References
- Takagi , H , Ogawa , H Yamazaki , Y . 1990 . Appl. Phys. Lett. , 56 : 2379
- Murphy , CJ and Coffer , JL . 2002 . Appl. Spectrosc. , 56 : 16A
- Zhang , L and Xue , D . 2002 . J. Mater. Sci. Lett. , 21 : 1931
- Eng , LM . 1999 . Nanotechnology , 10 : 405
- Röthlisberger , U , Andreoni , W and Parrinello , M . 1994 . Phys. Rev. Lett. , 72 : 665
- Wu , Y , Chen , Q Takeguchi , M . 2000 . Surf. Sci. , 462 : 203
- Ho , K-M , Shvartsburg , AA Pan , B . 1998 . Nature , 392 : 582
- Minor , AM , Lilleodden , ET Jin , M . 2005 . Phil. Mag. , 85 : 323
- Ge , D , Minor , AM Stach , EA . 2006 . Phil. Mag. , 86 : 4069
- Haque , MA and Saif , MTA . 2002 . Expl Mech. , 42 : 123
- Tanner , DM , Smith , NF and Irwin , LW . 2000 . Tech. Report No. SAND2000-0091 , Sandia, NM : Sandia National Laboratory .
- Gryanznov , VG and Trusov , LI . 1993 . Prog. Mater. Sci. , 37 : 289
- Arzt , E . 1998 . Acta. Mater. , 46 : 5611
- Uchic , MD , Dimiduk , DM Florando , JN . 2004 . Science , 305 : 986
- Gerberich , WW , Mook , WM Perrey , CR . 2003 . J. Mech. Phys. Solids , 51 : 979
- Mook , WM , Jungk , JM Cordill , MJ . 2004 . Z. Metallkd. , 95 : 416
- Wall , MA and Dahmen , U . 1997 . Microsc. Microanal. , 3 ( Suppl. 3 ) : 593
- Rao , NP , Lee , HJ Kelkar , M . 1997 . NanoStruct. Mater. , 9 : 129
- Di Fonzo , F , Gidwani , A Fan , MH . 2000 . Appl. Phys. Lett. , 77 : 910
- Perrey , CR , Carter , CB Bentley , J . 2003 . Microsc. Microanal. , 9 ( Suppl. 2 ) : 412
- Perrey , CR and Carter , CB . 2006 . J. Mater. Sci. , 41 : 2711
- This value was measured from images taken using an FEI Tecnai G2 30 FEG TEM
- Williams , DB and Carter , CB . 1996 . Transmission Electron Microscopy , New York : Plenum Press .
- Thölén , AR and Yao , Y . 2003 . J. Colloid Interface Sci. , 286 : 362
- Thölén , AR . 2006 . J. Mater. Sci. , DOI 10.1007/S10853-006-0092-X
- Mook , WM , Perrey , CR Carter , CB . 2006 . Phys. Rev. B , submitted
- Yonenaga , I . 2005 . Mater. Trans. , 46 : 1979
- Maugis , D . 2000 . Contact, Adhesion and Rupture of Elastic Solids , New York : Springer .