 .

Diffusion bonding of Al/Ti

  • Enjo , T . 1978 . ‘Effect of insert metal on diffusion bonding of aluminium and titanium’ . J Light Met Weld & Constr , 16 (3) : 107 – 114 .
  • Cam , G . 1995 . ‘Characterisation of diffusion‐bonded interface between Ti and Al’ . DVS Ber (Dtsch Verlag Schweisstech) , 166 : 233 – 238 .
  • Tsuchimoto , H . 1995 . ‘Investigation of interface reaction mechanism of Ti and Al’ . Proc Nat Conf Jpn Weld Soc , 57 : 484 – 485 .
  • Uenishi , K . 1995 . ‘Joining of intermetallic compound TiAl by using Al filler metal’ . Z Metallkd , 86 (4) : 270 – 274 .
  • Cam , G . 1996 . ‘Microstructure and fracture toughness aspects of diffusion‐bonded interface between Ti and Al’ . Trends Weld Res , : 569 – 578 .
  • Lee , T W . 1999 . ‘Growth behaviour of intermetallic compound layer in sandwich‐type Ti/Al diffusion couples inserted with Al‐Si‐Mg foil’ . J Mater Sci Lett , 18 (19) : 1599 – 1602 .
  • Thakur , A . 1999 . ‘Diffusion bonding of TiAl alloy with Al and Al/Ti/Al interlayers’ . Trends Weld Res , : 635 – 640 .

Diffusion bonding of Al/metal or other metals

  • Masumoto , H . 1993 . ‘Bonding of molybdenum and titanium’ . J Light Met Weld & Constr , 31 (5) : 203 – 208 .
  • Ito , T . 1995 . ‘Diffusion bonding of Al‐Sn alloys and cobalt in air’ . Proc Conf Jpn Inst Light Met , 89 : 67 – 68 .
  • Momono , M . 1996 . ‘Joining of dissimilar metals by diffusion bonding’ . Proc Symposium on Joining of Aluminium and Dissimilar Metals, Jpn Inst Light Met Welded Structures . 1996 . pp. 48 – 58 .
  • Ikeuchi , K . 1996 . ‘Solid‐state bonding of aluminium and dissimilar metals’ . J Jpn Inst Light Met , 46 (6) : 298 – 306 .
  • Mori , M . 1996 . ‘Au/Al solid‐state diffusion flip‐chip mounting technology’ . J Jpn Inst Electronic Information and Communications C‐2 , 78 (10) : 499 – 506 .
  • Bushby , R S . 1996 . ‘Joining molybdenum to aluminium by diffusion bonding’ . J Mater Sci , 31 (17) : 4545 – 4552 .
  • Iida , A . 1997 . ‘The development of repairable Au/Al solid phase diffusion flip‐chip bonding’ . Proc Electron Components Technol Conf , 47 : 101 – 107 .
  • Mori , M . “ ‘Study of bonding stabilisation by composition control of Au‐Al intermetallic compounds in Au/Al solid‐state diffusion flip‐chip mounting technology’ ” . In Jpn Inst Electrotechnology , Bull Electronic Circuit Research Committee 1997 ECT‐97 23–27 13 – 18 .
  • Yamada , H . 1997 . ‘Diffusion bonding of tungsten and Al‐Sn alloys in air’ . Proc Centenary Commemoration Conf Jpn Soc Mech Eng , : 78 – 79 .
  • Kanai , K . 1997 . ‘Diffusion bonding of niobium and Al‐Sn alloys in air’ . Proc Centenary Commemoration Conf Jpn Soc Mech Eng , : 80 – 81 .
  • Yamada , H . 1997 . ‘Diffusion bonding of Al‐Sn alloys and molybdenum in air’ . J Jpn Inst Light Met , : 279 – 284 .
  • Surzhenkov , G . 1997 . ‘Experience in industrial implementation of diffusion welding and brazing for the production of hard‐alloyed tools and electrotechnical devices’ . DVS Ber (Dtsch Verlag Schweisstech) , 184 : 198 – 200 .
  • Mori , M . 1998 . ‘Study of bonding stabilisation in Au‐Al solid‐state diffusion bonding’ . J Jpn Inst Electronic Information and Communications , J81‐C‐2 (7) : 628 – 636 .
  • Funagi , T . 1999 . ‘Diffusion behaviour in Au valve/Al electrode diffusion bonding interface’ . Proc Nat Conf Jpn Weld Soc , 65 : 320 – 321 .
  • Sueoka , H . 1999 . ‘Diffusion bonding of NiAl and stainless steel’ . Zairyo to Purosesu , 12 (2) : 23

