A novel thermomechanical model for predicting interfacial stresses in flexible hybrid laminate

References

• S. Hwangbo, L. Hu, A.T. Hoang, J.Y. Choi, and J.-H. Ahn, Wafer-scale monolithic integration of full-colour micro-LED display using MoS2 transistor, Nat. Nanotechnol., vol. 17, no. 5, pp. 500–506, 2022. DOI: 10.1038/s41565-022-01102-7.
   PubMed Web of Science ®Google Scholar
• Y. Jia, J. Ning, J. Zhang, B. Wang, C. Yan, Y. Zeng, H. Wu, Y. Zhang, X. Shen, C. Zhang, H. Guo, D. Wang, and Y. Hao, High-quality transferred GaN-based light-emitting diodes through oxygen-assisted plasma patterning of graphene, ACS Appl. Mater. Interf., vol. 13, no. 27, pp. 32442–32449, 2021. DOI: 10.1021/acsami.1c04659.
   PubMed Web of Science ®Google Scholar
• Z. Zhang, W. Wang, Y. Jiang, Y.-X. Wang, Y. Wu, J.-C. Lai, S. Niu, C. Xu, C.-C. Shih, C. Wang, H. Yan, L. Galuska, N. Prine, H.-C. Wu, D. Zhong, G. Chen, N. Matsuhisa, Y. Zheng, Z. Yu, Y. Wang, R. Dauskardt, X. Gu, J. B. H. Tok, and Z. Bao, High-brightness all-polymer stretchable LED with charge-trapping dilution, Nature, vol. 603, no. 7902, pp. 624–630, 2022. DOI: 10.1038/s41586-022-04400-1.
   PubMed Web of Science ®Google Scholar
• H. Ding, G. Lv, Z. Shi, D. Cheng, Y. Xie, Y. Huang, L. Yin, J. Yang, Y. Wang, and X. Sheng, Optoelectronic sensing of biophysical and biochemical signals based on photon recycling of a micro-LED, Nano Res., vol. 14, no. 9, pp. 3208–3213, 2021. DOI: 10.1007/s12274-020-3254-2.
   Web of Science ®Google Scholar
• Y. Hao, S. Xiang, G. Han, J. Zhang, X. Ma, Z. Zhu, X. Guo, Y. Zhang, Y. Han, Z. Song, Y. Liu, L. Yang, H. Zhou, J. Shi, W. Zhang, M. Xu, W. Zhao, B. Pan, Y. Huang, Q. Liu, Y. Cai, J. Zhu, X. Ou, T. You, H. Wu, B. Gao, Z. Zhang, G. Guo, Y. Chen, Y. Liu, X. Chen, C. Xue, X. Wang, L. Zhao, X. Zou, L. Yan, and M. Li, Recent progress of integrated circuits and optoelectronic chips, Sci. Chin. Inform. Sci., vol. 64, pp. 2014, 2021. DOI: 10.1007/s11432-021-3235-7.
   Web of Science ®Google Scholar
• M. Silverå Ejneby, M. Jakešová, J. J. Ferrero, L. Migliaccio, I. Sahalianov, Z. Zhao, M. Berggren, D. Khodagholy, V. Đerek, J. N. Gelinas, and E. D. Głowacki, Chronic electrical stimulation of peripheral nerves via deep-red light transduced by an implanted organic photocapacitor, Nat. Biomed. Eng., vol. 6, no. 6, pp. 741–753, 2022. DOI: 10.1038/s41551-021-00817-7.
   Google Scholar
• W. Meng, F. Xu, Z. Yu, T. Tao, L. Shao, L. Liu, T. Li, K. Wen, J. Wang, L. He, L. Sun, W. Li, H. Ning, N. Dai, F. Qin, X. Tu, D. Pan, S. He, D. Li, Y. Zheng, Y. Lu, B. Liu, R. Zhang, Y. Shi, and X. Wang, Three-dimensional monolithic micro-LED display driven by atomically thin transistor matrix, Nat. Nanotechnol., vol. 16, no. 11, pp. 1231–1236, 2021. DOI: 10.1038/s41565-021-00966-5.
