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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 73, 2018 - Issue 7
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Original Articles

Effect of nanofluid on thermo hydraulic performance of double layer tapered microchannel heat sink used for electronic chip cooling

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Pages 429-445 | Received 15 Nov 2017, Accepted 27 Feb 2018, Published online: 29 Mar 2018

References

  • D. B. Tuckerman and R. F. W. Pease, “High-performance heat sinking for VLSI,” IEEE Electron Device Lett., vol. 2, pp. 126–129, 1981. DOI: 10.1109/edl.1981.25367.
  • T. M Adams, S. I. Abdel-Khalik, S. M. Jeter, and Z. H. Qureshis, “An experimental investigation of single-phase forced convection in microchannels,” Int. J. Heat Mass Transfer, vol. 41, pp. 851–857, 1997. DOI: 10.1016/s0017-9310(97)00180-4.
  • K. C Toh, X. Y. Chen, and J. C. Chai, “Numerical computation of fluid flow and heat transfer in microchannels,” Int. J. Heat Mass Transfer, vol. 45, pp. 5133–5141, 2002. DOI: 10.1016/s0017-9310(02)00223-5.
  • O. Mokrani, B. Bourouga, C. Castelain, and H. Peerhossaini, “Fluid flow and convective heat transfer in flat microchannels,” Int. J. Heat Mass Transfer, vol. 52, pp. 1337–1352, 2009. DOI: 10.1016/j.ijheatmasstransfer.2008.08.022.
  • J. Li, G. P. Peterson, and P. Cheng, “Three-dimensional analysis of heat transfer in a micro-heat sink with single phase flow,” Int. J. Heat Mass Transfer, vol. 47, pp. 4215–4231, 2004. DOI: 10.1016/j.ijheatmasstransfer.2004.04.018.
  • W. Qu and I. Mudawar, “Analysis of three-dimensional heat transfer in micro-channel heat sinks,” Int. J. Heat Mass Transfer, vol. 45, pp. 3973–3985, 2002. DOI: 10.1016/s0017-9310(02)00101-1.
  • W. Qu and I. Mudawar, “Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink,” Int. J. Heat Mass Transfer, vol. 45, pp. 2549–2565, 2002. DOI: 10.1016/s0017-9310(01)00337-4.
  • K. Vafai and L. Zhu, “Analysis of two layered micro channel heat sink concept in electronic cooling,” Int. J. Heat Mass Transfer, vol. 42, pp. 2287–2297, 1999. DOI: 10.1016/s0017-9310(98)00017-9.
  • D. Sharma, H. Garg, and P. P. Bajpai, “Performance comparison of single and double layer microchannel using liquid metal coolants: A numerical study,” ARME, vol. 1, no. 2, pp. 9–17, 2012.
  • S. L Beh, K. K. Tio, G. A. Quadir, and K. N. Seetharamu, “Fast transient solution of a two-layered counter-flow microchannel heat sink,” Int. J. Numer. Methods Heat Fluid Flow, vol. 19, pp. 595–616, 2009. DOI: 10.1108/09615530910963544.
  • C. Leng, X. Wang, and T. Wang, “An improved design of double-layered microchannel heat sink with truncated top channels,” Appl. Therm. Eng., vol. 79, pp. 54–62, 2015. DOI: 10.1016/j.applthermaleng.2015.01.015.
  • J. M Wu, J. Y. Zhao, and K. J. Tseng, “Parametric study on the performance of double-layered microchannels heat sink,” Energy Convers. Manage., vol. 80, pp. 550–560, 2014. DOI: 10.1016/j.enconman.2014.01.014.
  • X. Wei, Y. Joshi, and M. K. Patterson, “Experimental and numerical study of a stacked microchannel heat sink for liquid cooling of microelectronic devices,” J. Heat Transfer, vol. 129, pp. 1432–1444, 2007. DOI: 10.1115/1.2754781.
  • M. K. Patterson, X. Wei, Y. Joshi, and R. Prasher, “Numerical study of conjugate heat transfer in stacked microchannels,” IEEE Conference Publications, The Ninth Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (IEEE Cat. No.04CH37543), IEEE, Las Vegas, NV, USA, vol. 1, 2004, pp. 372–380.
