Review on Heat and Fluid Flow in Micro Pin Fin Heat Sinks under Single-phase and Two-phase Flow Conditions

References

• J. M. Koo, S. Im, L. Jiang, and K. E. Goodson, “Integrated microchannel cooling for three-dimensional electronic circuit architectures,” J. Heat Transfer, vol. 127, no. 1, pp. 49–58, 2005. DOI: 10.1115/1.1839582.
   Web of Science ®Google Scholar
• C. Kleinstreuer, J. Li, and J. Koo, “Microfluidics of nano-drug delivery,” Int. J. Heat Mass. Transfer, vol. 51, no. 23–24, pp. 5590–5597, 2008. DOI: 10.1016/j.ijheatmasstransfer.2008.04.043.
   Web of Science ®Google Scholar
• D. B. Tuckerman and R. F. W. Pease, “High-performance heat sinking for VLSI,” IEEE Electron Device Lett., vol. 2, no. 5, pp. 126–129, 1981. DOI: 10.1109/EDL.1981.25367.
   Web of Science ®Google Scholar
• D. B. Tuckerman, Heat-Transfer Microstructures for Integrated Circuits. Livermore: UC, 1984.
   Google Scholar
• G. M. Harpole and J. E. Eninger, “Micro-channel heat exchanger optimization,” Proc. Seventh IEEE Semicond. Therm. Meas. Manage. Symp. 12-14 February 1991, Locarşon, Phoenix, Arizona, USA, 1991, pp. 59–63.
   Google Scholar
• S. J. Kim and D. Kim, “Forced convection in microstructures for electronic equipment cooling,” J. Heat Transfer, vol. 121, no. 8, pp. 639–645, 1999. DOI: 10.1115/1.2826027.
   Google Scholar
• F. C. Chou, J. R. Lukes, and C. L. Tien, “Heat transfer enhancement by fins in the microscale regime,” J. Heat Transfer, vol. 121, no. 11, pp. 972–977, 1999. DOI: 10.1115/1.2826088.
   Google Scholar
• S. G. Kandlikar and A. V. Bapat, “Evaluation of jet impingement, spray and microchannel chip cooling options for high heat flux removal,” Heat Transf. Eng., vol. 28, no. 11, pp. 911–923, 2007. DOI: 10.1080/01457630701421703.
   Web of Science ®Google Scholar
• S. Ndao, Y. Peles, and M. K. Jensen, “Multi-objective thermal design optimization and comparative analysis of electronics cooling technologies,” Int. J. Heat Mass. Transfer, vol. 52, no. 19–20, pp. 4317–4326, 2009. DOI: 10.1016/j.ijheatmasstransfer.2009.03.069.
   Web of Science ®Google Scholar
• J. F. Tullius, R. Vajtai, and Y. Bayazitoglu, “A review of cooling in microchannels,” Heat Transf. Eng., vol. 32, no. 7–8, pp. 527–541, 2011. DOI: 10.1080/01457632.2010.506390.
   Web of Science ®Google Scholar
• C. B. Tibirica and G. Ribatski, “Flow boiling in micro-scale channels - synthesized literature review,” Int. J. Refrig., vol. 36, no. 2, pp. 301–324, 2013. DOI: 10.1016/j.ijrefrig.2012.11.019.
   Web of Science ®Google Scholar
• B. H. Salman, H. A. Mohammed, K. M. Munisamy, and A. S. Kherbeet, “Characteristics of heat transfer and fluid flow in microtube and microchannel using conventional fluids and nanofluids: A review,” Renew. Sustain. Energy Rev., vol. 28, pp. 848–880, 2013. DOI: 10.1016/j.rser.2013.08.012.
   Web of Science ®Google Scholar
• S. G. Kandlikar, et al., “Heat transfer in microchannels - 2012 status and research needs,” J. Heat Transfer, vol. 135, no. 9, pp. 91001 (1–18), 2013. DOI: 10.1115/1.4024354.
   PubMed Web of Science ®Google Scholar
• Y. Wang and Z. G. Wang, “An overview of liquid-vapor phase change, flow and heat transfer in mini- and micro-channels,” Int. J. Therm. Sci., vol. 86, pp. 227–245, 2014. DOI: 10.1016/j.ijthermalsci.2014.07.005.