   PubMed Web of Science ®Google Scholar
• N. Yulianto, A. D. Refino, A. Syring, N. Majid, S. Mariana, P. Schnell, R. A. Wahyuono, K. Triyana, F. Meierhofer, W. Daum, F. F. Abdi, T. Voss, H. S. Wasisto, and A. Waag, Wafer-scale transfer route for top-down III-nitride nanowire LED arrays based on the femtosecond laser lift-off technique, Microsyst. Nanoeng., vol. 7, no. 1, pp. 32, 2021. DOI: 10.1038/s41378-021-00257-y.
   PubMed Web of Science ®Google Scholar
• M.K. Choi, J. Yang, T. Hyeon, and D.-H. Kim, Flexible quantum dot light-emitting diodes for next-generation displays, NPJ Flex Electron., vol. 2, no. 1, pp. 10, 2018. DOI: 10.1038/s41528-018-0023-3.
   Google Scholar
• Y. Jia, H. Guo, J. Ning, J. Zhang, D. Wang, B. Wang, H. Wu, X. Shen, C. Zhang, and Y. Hao, Flexible high-stability self-variable-voltage monolithic integrated system achieved by high-brightness LED for information transmission, Small., vol. 17, no. 45, pp. 2170238, 2021. DOI: 10.1002/smll.202170238.
   Web of Science ®Google Scholar
• X. Chen, Y. Yin, W. Yuan, S. Nie, Y. Lin, W. Guo, W. Su, Y. Li, K. Yang, and Z. Cui, Transparent thermotherapeutic skin patch based on highly conductive and stretchable copper mesh heater, Adv. Electron. Mater., vol. 7, no. 12, pp. 2100611, 2021. DOI: 10.1002/aelm.202100611.
   Web of Science ®Google Scholar
• H. Li, Y. Ma, Z. Liang, Z. Wang, Y. Cao, Y. Xu, H. Zhou, B. Lu, Y. Chen, Z. Han, S. Cai, and X. Feng, Wearable skin-like optoelectronic systems with suppression of motion artifacts for cuff-less continuous blood pressure monitor, Nat. Sci. Rev., vol. 7, no. 5, pp. 849–862, 2020. DOI: 10.1093/nsr/nwaa022.
   PubMed Web of Science ®Google Scholar
• X. Liu, Y. Wei, and Y. Qiu, Advanced flexible skin-like pressure and strain sensors for human health monitoring, Micromachines (Basel)., vol. 12, no. 6, pp. 695, 2021. DOI: 10.3390/mi12060695.
   PubMed Web of Science ®Google Scholar
• Y. Ma, Y. Zhang, S. Cai, Z. Han, X. Liu, F. Wang, Y. Cao, Z. Wang, H. Li, Y. Chen, and X. Feng, Flexible hybrid electronics for digital healthcare, Adv. Mater., vol. 32, no. 15, pp. 1902062, 2020. DOI: 10.1002/adma.201902062.
   Web of Science ®Google Scholar
• J. Deng, H. Yuk, J. Wu, C. E. Varela, X. Chen, E. T. Roche, C. F. Guo, and X. Zhao, Electrical bioadhesive interface for bioelectronics, Nat. Mater., vol. 20, no. 2, pp. 229–236, 2021. DOI: 10.1038/s41563-020-00814-2.
   PubMed Web of Science ®Google Scholar
• Y. Huang, N. Zheng, Z. Cheng, Y. Chen, B. Lu, T. Xie, and X. Feng, Direct laser writing-based programmable transfer printing via bioinspired shape memory reversible adhesive, ACS Appl. Mater. Interf., vol. 8, no. 51, pp. 35628–35633, 2016. DOI: 10.1021/acsami.6b11696.
   PubMed Web of Science ®Google Scholar
• R. Mikkonen, P. Puistola, I. Jonkkari, and M. Mantysalo, Inkjet printable polydimethylsiloxane for all-inkjet-printed multilayered soft electrical applications, ACS Appl. Mater. Interf., vol. 12, no. 10, pp. 11990–11997, 2020. DOI: 10.1021/acsami.9b19632.
