References
- Ilankoon I, Ghorbani Y, Chong MN, et al. E-waste in the international context - a review of trade flows, regulations, hazards, waste management strategies and technologies for value recovery. Waste Manage. 2018;82:258–275. https://doi.org/https://doi.org/10.1016/j.wasman.2018.10.018.
- Holgersson S, Steenari B-M, Björkman M, et al. Analysis of the metal content of small-size waste electric and electronic equipment (WEEE) printed circuit boards—part 1: Internet routers, mobile phones and smartphones. Resour Conserv Recycl. 2018;133:300–308. https://doi.org/https://doi.org/10.1016/j.resconrec.2017.02.011.
- Arshadi M, Yaghmaei S, Mousavi SM. Content evaluation of different waste PCBs to enhance basic metals recycling. Resour Conserv Recycl. 2018;139:298–306. https://doi.org/https://doi.org/10.1016/j.resconrec.2018.08.013.
- Ghosh B, Ghosh MK, Parhi P, et al. Waste printed circuit boards recycling: an extensive assessment of current status. J Clean Prod. 2015;94:5–19. https://doi.org/https://doi.org/10.1016/j.jclepro.2015.02.024.
- Li H, Eksteen J, Oraby E. Hydrometallurgical recovery of metals from waste printed circuit boards (WPCBs): current status and perspectives – a review. Resour Conserv Recycl. 2018;139:122–139. https://doi.org/https://doi.org/10.1016/j.resconrec.2018.08.007.
- Baniasadi M, Vakilchap F, Bahaloo-Horeh N, et al. Advances in bioleaching as a sustainable method for metal recovery from e-waste: A review. J Ind Eng Chem. 2019;76:75–90. https://doi.org/https://doi.org/10.1016/j.jiec.2019.03.047.
- Kaya M. Recovery of metals and nonmetals from electronic waste by physical and chemical recycling processes. Waste Manage. 2016;57:64–90. https://doi.org/https://doi.org/10.1016/j.wasman.2016.08.004.
- Cui J, Forssberg E. Mechanical recycling of waste electric and electronic equipment: a review. J Hazard Mater. 2003;99:243–263. https://doi.org/https://doi.org/10.1016/S0304-3894(03)00061-X.
- Hadi P, Xu M, Lin CS, et al. Waste printed circuit board recycling techniques and product utilization. J Hazard Mater. 2015;283:234–243. https://doi.org/https://doi.org/10.1016/j.jhazmat.2014.09.032.
- Liu F, Wan B, Wang F, et al. Effect of thermal shock process on the microstructure and peel resistance of single-sided copper clad laminates used in waste printed circuit boards. J Air Waste Manage Assoc. 2019;69:1490–1502. https://doi.org/https://doi.org/10.1080/10962247.2019.1674751.
- Guo C, Wang H, Liang W, et al. Liberation characteristic and physical separation of printed circuit board (PCB). Waste Manage. 2011;31:2161–2166. https://doi.org/https://doi.org/10.1016/j.wasman.2011.05.011.
- Havlik T, Orac D, Berwanger M, et al. The effect of mechanical–physical pretreatment on hydrometallurgical extraction of copper and tin in residue from printed circuit boards from used consumer equipment. Miner Eng. 2014;65:163–171. https://doi.org/https://doi.org/10.1016/j.mineng.2014.06.004.
- Koyanaka S, Endoh S, Ohya H. Effect of impact velocity control on selective grinding of waste printed circuit boards. Adv Powder Technol. 2006;17:113–126. https://doi.org/https://doi.org/10.1163/156855206775123467.
- Koyanaka S, Endoh S, Ohya H, et al. Particle shape of copper milled by swing-hammer-type impact mill. Powder Technol. 1997;90:135–140. https://doi.org/https://doi.org/10.1016/s0032-5910(96)03213-5.
- Verma HR, Singh KK, Basha SM. Effect of milling parameters on the concentration of copper content of hammer-milled waste PCBs: a case study. J Sustainable Metall. 2018;4:187–193. https://doi.org/https://doi.org/10.1007/s40831-018-0179-z.
- Yoo JM, Jeong J, Yoo K, et al. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill. Waste Manage. 2009;29:1132–1137. https://doi.org/https://doi.org/10.1016/j.wasman.2008.06.035.
- Suryanarayana C. Mechanical alloying and milling. Prog Mater Sci. 2001;46:1–184. doi: https://doi.org/10.1016/S0079-6425(99)00010-9
- Ren T, Yang S, Wu S, et al. High-energy ball milling enhancing the reactivity of microscale zero-valent aluminum toward the activation of persulfate and the degradation of trichloroethylene. Chem Eng J. 2019;374:100–111. https://doi.org/https://doi.org/10.1016/j.cej.2019.05.172.
- Liu B, Qin T, Lu X, et al. Morphology and phase structure of nanosized Co powders prepared by one-step reduction combined with high-energy ball milling. J Alloys Compd. 2019;800:490–497. https://doi.org/https://doi.org/10.1016/j.jallcom.2019.06.130.
- Fu Z, Chen W, Wen H, et al. Microstructure and strengthening mechanisms in an FCC structured single-phase nanocrystalline Co25Ni25Fe25Al7.5Cu17.5 high-entropy alloy. Acta Mater. 2016;107:59–71. https://doi.org/https://doi.org/10.1016/j.actamat.2016.01.050.
- Sarvar M, Salarirad MM, Shabani MA. Characterization and mechanical separation of metals from computer printed circuit boards (PCBs) based on mineral processing methods. Waste Manage. 2015;45:246–257. https://doi.org/https://doi.org/10.1016/j.wasman.2015.06.020.
- Nekouei RK, Pahlevani F, Rajarao R, et al. Two-step pre-processing enrichment of waste printed circuit boards: mechanical milling and physical separation. J Clean Prod. 2018;184:1113–1124. https://doi.org/https://doi.org/10.1016/j.jclepro.2018.02.250.
- Kumar V, Lee J-c, Jeong J, et al. Novel physical separation process for eco-friendly recycling of rare and valuable metals from end-of-life DVD-PCBs. Sep Purif Technol. 2013;111:145–154. https://doi.org/https://doi.org/10.1016/j.seppur.2013.03.039.
- Kumar V, Lee J-c, Jeong J, et al. Recycling of printed circuit boards (PCBs) to generate enriched rare metal concentrate. J Ind Eng Chem. 2015;21:805–813. https://doi.org/https://doi.org/10.1016/j.jiec.2014.04.016.
- Hossain R, Nekouei RK, Mansuri I, et al. Sustainable recovery of Cu and Sn from problematic global waste: exploring value from waste printed circuit boards. ACS Sustain Chem Eng. 2019;7:1006–1017. https://doi.org/https://doi.org/10.1021/acssuschemeng.8b04657.
- Ulman K, Maroufi S, Bhattacharyya S, et al. Thermal transformation of printed circuit boards at 500 °C for synthesis of a copper-based product. J Clean Prod. 2018;198:1485–1493. https://doi.org/https://doi.org/10.1016/j.jclepro.2018.07.140.