Diffusion bonding of Al/composites

  • Tishkin , A P . 1995 . ‘Multiple fibre breaking in Al‐B composite by the relaxation redistribution of local stresses’ . Tech Phys Lett , 21 (8) : 587 – 588 .
  • Midling , O T and Grong , O . 1995 . ‘Joining of particle‐reinforced Al‐SiC MMCs’ . Key Eng Mater , : 355 – 371 . Part 1
  • Ryabov , V R . 1995 . ‘Welding of composite materials’ . Weld Surf Rev , 4 (2) : 1 – 191 . 193
  • Bushby , R S and Scott , V D . 1995 . ‘Joining of paniculate silicon carbide‐reinforced 2124 aluminium alloy by diffusion bonding’ . Mater Sci Technol , 11 (8) : 753 – 758 .
  • Bushby , R S and Scott , V D . 1995 . ‘Joining aluminium/Nicalon composite by diffusion bonding’ . Compos Eng , 5 (8) : 1028 – 1042 .
  • Urena , A . 1995 . ‘Diffusion bonding of discontinuously reinforced SiC/Al matrix composites: The role of interlayers’ . Key Eng Mater , : 523 – 529 . Part 2
  • Byrne , J G and Jung , K . 1995 . ‘Laminate of 60 vol% BeO/Be composite with A6061 Al alloy’ . Mater Sci Eng A , 199 (2) : L1 – L2 .
  • King , W E . 1995 . ‘X‐ray tomographic microscopy investigation of the ductile rupture of an Al foil bonded between sapphire blocks’ . Scr Metall Mater , 33 (12) : 1941 – 1946 .
  • Yao , B . 1995 . ‘Effect of high pressure on the multilayered Al/ Fe‐Mo‐Si‐B nanostructured composite at high pressure’ . China Sci Bull , 40 (12) : 1044 – 1048 .
  • Kagawa , T . 1995 . ‘Advances and future developments in new materials and processes — composites’ . Tetsu to Hagane (J Iron Steel Inst Jpn) , 81 (4) : 502 – 505 .
  • Ellis , M B D . 1996 . ‘Joining of aluminium‐based metal matrix composite’ . Int Mater Rev , 41 (2) : 41 – 58 .
  • Ryabov , V R . 1996 . ‘Study of weldability of the carbon‐aluminium composite’ . Inst Sampe Sympe Exhib , 41 (2) : 1113 – 1121 .
  • Li , H . 1996 . ‘Effect of low‐temperature treatment on residual stress state near interface in bonded SiC/A6061 compounds’ . Mater Sci Eng A , 221 (1/2) : 179 – 186 .
  • Hirose , A . 1996 . ‘Joining of composites (part 2). Joining of metal‐base composites’ . J Jpn Weld Soc , 65 (7) : 526 – 530 .
  • Yokota , T . 1996 . ‘Solid‐state bonding of SiCp/A6061 aluminium alloy composites and A6061 aluminium alloy’ . Proc Conf Jpn Inst Light Met , 90 : 119 – 120 .
  • Urena , A . 1996 . ‘Diffusion bonding of an an aluminium‐copper alloy reinforced with silicon carbide particles (A2014/ SiC/13p) using metallic interlayers’ . Sci Mater , 35 (11) : 1285 – 1293 .
  • Chang , S‐Y . 1997 . ‘Processing stainless steel fibre reinforced NiAl matrix composites by reactive hot pressing’ . J Mater Sci , 32 (19) : 5127 – 5135 .
  • Yokota , T . 1997 . ‘Solid‐phase welding of alloy AA6061 and SiCp reinforced alloy AA6061 at intermediate temperature’ . Mater Sci Forum , 242 : 225 – 230 .
  • Ellis , M B D . 1997 . ‘Joining of metal matrix composites ‐ A review’ . TWI J , 6 (1) : 67 – 128 .
  • Landi , E and Casagrande , A . 1997 . ‘Production and characterisation of Nicalon fibre/aluminium alloy composites . Prakt Metallogr , 34 (9) : 463 – 467 .
  • Lutfullin , R Ya and Kaibyshev , O A . 1997 . ‘Production and characterisation of Nicalon fibre/aluminium alloy composites’ . Prakt Metallogr , 34 (9) : 463 – 467 .
  • Xiong , B . 1997 . ‘Mechanical properties of Si3N4/metal diffusion welding tip’ . Trans Nonferrous Met Soc China , 7 (4) : 38 – 42 .
  • Zou , M . 1998 . ‘Diffusion welding of SiCp reinforced Al alloy matrix composites’ . DVS Ber (Dtsch Verlag Schweisstech) , 192 : 294 – 296 .
  • Barabanova , O A . 1998 . ‘Diffusion bonding of aluminium‐based composite material’ . DVS Ber (Dtsch Verlag Schweisstech) , 192 : 305 – 306 .