   Web of Science ®Google Scholar
• S. T. Kadam and R. Kumar, “Twenty first century cooling solution: Microchannel heat sinks,” Int. J. Therm. Sci., vol. 85, pp. 73–92, 2014. DOI: 10.1016/j.ijthermalsci.2014.06.013.
   Web of Science ®Google Scholar
• S. G. Kandlikar, “Design considerations for cooling high heat flux IC chips with microchannels,” IEEE Des. Test, July/August, 2014, pp. 43–50.
   Google Scholar
• M. Asadi, G. Xie, and B. Sunden, “A review of heat transfer and pressure drop characteristics of single and two-phase microchannels,” Int. J. Heat Mass. Transfer, vol. 79, pp. 34–53, 2014. DOI: 10.1016/j.ijheatmasstransfer.2014.07.090.
   Web of Science ®Google Scholar
• Z. Wu and B. Sundén, “On further enhancement of single-phase and flow boiling heat transfer in micro/minichannels,” Renew. Sustain. Energy Rev., vol. 40, pp. 11–27, 2014. DOI: 10.1016/j.rser.2014.07.171.
   Web of Science ®Google Scholar
• S. G. Kandlikar, “Mechanistic considerations for enhancing flow boiling heat transfer in microchannels,” J. Heat Transfer, vol. 138, no. 2, pp. 021504 (1–16), 2015. DOI: 10.1115/1.4031648.
   Web of Science ®Google Scholar
• D. E. Kim, D. I. Yu, D. W. Jerng, M. H. Kim, and H. S. Ahn, “Review of boiling heat transfer enhancement on micro/nanostructured surfaces,” Exp. Therm. Fluid Sci., vol. 66, pp. 173–196, 2015. DOI: 10.1016/j.expthermflusci.2015.03.023.
   Web of Science ®Google Scholar
• A. Dewan and P. Srivastava, “A review of heat transfer enhancement through flow disruption in a microchannel,” J. Therm. Sci., vol. 24, no. 3, pp. 203–214, 2015. DOI: 10.1007/s11630-015-0775-1.
   Web of Science ®Google Scholar
• M. Shojaeian and A. Koşar, “Pool boiling and flow boiling on micro- and nanostructured surfaces,” Exp. Therm. Fluid Sci., vol. 63, pp. 45–73, 2015. DOI: 10.1016/j.expthermflusci.2014.12.016.
   Web of Science ®Google Scholar
• A. A. Hussien, M. Z. Abdullah, and M. A. Al-Nimr, “Single-phase heat transfer enhancement in micro/minichannels using nanofluids: Theory and applications,” Appl. Energy, vol. 164, pp. 733–755, 2016. DOI: 10.1016/j.apenergy.2015.11.099.
   Web of Science ®Google Scholar
• A. Koşar, C. Mishra, and Y. Peles, “Laminar flow across a bank of low aspect ratio micro pin fins,” J. Fluids Eng., vol. 127, no. 5, pp. 419–430, 2005. DOI: 10.1115/1.1900139.
   Google Scholar
• Y. Peles, A. Koşar, C. Mishra, C. Kuo, and B. Schneider, “Forced convective heat transfer across a pin fin micro heat sink,” Int. J. Heat Mass. Transfer, vol. 48, pp. 3615–3627, 2005. DOI: 10.1016/j.ijheatmasstransfer.2005.03.017.
   Web of Science ®Google Scholar
• A. Koşar and Y. Peles, “Thermal-hydraulic performance of MEMS-based pin fin heat sink,” J. Heat Transfer, vol. 128, no. 2, pp. 121–131, 2006. DOI: 10.1115/1.2137760.
   Web of Science ®Google Scholar
• A. Renfer, M. K. Tiwari, T. Brunschwiler, B. Michel, and D. Poulikakos, “Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics,” Exp. Fluids, vol. 51, no. 3, pp. 731–741, 2011. DOI: 10.1007/s00348-011-1091-5.
   Web of Science ®Google Scholar
• A. Koşar and Y. Peles, “Micro scale pin fin heat sinks - parametric performance evaluation study,” IEEE Trans. Compon. Packag. Technol., vol. 30, no. 4, pp. 855–865, 2007. DOI: 10.1109/TCAPT.2007.906334.
