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Welding International Volume 35, 2021 - Issue 1-3
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Research Article

Effect of isothermal ageing on the microstructure, shear behaviour and hardness of the Sn58Bi/SnAgCuBiNi/Cu solder joints

Jian Changa School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, China;b College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
,
Yang Liub College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, ChinaCorrespondence[email protected]
ORCID Iconhttps://orcid.org/0000-0002-4311-2198
ORCID Icon,
Hao Zhangc Department of Microelectronics, Delft University of Technology, Delft, The Netherlands
,
Min Zhoub College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
,
Xue Yuxiongb College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
,
Xianghua Zengb College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
,
Rongxing Caob College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
&
Penghui Chenb College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, China
 show all
Pages 3-11 | Received 16 Dec 2020, Accepted 09 Feb 2021, Published online: 03 Mar 2021

References

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