  • Howard , S J . 1998 . ‘Effect of interfacial adhesion on toughness of metal/ceramic laminates’ . Mater Sci Technol , 14 (6) : 535 – 541 .
  • Kawamoto , N . 1998 . ‘Study of composite production by diffusion bonding’ . Shinto Giho , 18 : 61 – 65 .
  • Shaw , M C . 1998 . ‘The effects of strength probabilistics on the fracture mode of ceramic/metal multilayers’ . Eng Fract Mech , 61 (1) : 49 – 74 .
  • Li , H . 1998 . ‘Thermal stress behaviour of diffusion‐bonded SiC/A6061 Al laminates during thermal cycling’ . J Mater Sci Technol , 15 (2) : 117 – 120 .
  • Lee , C S . 1999 . ‘Vacuum‐free diffusion bonding of aluminium metal matrix composite’ . J Mater Process Technol , 89 ( 90 ) : 326 – 330 .
  • Lee , C S . 1999 . ‘Simulation model for vacuum‐free diffusion bonding of aluminium metal matrix composite’ . J Mater Process Technol , 89 ( 90 ) : 344 – 349 .
  • Xhang , X‐P . 1999 . ‘Investigation of diffusion bonding characteristics of SiC paniculate‐reinforced aluminium metal matrix composite’ . Composites Part A , 30A (12) : 1415 – 1421 .
  • Zhao , M‐J . 1999 . ‘Effect of interlayer on properties of diffusion‐bonded joints of silicon carbide paniculate‐reinforced aluminium composites’ . J Mater Sci Lett , 18 (24) : 2005 – 2006 .
  • Liu , L . 1999 . ‘Diffusion bonding mechanism and microstruc‐ture of welded joints and aluminium matrix composite A1203p/6061’ . Trans Nonferrous Met Soc China , 9 (4) : 826 – 830 .
  • Urena‐Fernandes , A . 1999 . ‘Interfacial characterisation using transmission electron microscopy of the diffusion bonding of SiC whisker‐reinforced aluminium alloys’ . J Mater Res , 14 (3) : 811 – 816 .
  • Urena , A . 2000 . ‘Diffusion bonding of alumina‐reinforced 6061 alloy metal matrix composite using Al‐Li interlayer’ . Mater Sci Technol , 16 (1) : 103 – 109 .
  • Suganuma , K and Nakase , H . 1995 . ‘TEM observations of alumina/ aluminium interface’ . Proc Conf Jpn Inst Light Met Weld and Constr , 88 : 279 – 280 .
  • Suganuma , K . 1995 . ‘TEM observations of alumina/aluminium interface’ . J Jpn Inst Aluminium Res , 6 : 105 – 106 .
  • Kawamoto , N and Kurosawa , K . 1995 . ‘Diffusion bonding of ceramics and aluminium alloys’ . Bull Aichi Pref Industrial Technology Centre , 31 : 81 – 84 .
  • Li , H . 1996 . ‘X‐ray stress measurement and FEM analysis of residual stress distribution near interface in bonded ceramic metal compounds’ . Scr Mater , 34 (9) : 1503 – 1508 .
  • Mizuno , K . 1996 . ‘Joining of A12O3 and aluminium by hot pressing’ . Proc Conf Jpn Soc Mech Eng , 73 (Part 2) : 631 – 632 .
  • Suganuma , K . 1996 . ‘Joining of ceramics and metals’ . Fine Ceram Rep , 14 (10) : 262 – 270 .
  • Udo , R and Kohno , K . 1996 . ‘Microstructures and deteriorations on Al2O3/Al alloy joints’ . Mater Trans JIM , 37 (5) : 1127 – 1131 .
  • King , W E . 1997 . ‘X‐ray tomographic microscopy investigation of the ductile rupture of an Al foil bonded between sapphire blocks’ . Comput Model Mater Process , : 238 – 244 .
  • Urena , A . 1997 . ‘Influence of metal‐ceramic interfaces on the behaviour of metal matrix composites and their joints’ . Key Eng Mater , 127 ( 131 (Part 1) : 687 – 694 .
  • Kim , Y‐J . 1998 . ‘Strength mismatch effect on local stresses and its implication for structural assessments’ . Weld World , 41 (5) : 443 – 451 .
  • Liu , H . 1999 . ‘Interface structure and formation mechanism of diffusion‐bonded SiC/TiAl joint’ . J Mater Sci Lett , 18 (13) : 1011 – 1012 .
  • Lin , C‐T . 1999 . ‘Grain morphology, texture, and microhardness gradients in aluminium diffusion‐bonded to aluminium oxide’ . Acta Mater , 67 (2) : 501 – 515 .
  • Gaudette , F . 1999 . ‘The influence of solid‐state and liquid‐phase bonding on fatigue at Al/Al2O3 interfaces’ . Metall Mater Trans A , 30A (3A) : 763 – 769 .