   Google Scholar
• A. Siu-Ho, W. Qu, and F. Pfefferkorn, “Experimental study of pressure drop and heat transfer in a single-phase micropin-fin heat sink,” J. Electron. Packag., vol. 129, no. 12, pp. 479–487, 2007. DOI: 10.1115/1.2804099.
   Google Scholar
• W. Qu and A. Siu-Ho, “Liquid single-phase in an array of micro-pin-fins - Part II : Pressure drop characteristics,” J. Heat Transfer, vol. 130, pp. 124501 (1–4), 2008.
   Web of Science ®Google Scholar
• W. Qu, “Comparison of thermal-hydraulic performance of single-phase micro-pin-fin and micro-channel heat sinks,” 11th Intersoc. Therm. Thermomechanical Phenom. Electr. Syst., 2008, pp. 105–112.
   Google Scholar
• R. S. Prasher, et al., “Nusselt number and friction factor of staggered arrays of low aspect ratio micropin-fins under cross flow for water as fluid,” J. Heat Transfer, vol. 129, no. 2, pp. 141–153, 2007. DOI: 10.1115/1.2402179.
   Web of Science ®Google Scholar
• Y. J. Lee, P. S. Lee, and S. K. Chou, “Enhanced microchannel heat sinks using oblique fins,” ASME 2009 InterPACK Conf., 2009, pp. 253–260.
   Google Scholar
• Y. J. Lee, P. S. Lee, and S. K. Chou, “Experimental investigation of silicon-based oblique finned microchannel heat sinks,” Proc. 14th Int. Heat Transfer Conf. (IHTC14)-23413, 2010, pp. 1–9.
   Google Scholar
• Y. J. Lee, P. S. Lee, and S. K. Chou, “Enhanced thermal transport in microchannel using oblique fins,” J. Heat Transfer, vol. 134, no. 10, pp. 101901 (1–10), 2012. DOI: 10.1115/1.4006843.
   Web of Science ®Google Scholar
• Y. J. Lee, P. S. Lee, and S. K. Chou, “Numerical study of fluid flow and heat transfer in the enhanced microchannel with oblique fins,” J. Heat Transfer, vol. 135, no. 4, pp. 041901 (1–10), 2013. DOI: 10.1115/1.4023029.
   Web of Science ®Google Scholar
• D. Ansari, A. Husain, and K. Y. Kim, “Optimization and comparative study on oblique- and rectangular-fin microchannel heat sinks,” J. Thermophys. Heat Transfer, vol. 24, no. 4, pp. 849–852, 2010. DOI: 10.2514/1.50162.
   Web of Science ®Google Scholar
• T. J. John, B. Mathew, and H. Hegab, “Parametric study on the combined thermal and hydraulic performance of single phase micro pin-fin heat sinks Part I: Square and circle geometries,” Int. J. Therm. Sci., vol. 49, pp. 2177–2190, 2010. DOI: 10.1016/j.ijthermalsci.2010.06.011.
   Web of Science ®Google Scholar
• T. J. John, B. Mathew, and H. Hegab, “S-shaped pin-fins for enhancement of overall performance of the pin-fin heat sink,” Proc. ASME 2010 3rd Joint US-European Fluids Eng. Summer Meeting 8th Int. Conf. Nanochannels, Microchannels Minichannels (FEDSM-ICNMM), 2010, pp. 31164 (1–9).
   Google Scholar
• Z. Liu, C. Zhang, and N. Guan, “Experimental investigation on resistance characteristics in micro/mini cylinder group,” Exp. Therm. Fluid Sci., vol. 35, no. 1, pp. 226–233, 2011. DOI: 10.1016/j.expthermflusci.2010.09.005.
   Web of Science ®Google Scholar
• N. Guan, Z. Liu, M. Takei, and C. Zhang, “Numerical investigation of laminar flow and heat transfer in hexagonal ducts under isothermal and constant,” Proc. ASME 2010 3rd Joint US-European Fluids Eng. Summer Meeting 8th Int. Conf. Nanochannels Microchannels Minichannels (FEDSM-ICNMM), 2010, pp. 30423 (1–10).
   Google Scholar
• Z. Liu, Z. Wang, and C. Zhang, “Flow resistance and heat transfer characteristics in micro-cylinders-group,” Heat Mass. Transfer, vol. 49, pp. 733–744, 2013. DOI: 10.1007/s00231-013-1115-1.