   PubMed Web of Science ®Google Scholar
• R. Luo, H. Li, B. Du, S. Zhou, and Y. Zhu, A simple strategy for high stretchable, flexible and conductive polymer films based on PEDOT: PSS-PDMS blends, Org. Electron., vol. 76, pp. 105451, 2020. DOI: 10.1016/j.orgel.2019.105451.
   Web of Science ®Google Scholar
• Y. Liu, X. Wang, Y. Xu, Z. Xue, Y. Zhang, X. Ning, X. Cheng, Y. Xue, D. Lu, Q. Zhang, F. Zhang, J. Liu, X. Guo, K.-C. Hwang, Y. Huang, J. A. Rogers, and Y. Zhang, Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling, Proc. Natl. Acad. Sci. USA., vol. 116, no. 31, pp. 15368–15377, 2019. DOI: 10.1073/pnas.1907732116.
   PubMed Web of Science ®Google Scholar
• MIL-PRF-38534-2019 Hybrid Microcircuits, General Specification for REVISION L. United States Department of Defense, Dec. 3, 2019.
   Google Scholar
• EHAOAN Inc, “The classification of electronic components, from the working temperature to divide the device level”, EHAOAN Inc, Guangzhou, China. [Online]. Available: https://www.ehaoan.com/news/question/621.html. Accessed: Aug. 4, 2023.
   Google Scholar
• GB/T 12085.2-2022, Optics and photonics-Environmental test methods—Part 2: cold, heat and humidity. National Standardization Technical Committee, China, 2022.
   Google Scholar
• GB/T 2423.63-2019, Environmental testing—Part 2: test methods—Test: combined temperature(cold and heat)/low air pressure/vibration (mixed mode). National Standardization Technical Committee, China, 2019.
   Google Scholar
• E. Carrera, M. Cinefra, M. Petrolo, and E. Zappino, Finite Element Analysis of Structures through Unified Formulation, John Wiley & Sons, Chichester, 2014. DOI: 10.1002/9781118536643.
   Google Scholar
• E. Carrera, A. G. de Miguel, M. Filippi, I. Kaleel, A. Pagani, M. Petrolo, and E. Zappino, Global-local plug-in for high-fidelity composite stress analysis in ABAQUS, Mech. Adv. Mater. Struct., vol. 28, no. 14, pp. 1445–1450, 2021. DOI: 10.1080/15376494.2019.1676938.
   Web of Science ®Google Scholar
• E. Carrera, and V.V. Zozulya, Carrera unified formulation (CUF) for the composite shells of revolution. Equivalent single layer models, Mech. Adv. Mater. Struct., pp. 1–23, 2023. DOI: 10.1080/15376494.2023.2218380.
   Web of Science ®Google Scholar
• J.L. Mantari, J. Yarasca, M. Petrolo, and E. Carrera, On the effects of trigonometric and exponential terms on the best theory diagrams for metallic, multilayered, and functionally graded plates, Mech. Adv. Mater. Struct., vol. 27, no. 5, pp. 426–440, 2020. DOI: 10.1080/15376494.2018.1478048.
   Web of Science ®Google Scholar
• A.G. de Miguel, A. Pagani, L. Rizzo, A. Catapano, and E. Panettieri, Accurate evaluation of 3D stress fields in adhesive bonded joints via higher-order FE models, Mech. Adv. Mater. Struct., vol. 27, no. 4, pp. 333–345, 2020. DOI: 10.1080/15376494.2018.1472352.
   Web of Science ®Google Scholar
• S. E. Stapleton, B. Stier, S. Jones, A. Bergan, I. Kaleel, M. Petrolo, E. Carrera, and B. A. Bednarcyk, A critical assessment of design tools for stress analysis of adhesively bonded double lap joints, Mech. Adv. Mater. Struct., vol. 28, no. 8, pp. 791–811, 2021. DOI: 10.1080/15376494.2019.1600768.
   Web of Science ®Google Scholar
• A.L. Moore, and L. Shi, Emerging challenges and materials for thermal management of electronics, Mater. Today., vol. 17, no. 4, pp. 163–174, 2014. DOI: 10.1016/j.mattod.2014.04.003.