Liquid‐phase diffusion bonding

  • Momono , M . 1995 . ‘TLP bonding of aluminium alloys’ . J Jpn Light Met Weld and Constr , 33 (8) : 367 – 372 .
  • Momono , M . 1995 . ‘Melting and solidification process in liquid‐phase diffusion bonding’ . Proc Conf Jpn Inst Casting , 126 : 17
  • Li , Z . 1995 . ‘Counteraction of particulate segregation during transient liquid phase of aluminium‐based MMC material’ . J Mater Sci , 30 (4) : 1075 – 1082 .
  • Shirzadi , A A and Wallach , E R . 1995 . ‘Isostatic transient liquid phase diffusion bonding of aluminium‐based metal matrix composite 8095/SiC . DVS Ber (Dtsch Verlag Schweisstech) , : 90 – 93 .
  • Bushby , R S and Scott , V D . 1995 . ‘Liquid‐phase bonding of aluminium and aluminium/Nicalon using the interlayers of CuAg alloy’ . Mater Sci Technol , 11 (7) : 643 – 649 .
  • Shirzadi , A A and Wallach , E R . 1996 . ‘The use of isostatic pressing to improve the strength of TLP diffusion bonds in aluminium‐based composites’ . Trends Weld Res , : 797 – 802 .
  • Endo , K . 1996 . ‘Effects of bonding parameters on migration of interface in liquid‐phase diffusion bonds’ . Proc Conf Jpn Inst Light Met , 91 : 259 – 260 .
  • Watanabe , T . 1996 . ‘Eutectic bonding of aluminium pipes and copper pipes’ . Proc Nat Conf Jpn Weld Soc , 59 : 154 – 155 .
  • Shirzadi , A A and Wallach , E R . 1997 . ‘New approaches for transient liquid phase diffusion bonding of aluminium‐based metal matrix composites’ . Mater Sci Technol , 13 (2) : 135 – 142 .
  • Momono , M . 1997 . ‘Melting process of TLP bonded aluminium alloy using copper foil insert’ . Proc Nat Conf Jpn Weld Soc , 61 : 302 – 303 .
  • Zhai , Y and North , T H . 1997 . ‘Transient liquid‐phase bonding of alumina and metal matrix composite based materials’ . J Mater Sci , 32 (6) : 1393 – 1397 .
  • Zhai , Y and North , T H . 1997 . ‘Counteracting paniculate segregation during transient liquid phase of MMC‐MMC and Al2O3‐MMC joints’ . J Mater Sci , 32 (21) : 5571 – 5575 .
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