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Miscellany

Effects of wire deformation behaviour on bondability: Study of Cu wire stitch bonding (2nd Report)

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Pages 711-716 | Published online: 09 Dec 2009

References

  • Fujimoto , Manabe and Nakata . 1996 . ‘Effects of bonding conditions and surface state on bondability ‐ Study of Cu wire stitch bonding (1st Report)’ . Q J Jpn Weld Soc , 14 (1) : 168
  • Takahashi , Inoue and Shibamoto . 1993 . ‘Numerical analysis of wire hot‐pressure bonding process and bonding limits viewed from perspective of adhesion mechanism’ . Symposium on ‘Ultrafine bonding in microelectronics’ . 1993 . pp. 77 – 86 .
  • Winchell , V H and Berg , H M . 1978 . ‘Enhancing ultrasonic bond development’ . ECC , : 387 – 396 .

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