   Web of Science ®Google Scholar
• N. Guan, T. Luan, Z. G. Liu, C. W. Zhang, and G. Jiang, “Vortex distribution and mixed convection of liquid flow across micro-cylinders in a rectangular channel,” Heat Mass. Transfer, vol. 52, no. 3, pp. 657–670, 2016. DOI: 10.1007/s00231-015-1640-1.
   Web of Science ®Google Scholar
• H. J. T. Tan and M. Z. Abdullah, “Effect of horizontal/vertical fin tip gaps on microchannel heat sinks performance in electronic cooling,” J. Therm. Sci. Technol., vol. 33, pp. 23–34, 2013.
   Web of Science ®Google Scholar
• N. Raja Kuppusamy, R. Saidur, N. N. N. Ghazali, and H. A. Mohammed, “Numerical study of thermal enhancement in micro channel heat sink with secondary flow,” Int. J. Heat Mass. Transfer, vol. 78, pp. 216–223, 2014. DOI: 10.1016/j.ijheatmasstransfer.2014.06.072.
   Web of Science ®Google Scholar
• Z. Wan and Y. Joshi, “Pressure drop and heat transfer characteristics of square pin fin enhanced microgaps in single phase microfluidic cooling,” IEEE Intersoc. Conf. Therm. Thermomechanical Phenom. Electron. Syst., 2014, pp. 649–657.
   Google Scholar
• Y. J. Lee, P. K. Singh, and P. S. Lee, “Fluid flow and heat transfer investigations on enhanced microchannel heat sink using oblique fins with parametric study,” Int. J. Heat Mass. Transfer, vol. 81, pp. 325–336, 2015. DOI: 10.1016/j.ijheatmasstransfer.2014.10.018.
   Web of Science ®Google Scholar
• Z. G. Liu, N. Guan, C. W. Zhang, and G. L. Jiang, “The flow resistance and heat transfer characteristics of micro pin-fins with different cross-sectional shapes,” Nanoscale Microscale Thermophys. Eng., vol. 19, pp. 221–243, 2015. DOI: 10.1080/15567265.2015.1073820.
   Web of Science ®Google Scholar
• H. Zhao, Z. Liu, C. Zhang, N. Guan, and H. Zhao, “Pressure drop and friction factor of a rectangular channel with staggered mini pin fins of different shapes,” Exp. Therm. Fluid Sci., vol. 71, pp. 57–69, 2016. DOI: 10.1016/j.expthermflusci.2015.10.010.
   Web of Science ®Google Scholar
• J. Hua, G. Li, X. Zhao, Q. Li, and J. Hu, “Study on the flow resistance performance of fluid cross various shapes of micro-scale pin fin,” Appl. Therm. Eng., vol. 107, pp. 768–775, 2016. DOI: 10.1016/j.applthermaleng.2016.07.048.
   Web of Science ®Google Scholar
• D. Yang, et al., “Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations,” Appl. Therm. Eng., vol. 112, pp. 1547–1556, 2017. DOI: 10.1016/j.applthermaleng.2016.08.211.
   Web of Science ®Google Scholar
• C. A. Rubio-Jimenez, S. G. Kandlikar, and A. Hernandez-Guerrero, “Numerical analysis of novel micro pin fin heat sink with variable fin density,” IEEE Trans. Components, Packag. Manuf. Technol., vol. 2, no. 5, pp. 825–833, 2012. DOI: 10.1109/TCPMT.2012.2189925.
   Google Scholar
• C. A. Rubio-Jimenez, S. G. Kandlikar, and A. Hernandez-Guerrero, “Performance of online and offset micro pin-fin heat sinks with variable fin density,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 1, pp. 86–93, 2013. DOI: 10.1109/TCPMT.2012.2225143.
   Web of Science ®Google Scholar
• Z. Liu, N. Guan, and C. Zhang, “Influence of tip clearance on heat transfer efficiency in micro-cylinders-group heat sink,” Exp. Therm. Fluid Sci., vol. 46, pp. 64–73, 2013. DOI: 10.1016/j.expthermflusci.2012.11.021.
   Web of Science ®Google Scholar
• R. Roth, G. Lenk, K. Cobry, and P. Woias, “Heat transfer in freestanding microchannels with in-line and staggered pin fin structures with clearance,” Int. J. Heat Mass. Transfer, vol. 67, pp. 1–15, 2013. DOI: 10.1016/j.ijheatmasstransfer.2013.07.097.