   Web of Science ®Google Scholar
• H. H. Jung, J. Song, S. Nie, H. N. Jung, M. S. Kim, J.-W. Jeong, Y. M. Song, J. Song, and K.-I. Jang, Thin metallic heat sink for interfacial thermal management in biointegrated optoelectronic devices, Adv. Mater. Technol., vol. 3, no. 11, pp. 1800159, 2018. DOI: 10.1002/admt.201800159.
   Web of Science ®Google Scholar
• Y. Li, J. Zhang, Y. Xing, and J. Song, Thermomechanical analysis of epidermal electronic devices integrated with human skin, J. Appl. Mech-T ASME., vol. 84, no. 11, pp. 1004, 2017. DOI: 10.1115/1.4037704.
   Web of Science ®Google Scholar
• Z. Zhao, Y. Li, S. Dong, Y. Cui, and Z. Dai, An analytic model for transient heat conduction in bi-layered structures with flexible serpentine heaters, Appl. Math. Mech.-Engl. Ed., vol. 42, no. 9, pp. 1279–1296, 2021. DOI: 10.1007/s10483-021-2765-9.
   Google Scholar
• E. Carrera, M. Cinefra, and F.A. Fazzolari, Some results on thermal stress of layered plates and shells by using unified formulation, J. Therm. Stresses., vol. 36, no. 6, pp. 589–625, 2013. DOI: 10.1080/01495739.2013.784122.
   Web of Science ®Google Scholar
• P. Raghu, A. Rajagopal, and J.N. Reddy, Nonlocal transient dynamic analysis of laminated composite plates, Mech. Adv. Mater. Struct., vol. 27, no. 13, pp. 1076–1084, 2020. DOI: 10.1080/15376494.2020.1718810.
   Web of Science ®Google Scholar
• M. Farrokh, M. Afzali, and E. Carrera, Mechanical and thermal buckling loads of rectangular FG plates by using higher-order unified formulation, Mech. Adv. Mater. Struct., vol. 28, no. 6, pp. 608–617, 2021. DOI: 10.1080/15376494.2019.1578014.
   Web of Science ®Google Scholar
• C. Wenzel, M. D’Ottavio, O. Polit, and P. Vidal, Assessment of free-edge singularities in composite laminates using higher-order plate elements, Mech. Adv. Mater. Struct., vol. 23, no. 9, pp. 948–959, 2016. DOI: 10.1080/15376494.2015.1121526.
   Web of Science ®Google Scholar
• C. Jiang, L. Xiang, S. Miao, L. Shi, D. Xie, J. Yan, Z. Zheng, X. Zhang, and Y. Tang, Flexible interface design for stress regulation of a silicon anode toward highly stable dual-ion batteries, Adv. Mater., vol. 32, no. 17, pp. e1908470, 2020. DOI: 10.1002/adma.201908470.
   PubMed Web of Science ®Google Scholar
• Y. Chen, R. Jamshidi, W. Hong, and M. Reza. Interfacial stress in physically transient layered structures: an experimental and analytical approach, Adv. Mater. Interf., vol. 4, no. 7, pp. 1601076, 2017. DOI: 10.1002/admi.201601076.
   Web of Science ®Google Scholar
• J. Wu, H. Yuan, and L. Li, Effect of viscoelasticity on interfacial stress transfer mechanism in the biocomposites: a theoretical study of viscoelastic shear lag model, Compos. Part B-Eng., vol. 164, pp. 297–308, 2019. DOI: 10.1016/j.compositesb.2018.11.086.
   Web of Science ®Google Scholar
• X. Liu, Y. Qiu, Y. Wei, and R. Yan, A novel thermal-mechanical model and the characteristics of interfacial stress in the laminated structure for flexible electronics, J. Phys. D: Appl. Phys., vol. 55, no. 7, pp. 074004, 2022. DOI: 10.1088/1361-6463/ac30b9.