  • A. K. M. M. Morshed and J. A. Khan, “Numerical analysis of single phase multi layered microchannel heat sink with inter-connects between vertical channels,” Proc. 14th Int. Heat Transf. Conf. Washington, DC, USA, vol. 6, 2010, pp. 133–140.
  • P. Skandakumaran, A. Ortega, T. Jamal-Eddine, and R. Vaidyanathan, “Multi-layered sic microchannel heat sinks-modeling and experiment,” IEEE Conference Publications, The Ninth Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (IEEE Cat. No.04CH37543), IEEE, Las Vegas, NV, USA, vol. 1, 2004, pp. 352–360.
  • M Hatami and D. D. Ganji, “Thermal and flow analysis of microchannel heat sink (MCHS) cooled by Cu–water nanofluid using porous media approach and least square method,” Energy Convers. Manage., vol. 78, pp. 347–358, 2004. DOI: 10.1016/j.enconman.2013.10.063.
  • C. J Ho, L. C. Wei, and Z. W. Li, “An experimental investigation of forced convective cooling performance of a microchannel heat sink with Al2O3/water nanofluid,” Appl. Therm. Eng., vol. 30, pp. 96–103, 2010. DOI: 10.1016/j.applthermaleng.2009.07.003.
  • S. M Peyghambarzadeh, S. H. Hashemabadi, A. R. Chabi, and M. Salimi, “Performance of water based CuO and Al2O3 nanofluids in a Cu–Be alloy heat sink with rectangular microchannels,” Energy Convers. Manage., vol. 86, pp. 28–38, 2014. DOI: 10.1016/j.enconman.2014.05.013.
  • T. Tsai and R. Chein, “Performance analysis of nanofluid-cooled microchannel heat sinks,” Int. J. Heat Fluid Flow, vol. 28, pp. 1013–1026, 2007. DOI: 10.1016/j.ijheatfluidflow.2007.01.007.
  • A. Sakanova, S. Yin, J. Zhao, J. M. Wu, and K. C. Leong, “Optimization and comparison of double-layer and double-side micro-channel heat sinks with nano fluid for power electronics cooling,” Appl. Therm. Eng., vol. 65, pp. 124–134, 2014. DOI: 10.1016/j.applthermaleng.2014.01.005.
  • H. E. Ahmed, M. I. Ahmed, I. M. F. Seder, and B. H. Salman, “Experimental investigation for sequential triangular double-layered microchannel heat sink with nano fluids,” Int. Commun. Heat Mass Transfer, vol. 77, pp. 104–115, 2016. DOI: 10.1016/j.icheatmasstransfer.2016.06.010.
  • T. Hung and W. Yan, “Enhancement of thermal performance in double-layered microchannel heat sink with nanofluids,” Int. J. Heat Mass Transfer, vol. 55, pp. 3225–3238, 2012. DOI: 10.1016/j.ijheatmasstransfer.2012.02.057.
  • B. Rajabifar, “Enhancement of the performance of a double layered microchannel heatsink using PCM slurry and nanofluid coolants,” Int. J. Heat Mass Transfer, vol. 88, pp. 627–635, 2015. DOI: 10.1016/j.ijheatmasstransfer.2015.05.007.
  • M. R. Gorji, O. Pourmehran, M. Hatami, and D. D. Ganji, “Statistical optimization of microchannel heat sink (MCHS) geometry cooled by different nanofluids using RSM analysis,” Eur. Phys. J. Plus, vol. 130, no. 2, pp. 22, 2015. DOI: 10.1140/epjp/i2015-15022-8.
  • X. Wang, B. An, L. Lin, and D. Lee, “Inverse geometric optimization for geometry of nano fluid-cooled microchannel heat sink,” Appl. Therm. Eng., vol. 55, pp. 87–94, 2013. DOI: 10.1016/j.applthermaleng.2013.03.010.
  • T. W. Ting, Y. M. Hung, and N. Guo, “Effects of streamwise conduction on thermal performance of nanofluid flow in microchannel heat sinks,” Energy Convers. Manage., vol. 78, pp. 14–23, 2014. DOI: 10.1016/j.enconman.2013.10.061.
  • Y. L. Zhai, G. D. Xia, X. F. Liu, and Y. F. Li, “Heat transfer enhancement of Al2O3-H2O nanofluids flowing through a micro heat sink with complex structure,” Int. Commun. Heat Mass Transfer, vol. 66, pp. 158–166, 2015. DOI: 10.1016/j.icheatmasstransfer.2015.05.025.