   Web of Science ®Google Scholar
• A. Bhat, Experimental Study of Heat Transfer and Pressure Drop over an Array of Short Micro Pin Fins. Rochester, NY: RIT, 2015.
   Google Scholar
• A. Ebrahimi, E. Roohi, and S. Kheradmand, “Numerical study of liquid flow and heat transfer in rectangular microchannel with longitudinal vortex generators,” Appl. Therm. Eng., vol. 78, pp. 576–583, 2015. DOI: 10.1016/j.applthermaleng.2014.12.006.
   Web of Science ®Google Scholar
• M. T. Al-Asadi, F. S. Alkasmoul, and M. C. T. Wilson, “Heat transfer enhancement in a micro-channel cooling system using cylindrical vortex generators,” Int. Commun. Heat Mass. Transfer, vol. 74, pp. 40–47, 2016. DOI: 10.1016/j.icheatmasstransfer.2016.03.002.
   Web of Science ®Google Scholar
• A. Abdoli, G. Jimenez, and G. S. Dulikravich, “Thermo-fluid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot,” Int. J. Therm. Sci., vol. 90, pp. 290–297, 2015. DOI: 10.1016/j.ijthermalsci.2014.12.021.
   Web of Science ®Google Scholar
• D. Lorenzini, et al., “Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering,” Int. J. Heat Mass. Transfer, vol. 103, pp. 1359–1370, 2016. DOI: 10.1016/j.ijheatmasstransfer.2016.08.040.
   Web of Science ®Google Scholar
• J. Mita and W. Qu, “Pressure drop of water flow across a micro-pin–fin array Part 1: isothermal liquid single-phase flow,” Int. J. Heat Mass. Transfer, vol. 89, pp. 1073–1082, 2015. DOI: 10.1016/j.ijheatmasstransfer.2015.06.006.
   Web of Science ®Google Scholar
• G. Xie, Y. Li, F. Zhang, and B. Sundén, “Analysis of micro-channel heat sinks with rectangular-shaped flow obstructions,” Numer. Heat Transf. Part A Appl., vol. 69, no. 4, pp. 335–351, 2016. DOI: 10.1080/10407782.2015.1080580.
   Web of Science ®Google Scholar
• D. Lorenzini-Gutierrez and S. G. Kandlikar, “Variable fin density flow channels for effective cooling and mitigation of temperature nonuniformity in three-dimensional integrated circuits,” J. Electron. Packag., vol. 136, no. 6, pp. 021007 (1–11), 2014. DOI: 10.1115/1.4027091.
   Google Scholar
• X. Yu, C. Woodcock, J. Plawsky, and Y. Peles, “An investigation of convective heat transfer in microchannel with piranha pin fin,” Int. J. Heat Mass. Transfer, vol. 103, pp. 1125–1132, 2016. DOI: 10.1016/j.ijheatmasstransfer.2016.07.069.
   Web of Science ®Google Scholar
• C. Woodcock, X. Yu, J. Plawsky, and Y. Peles, “Piranha Pin Fin (PPF) - advanced flow boiling microstructures with low surface tension dielectric fluids,” Int. J. Heat Mass. Transfer, vol. 90, pp. 591–604, 2015. DOI: 10.1016/j.ijheatmasstransfer.2015.06.072.
   Web of Science ®Google Scholar
• H. R. Seyf and M. Feizbakhshi, “Computational analysis of nanofluid effects on convective heat transfer enhancement of micro-pin-fin heat sinks,” Int. J. Therm. Sci., vol. 58, pp. 168–179, 2012. DOI: 10.1016/j.ijthermalsci.2012.02.018.
   Web of Science ®Google Scholar
• E. Hosseinirad and F. Hormozi, “New correlations to predict the thermal and hydraulic performance of different longitudinal pin fins as vortex generator in miniature channel: Utilizing MWCNT-water and Al2O3-water nanofluids,” Appl. Therm. Eng., vol. 118, pp. 199–213, 2017. DOI: 10.1016/j.applthermaleng.2017.02.105.
   Web of Science ®Google Scholar
• U. Izci, M. Koz, and A. Koşar, “The effect of micro pin-fin shape on thermal and hydraulic performance of micro pin-fin heat sinks,” Heat Transf. Eng., vol. 36, no. 17, pp. 1447–1457, 2015. DOI: 10.1080/01457632.2015.1010921.