   Web of Science ®Google Scholar
• W. G. Mao, Y. Y. Chen, Y. J. Wang, M. Zhou, H. Y. Yang, Z. Wang, C. Y. Dai, X. Chen, and D. N. Fang, A multilayer structure shear lag model applied in the tensile fracture characteristics of supersonic plasma sprayed thermal barrier coating systems based on digital image correlation, Surf. Coat. Tech., vol. 350, pp. 211–226, 2018. DOI: 10.1016/j.surfcoat.2018.07.013.
   Web of Science ®Google Scholar
• Y. Liu, B.L. Wang, and K.F. Wang, Mechanical model for the interfacial thermal stress in porous ceramic foam coatings bonded to a substrate, Mech, Adv. Mater. Struct., vol. 27, no. 12, pp. 941–947, 2020. DOI: 10.1080/15376494.2018.1501835.
   Web of Science ®Google Scholar
• H.S. Shen, J.N. Reddy, and Y. Yu, Postbuckling of doubly curved FG-GRC laminated panels subjected to lateral pressure in thermal environments, Mech. Adv. Mater. Struct., vol. 28, no. 3, pp. 260–270, 2021. DOI: 10.1080/15376494.2018.155682.
   Web of Science ®Google Scholar
• B. Wu, A. Pagani, W.Q. Chen, and E. Carrera, Geometrically nonlinear refined shell theories by Carrera Unified Formulation, Mech. Adv. Mater. Struct., vol. 28, no. 16, pp. 1721–1741, 2021. DOI: 10.1080/15376494.2019.1702237.
   Web of Science ®Google Scholar
• Z. Yang, Z.C. Zhang, C.B. Liu, C.F. Gao, W.Q. Chen, and C.L. Zhang, Analysis of a hollow piezoelectric semiconductor composite cylinder under a thermal loading, Mech. Adv. Mater. Struct., vol. 30, no. 10, pp. 2037–2046, 2023. DOI: 10.1080/15376494.2022.2048424.
   Web of Science ®Google Scholar
• Jin-Woo Park, Seung-Ho Lee, and Chan-Woo Yang, Investigation of the interfacial adhesion of the transparent conductive oxide films to large-area flexible polymer substrates using laser-induced thermo-mechanical stresses, J. Appl. Phys., vol. 114, no. 6, pp. 063513, 2013. DOI: 10.1063/1.4818310.
   Web of Science ®Google Scholar
• Y. Yin, Y. Cui, Y. Li, Y. Xing, and M. Li, Thermal management of flexible wearable electronic devices integrated with human skin considering clothing effect, Appl. Therm. Eng., vol. 144, pp. 504–511, 2018. DOI: 10.1016/j.applthermaleng.2018.08.088.
   Web of Science ®Google Scholar
• Y. Cui, Y. Li, Y. Xing, Q. Ji, and J. Song, Thermal design of rectangular microscale inorganic light-emitting diodes, Appl. Therm. Eng., vol. 122, pp. 653–660, 2017. DOI: 10.1016/j.applthermaleng.2017.05.020.
   Web of Science ®Google Scholar
• Z. Guo, Z. Wu, H. Wang, H. Tian, L. Liu, Z. Peng, H. Li, and Q. Wang, Experimental and numerical study on formation of interface separation and interfacial dielectric strength of GIL insulator, IEEE Trans. Dielect. Electr. Insul., vol. 26, no. 6, pp. 1738–1746, 2019. DOI: 10.1109/TDEI.2019.008060.
   Web of Science ®Google Scholar
• W.E.R. Krieger, S. Raghavan, and S.K. Sitaraman, Experiments for obtaining cohesive-zone parameters for copper-mold compound interfacial delamination, IEEE Trans. Compon., Packag. Manufact. Technol., vol. 6, no. 9, pp. 1389–1398, 2016. DOI: 10.1109/TCPMT.2016.2589223.
   Web of Science ®Google Scholar
• L. Zhu, and X. Chen, Delamination-based measurement and prediction of the adhesion energy of thin film/substrate interfaces, J. Eng. Mater-T ASME., vol. 139, no. 2, pp. 021021, 2017. DOI: 10.1115/1.4035497.
