Publication Cover
Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 65, 2014 - Issue 2
474
Views
28
CrossRef citations to date
0
Altmetric
Original Articles

A Numerical Study of the Thermal Performance of Microchannel Heat Sinks with Multiple Length Bifurcation in Laminar Liquid Flow

, , , &
Pages 107-126 | Received 24 May 2013, Accepted 26 Jun 2013, Published online: 21 Oct 2013

REFERENCES

  • D. B. Tuckerman and R. F. W. Pease , High-Performance Heat Sinking for VLSI , Electron Device Letters, IEEE , vol. 2 , pp. 126 – 129 , 1981 .
  • P. S. Lee , S. V. Garimella , and D. Liu , Investigation of Heat Transfer in Rectangular Microchannels , Int. J. Heat and Mass Transfer , vol. 48 , pp. 1688 – 1704 , 2005 .
  • W. Qu and I. Mudawar , Experimental and Numerical Study of Pressure Drop and Heat Transfer in a Single-Phase Micro-Channel Heat Sink , Int. J. Heat and Mass Transfer , vol. 45 , pp. 2549 – 2565 , 2002 .
  • W. Qu , I. Mudawar , S. Lee , and S. T. Wereley , Experimental and Computational Investigation of Flow Development and Pressure Drop in a Rectangular Micro-Channel , ASME J. Electronic Packaging , vol. 128 , pp. 1 – 9 , 2006 .
  • W. Qu and I. Mudawar , Analysis of Three-Dimensional Heat Transfer in Microchannel Heat Sinks , Int. J. Heat and Mass Transfer , vol. 45 , pp. 3973 – 3985 , 2002 .
  • X. L. Xie , W. Q. Tao , and Y. L. He , Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink , ASME J. Electronic Packaging , vol. 129 , pp. 247 – 255 , 2007 .
  • X. L. Xie , Z. J. Liu , Y. L. He , and W. Q. Tao , Numerical Study of Laminar Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink , Appl. Therm. Eng. , vol. 29 , pp. 64 – 74 , 2009 .
  • C. H. Chen , Forced Convection Heat Transfer in Microchannel Heat Sinks , Int. J. Heat and Mass Transfer , vol. 50 , pp. 2182 – 2189 , 2007 .
  • H. Y. Wu and P. Cheng , An Experimental Study of Convective Heat Transfer in Silicon Microchannels with Different Surface Conditions , Int. J. Heat and Mass Transfer , vol. 46 , pp. 2547 – 2556 , 2003 .
  • R. M. Manglik , J. Zhang , and A. Muley , Low Reynolds Number Forced Convection in Three-Dimensional Wavy-Plate-Fin Compact Channels: Fin Density Effects, Int. J. Heat and Mass Transfer , vol. 48, pp. 1439–1449, 2005.
  • Y. Sui , C. J. Teo , P. S. Lee , Y. T. Chew , and C. Shu , Fluid Flow and Heat Transfer in Wavy Microchannels , Int. J. Heat and Mass Transfer , vol. 53 , pp. 2760 – 2772 , 2010 .
  • G. N. Xie , J. Liu , W. H. Zhang , and B. Sunden , Analysis of Flow, and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling , ASME J. Electronic Packaging , vol. 134 , paper no. 041010 , 2012 .
  • G. N. Xie , J. Liu , Y. Q. Liu , B. Sunden , and W. H. Zhang , Comparative Study of Thermal Performance of Longitudinal, and Transversal Wavy Microchannel Heat Sinks for Electronic Cooling , ASME J. Electronic Packaging , vol. 135 , paper no. 021008 , 2013 .
  • H. Wee , Q. Zhang , P. M. Ligrani , and S. Narasimhan , Numerical Predictions of Heat Transfer and Flow Characteristics of Heat Sinks with Ribbed and Dimpled Surfaces in Laminar Flow , Numer. Heat Transfer A , vol. 53 , pp. 1156 – 1175 , 2008 .
  • J. B. Lan , Y. H. Xie , and D. Zhang , Flow and Heat Transfer in Microchannels with Dimples, and Protrusions , ASME J. Heat Transfer , vol. 134 , pp. 021901 . 1 – 9 , 2012 .
  • K. Vafai and L. Zhu , Analysis of Two-Layered Microchannel Heat Sink Concept in Electronic Cooling , Int. J. Heat Mass Transfer , vol. 42 , pp. 2287 – 2297 , 1999 .
  • M. Levac , H. Soliman , and S. Ormiston , Three-Dimensional Analysis of Fluid Flow and Heat Transfer in Single and Two-Layered Microchannel Heat Sinks , Heat Mass Transfer , vol. 47 , pp. 1375 – 1383 , 2011 .
  • G. N. Xie , Y. Q. Liu , B. Sunden , and W. H. Zhang , Computational Study, and Optimization of Laminar Heat Transfer, and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling , ASME J. Therm. Sci. Eng. Applications , vol. 5 , paper no. 011004 , 2013 .
  • G. N. Xie , Z. Y. Chen , B. Sunden , and W. H. Zhang , Numerical Prediction of the Flow and Thermal Performance of Water-Cooled Single-Layer and Double-Layer Wavy Microchannel Heat Sinks , Numer. Heat Transfer A , vol. 63 , pp. 201 – 225 , 2013 .
  • G. N. Xie , Z. Y. Chen , B. Sunden , and W. H. Zhang , Comparative Study of Flow and Thermal Performance of Liquid-Cooling Parallel-Flow and Counter-Flow Double-Layer Wavy Microchannel Heat Sinks , Numer. Heat Transfer A , vol. 64 , pp. 30 – 55 , 2013 .
  • J. M. Khodadadi , T. M. Nguyen , and N. S. Vlachos , Laminar Forced Convective Heat Transfer in a Two-Dimensional 90° Bifurcation , Numer. Heat Transfer A , vol. 9 , pp. 677 – 695 , 1986 .
  • Y. Nakamura , W. Jia , and M. Yasuhara , Incompressible Flow Through Multiple Passages , Numer. Heat Transfer A , vol. 16 , pp. 451 – 465 , 1989 .
  • Y. T. Yang and T. Y. Tsai , Numerical Calculation of Turbulent Flow in a Planar Bifurcation with a Protruding Branching Duct , Numer. Heat Transfer A , vol. 34 , pp. 61 – 74 , 1998 .
  • W. Wechsatol , A. Bejan , and S. Lorente , Tree-Shaped Flow Architectures: Strategies for Increasing Optimization Speed and Accuracy , Numer. Heat Transfer, Part A , vol. 48 , pp. 731 – 744 , 2005 .
  • J. R. Zhang , Y. Jaluria , T. T. Zhang , and L. Jia , Combined Experimental and Numerical Study for Multiple Microchannel Heat Transfer System, Proc. of the 14th Int. Heat Transfer Conf., August 8–13, Washington, D.C., USA, Paper no. IHTC-22235, 2010 .
  • J. R. Zhang , P. T. Lin , and Y. Jaluria , Designs of Multiple Microchannel Heat Transfer Systems, Proc. of the ASME 2011 Int. Mechanical Eng. Congress & Exposition, November 11–17, 2011, Denver, Colorado, USA, Paper no. IMECE2011–62539 .
  • G. N. Xie , Z. Y. Chen , B. Sunden , and W. H. Zhang , Numerical Analysis of Flow and Thermal Performance of Liquid-Cooling Microchannel Heat Sinks with Bifurcation , Numer. Heat Transfer A , vol. 64 , pp. 902 – 919 , 2013 .

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.