  • A. Sakanova, C. Chun, and J. Zhao, “Performance improvements of microchannel heat sink using wavy channel and nanofluids,” Int. J. Heat Mass Transfer, vol. 89, pp. 59–74, 2015. DOI: 10.1016/j.ijheatmasstransfer.2015.05.033.
  • G. Wang, D. Niu, F. Xie, Y. Wang, X. Zhao, and G. Ding, “Experimental and numerical investigation of a microchannel heat sink (MCHS) with micro-scale ribs and grooves for chip cooling,” Appl. Therm. Eng., vol. 85, pp. 61–70, 2015. DOI: 10.1016/j.applthermaleng.2015.04.009.
  • D. D. Ma, G. D. Xia, Y. F. Li, Y. T. Jia, and J. Wang, “Design study of micro heat sink configurations with offset zigzag channel for specific chips geometrics,” Energy Convers. Manage., vol. 127, pp. 160–169, 2016. DOI: 10.1016/j.enconman.2016.09.013.
  • D. Yang, Y. Wang, G. Ding, Z. Jin, J. Zhao, and G. Wang, “Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations,” Appl. Therm. Eng., vol. 112, pp. 1547–1556, 2017. DOI: 10.1016/j.applthermaleng.2016.08.211.
  • T. Hung, T. Sheu, and W. Yan, “Optimal thermal design of microchannel heat sinks with different geometric configurations,” Int. Commun. Heat Mass Transfer, vol. 39, pp. 1572–1577, 2015. DOI: 10.1016/j.icheatmasstransfer.2012.10.008.
  • M. Dehghan, M. Daneshipour, M. S. Valipour, R. Rafee, and S. Saedodin, “Enhancing heat transfer in microchannel heat sinks using converging flow passages,” Energy Convers. Manage., vol. 92, pp. 244–250, 2015. DOI: 10.1016/j.enconman.2014.12.063.
  • B. Osanloo, A. M. Amar, A. Solati, and M. Baghani, “Performance enhancement of the double-layered micro-channel heat sink by use of tapered channels,” Appl. Therm. Eng., vol. 102, pp. 1345–1354, 2016. DOI: 10.1016/j.applthermaleng.2016.04.073.
  • K. C. Wong and M. L. Ang, “Thermal hydraulic performance of a double-layer microchannel heat sink with channel contraction,” Int. Commun. Heat Mass Transfer, vol. 92, pp. 269–275, 2016. DOI: 10.1016/j.icheatmasstransfer.2016.09.013.
  • H. Herwig and S. P. Mahulikar, “Variable property effects in single-phase incompressible flows,” Int. J. Thermal Science, vol. 45, pp. 977–981, 2006. DOI: 10.1016/j.ijthermalsci.2006.01.002.
  • Z. Li, X. Huai, Y. Tao, and H. Chen, “Effects of thermal property variations on the liquid flow and heat transfer in microchannel heat sinks,” Appl. Therm. Eng., vol. 27, pp. 2803–2814, 2007. DOI: 10.1016/j.applthermaleng.2007.02.007.
  • L. Chai, G. Dong, and H. Sheng, “Numerical study of laminar flow and heat transfer in microchannel heat sink with offset ribs on sidewalls,” Appl. Therm. Eng., vol. 92, pp. 32–41, 2016. DOI: 10.1016/j.applthermaleng.2015.09.071.
  • J. Buongiorno, “Convective transport in nanofluids,” J. Heat Transfer, vol. 128, pp. 240–250, 2006. DOI: 10.1115/1.2150834.
  • M. Corcione, “Empirical correlating equations for predicting the effective thermal conductivity and dynamic viscosity of nanofluids,” Energy Convers. Manage., vol. 52, pp. 789–793, 2011. DOI: 10.1016/j.enconman.2010.06.072.
  • T. L. Bergman, A. S. Lavine, F. P. Incropera, and D. P. Dewitt, Fundamentals of Heat and Mass Transfer, 7th ed. New York: Wiley, 2011.
  • M. Raja, R. Vijayan, P. Dineshkumar, and M. Venkatesan, “Review on nano fluids characterization, heat transfer characteristics and applications,” Renewable Sustainable Energy Rev., vol. 64, pp. 163–173, 2016. DOI: 10.1016/j.rser.2016.05.079.

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