References
- Kim, S.Y., Paek, J.W., & Kang, B.H. (2000). J. Heat Transfer, 122, 572.
- Wanga, S., Cheng, S., Yu, H., Rao, Z., & Liu, Z. (2013). Exp. Therm. Fluid Sci., 51, 264.
- Chang, C.H., Jeng, M.C., Su, C.Y., & Chang, C.L. (2009). Thin Solid Films, 517, 5265.
- Zemanova, M., Chovancova, M., Fellner, P., & Prekopp, K. (1998). Chem. Papers, 52, 152.
- Thieme, M. & Worch, H. (2006). J. Solid State Electrochem., 10, 737.
- He, T., Wang, Y., Zhang, Y., Iv, Q., Xu, T., & Liu, T. (2009). Corros. Sci., 51, 1757.
- Mutalib, A., Losic, D., & Voelcker, N.H. (2013). Prog. Mater. Sci., 58, 636.
- Kim, S., Kwon, C.S., Oh, Y.S., Lee, S.M., & Kim, H.T. (2012). J. Kor. Powd. Met. Inst., 19, 379.