   Web of Science ®Google Scholar
• W.F. Schmidt, Mechanical Design Considerations: Advanced Electronic Packaging, Wiley, Hoboken, 2006.
   Google Scholar
• Y. Qiu, X. Qiu, X. Guo, D. Wang, and L. Sun, Thermal analysis of Si/GaAs bonding wafers and mitigation strategies of the bonding stresses, Adv. Mater. Sci. Eng., vol. 2017, pp. 1–8, 2017. DOI: 10.1155/2017/4903924.
   Web of Science ®Google Scholar
• K. Wang, Y. Huang, A. Chandra, and K. X. Hu, Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies, IEEE Trans. Comp. Packag. Technol., vol. 23, no. 2, pp. 309–316, 2000. DOI: 10.1109/6144.846769.
   Google Scholar
• E. Suhir, Stresses in bi-metal thermostats, J. Appl. Mech., vol. 53, no. 3, pp. 657–660, 1986. DOI: 10.1115/1.3171827.
   Web of Science ®Google Scholar
• E. Suhir, Bi-material assembly subjected to thermal stress: propensity to delamination assessed using interfacial compliance model, J Mater Sci: Mater Electron., vol. 27, no. 7, pp. 6779–6785, 2016. DOI: 10.1007/s10854-016-4628-9.
   Web of Science ®Google Scholar
• E. Suhir, Bonded tri-material specimen subjected to shear-off testing: predicted interfacial stresses, J. Aerosp. Eng. Mech., vol. 4, no. 1, pp. 201–205, 2020. DOI: 10.36959/422/441.
   Google Scholar
• E. Suhir, Analytical thermal stress modeling in electronics and photonics engineering: application of the concept of interfacial compliance, J. Therm. Stresses., vol. 42, no. 1, pp. 29–48, 2019. DOI: 10.1080/01495739.2018.1525331.
   Web of Science ®Google Scholar
• E. Suhir, Calculated thermally induced stresses in adhesively bonded and soldered assemblies, International Symposium on Microelectronics, ISHM, Atlanta, Georgia, 1986.
   Google Scholar
• H. Cheng, J. Wu, M. Li, D. H. Kim, Y. S. Kim, Y. Huang, Z. Kang, K. C. Hwang, and J. A. Rogers, An analytical model of strain isolation for stretchable and flexible electronics, Appl. Phys. Lett., vol. 98, no. 6, pp. 061902, 2011. DOI: 10.1063/1.3553020.
   Web of Science ®Google Scholar
• S.I. Park, J.H. Ahn, X. Feng, S. Wang, Y. Huang, and J.A. Rogers, Theoretical and experimental studies of bending of inorganic electronic materials on plastic substrates, Adv. Funct. Mater., vol. 18, no. 18, pp. 2673–2684, 2008. DOI: 10.1002/adfm.200800306.
   Web of Science ®Google Scholar
• J. Wu, M. Li, W.-Q. Chen, D.-H. Kim, Y.-S. Kim, Y.-G. Huang, K.-C. Hwang, Z. Kang, and J. A. Rogers, A strain-isolation design for stretchable electronics, Acta Mech. Sin., vol. 26, no. 6, pp. 881–888, 2010. DOI: 10.1007/s10409-010-0384-x.
   Web of Science ®Google Scholar
• X.F. Wu and R.A. Jenson, Stress-function variational method for stress analysis of bonded joints under mechanical and thermal loads, Int. J. Eng. Sci., vol. 49, no. 3, pp. 279–294, 2011. DOI: 10.1016/j.ijengsci.2010.11.005.
   Web of Science ®Google Scholar
• A.I. Lurie and A. Belyaev, Saint-Venant’s problem. In: Theory of Elasticity, A. I. Lurie, A. Belyaev, Eds., Springer Berlin Heidelberg, Berlin, 2005. DOI: 10.1007/978-3-540-26455-2.
   Google Scholar
• M. Bı^rsan, Saint-Venant’s problem. In: Encyclopedia of Thermal Stresses, R. B. Hetnarski, Ed., Springer, Dordrecht, 2013. DOI: 10.1007/978-94-007-2739-7.
   Google Scholar