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Integrated Ferroelectrics
An International Journal
Volume 17, 1997 - Issue 1-4
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Device integration

Challenges for plasma etch integration of ferroelectric capacitors in FeRAM's and DRAM's

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Pages 395-402 | Published online: 19 Aug 2006

References

  • Taylor , T. C. and Harper , H. A. presented at Tegal 20th Annual Plasma Seminar Proceedings, San Francisco, Ca. (July, 1994) Chemically Assisted Etching of PZT-Based Ferroelectric Dielectric and Noble Metal Capacitor Electrodes
  • Nishioka , Y. , Shiozawa , K. , Oishi , T. , Kanamoto , K. , Tokuda , Y. , Sumitani , H. , Aya , S. , Yabe , H. , Itoga , K. , Hifumi , T. , Marumoto , K. , Kuroiwa , T. , Kawahara , T. , Nishikawa , K. , Oomori , T. , Fujino , T. , Yamamoto , S. , Uzawa , S. , Kimata , M. , Nunoshita , M. and Abe , H. IEDM 95-903, Giga-bit Scale DRAM Cell with New Simple Ru/(Ba, Sr)TiO3/Ru Stacked Capacitors Using X-ray Lithography

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