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Numerical Heat Transfer, Part B: Fundamentals
An International Journal of Computation and Methodology
Volume 29, 1996 - Issue 4
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Original Articles

ANALYSIS/FINITE-ELEMENT COMBINED METHODOLOGY ON TRANSIENT HEAT CONDUCTION OF A FINITE DOMAIN WITH PLANAR-DISCRETE SOURCES

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Pages 459-478 | Received 20 Sep 1995, Accepted 27 Nov 1995, Published online: 19 Apr 2007

References

  • G. N. Ellison , Thermal Computations for Electronic Equipment , pp. 322 – 367 , Van Nostrand–Reinhold , New York , 1984 .
  • D. J. Dean , Thermal Design of Electronic Circuit Boards and Packages , pp. 233 – 290 , Electrochemical Publications , Edinburgh , Scotland , 1985 .
  • Polo Antognetti , Giacomo R. , Bisio , Francesco Curatell , Sergio Palara , Three–Dimensional Transient Thermal Simulation Application to Delayed Short Circuit Protection in Power IC'S , IEEE J. Solid–State Circuits , vol. SC–15 , no. 3 , pp. 277 – 281 , June 1980 .
  • M. Lawrence Buller , Thermal Transients in Electronic Packages , IEEE Trans. Components, Hybrid, and Manufacturing Technol. , vol. CHMT–3 , no. 4 , pp. 588 – 594 , December 1980 .
  • Achilies G. Kokkas , Thermal Analysis of Multiple–Layer Structures , IEEE Trans. Electron Devices , vol. ED-21 , no. 11 , pp. 674 – 681 , November 1974 .
  • A. Skorek , A. J. Jordan , and V. Rajagopalan , Analysis of Transient State Temperature Distribution in the Thyristor Packaging , J. Electron. Packaging, Trans. ASME , vol. 113\325 , September 1991 .
  • V. Kadami and N. Abuaf , Numerical Thermal Analysis of Power Chip Packages , Heat Transfer in Electronic Equipment , HTD–Vol. 48 , pp. 77 – 84 , 1985 .
  • John C. Bruch , George Zyvoloski , Transient Two–Dimensional Heat Conduction Problem Solved by the Finite Element Method , Int. J. Numer. Meth. Eng. , vol. 8 , pp. 481 – 494 , 1974 .
  • J. Donea , On the Accuracy of Finite Element Solutions to the Transient Heat–Conduction Equation , Int. J. Numer. Meth. Eng. , vol. 8 , pp. 103 – 110 , 1974 .
  • Fred T. Wenthen , Computer–Aided Thermal Analysis of Power Semiconductor Devices , IEEE Trans. Electron Devices , Vol. Ed–17 , no. 9 , pp. 765 – 770 , September 1970 .
  • E. J. Pinto and B. B. Mikic , Temperature Prediction on Substrates and Integrated Circuit Chips , Heat Transfer in Electronic Equipment , HTD–Vol. 57 , pp. 199 – 207 , 1986 .
  • E. J. Pinto and B. B. Mikic , Methodology for Evaluation of Temperature and Stress Fields in Substrates and Integrated Circuit Chips , Heat Transfer in Electronic Equipment , HTD–Vol. 57 , pp. 209 – 217 , 1986 .
  • Horng-Wen Wu , Sheng-Hwa Shii , Analysis\Finite–Element Combined Methodology on Temperature Distribution of a Finite Domain with Various Heat Sources , Numer. Heat Transfer , Part B , vol. 25 , pp. 449 – 466 , 1994 .
  • M. Necati ouml;zisik , Boundary Value Problems of Heat Conduction , pp. 101 – 106 , International Textbook Company , Scranton , Pennsylvania , 1968 .
  • Erwin Kreyszing , Advanced Engineering Mathematics , 6th ed. , pp. 644 – 717 , John Wiley , New York , 1988 .
  • G. M. Philips and P. J. Taylor , Theory and Application of Numerical Analysis , Academic Press , New York , 1973 .
  • J. N. Reddy , An Introduction to the Finite Element Method , McGraw–Hill , New York , 1984 .
  • S. S. Rao , Finite Element Method in Engineering , pp. 418 – 450 , Pergamon Press , New York , 1982 .
  • J. V. Beck , K. D. Cole , A. Haji–Sheikh , and B. Litkouhi , Heat Conduction Using Green's Functions , pp. 473 – 510 , Hemisphere , Washington , DC , 1992 .

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