   Web of Science ®Google Scholar
• M. Koz, M. R. Ozdemir, and A. Koşar, “Parametric study on the effect of end walls on heat transfer and fluid flow across a micro pin-fin,” Int. J. Therm. Sci., vol. 50, no. 6, pp. 1073–1084, 2011. DOI: 10.1016/j.ijthermalsci.2010.12.008.
   Web of Science ®Google Scholar
• M. Koz and A. Koşar, “Parameter optimization of a micro heat sink with circular pin-fins,” Proc. ASME 2010 3rd Joint US-European Fluids Eng. Summer Meeting 8th Int. Conf. Nanochannels Microchannels Minichannels ( F, 2010, pp. 30473 (1–9).
   Google Scholar
• A. KoşAr, B. Schneider, and Y. Peles, “Hydrodynamic characteristics of crossflow over MEMS-based pillars,” J. Fluids Eng., vol. 133, no. 8, pp. 081201 (1–11), 2011. DOI: 10.1115/1.4004366.
   Web of Science ®Google Scholar
• A. Mohammadi and A. Koşar, “Hydrodynamic and thermal performance of microchannels with different in-line arrangements of cylindrical micro pin fins,” J. Heat Transfer, vol. 138, no. 12, pp. 122403 (1–17), 2016. DOI: 10.1115/1.4034164.
   Web of Science ®Google Scholar
• A. Mohammadi and A. Koşar, “Hydrodynamic and thermal performance of microchannels with different staggered arrangements of cylindrical micro pin fins,” J. Heat Transfer, vol. 139, no. 6, pp. 062402 (1–13), 2017. DOI: 10.1115/1.4035655.
   PubMed Web of Science ®Google Scholar
• L. Ekstrand, Z. Mol, Y. Zhang, and J. Liu, “Modelling of carbon nanotubes as heat sink fins in microchannels for microelectronics cooling,” 5th Int. Conf. Polym. Adhes. Microelectron. Photonics, 2005, pp. 185–187.
   Google Scholar
• A. Koşar and Y. Peles, “Convective flow of refrigerant (R-123) across a bank of micro pin fins,” Int. J. Heat Mass. Transfer, vol. 49, no. 17–18, pp. 3142–3155, 2006. DOI: 10.1016/j.ijheatmasstransfer.2006.02.013.
   Web of Science ®Google Scholar
• M. E. Steinke and S. G. Kandlikar, “Single-phase liquid heat transfer in plain and enhanced microchannels,” Proc. 4th Int. Conf. Nanochannels Microchannels Minichannels (ICNMM), 2006, pp. 96227 (1–9).
   Google Scholar
• A. J. Heltzel, “Thermal performance modeling of micro pin-fin heat sinks for aircraft thermal management,” 46th AIAA Aerospace Sci. Meeting Exhibit, 2008, pp. 092407 (1–9).
   Google Scholar
• W. Qu and A. Siu-Ho, “Liquid single-phase flow in an array of micro pin fins - Part 1: Heat transfer characteristics,” J. Heat Transfer, vol. 130, pp. 122402 (1–11), 2008.
   Web of Science ®Google Scholar
• F. Hong and P. Cheng, “Three dimensional numerical analyses and optimization of offset strip-fin microchannel heat sinks,” Int. Commun. Heat Mass. Transfer, vol. 36, no. 7, pp. 651–656, 2009. DOI: 10.1016/j.icheatmasstransfer.2009.02.015.
   Web of Science ®Google Scholar
• Q. Wang, V. Hessel, E. V. Rebrov, and B. Werner, “3D analysis of heat transfer intensification by re-entrance flow pin-fins microstructures with a highly thermal-conductive plate,” Chem. Eng. Technol., vol. 34, no. 3, pp. 379–390, 2011. DOI: 10.1002/ceat.201000376.
   Web of Science ®Google Scholar
• N. Guan, G. Jiang, Z. G. Liu, and C. W. Zhang, “Effects of heating load on flow resistance and convective heat transfer in micro-pin-fin heat sinks with different cross-section shapes,” Exp. Heat Transfer., vol. 29, pp. 1–18, July 2016. DOI: 10.1080/08916152.2015.1086841.
   Web of Science ®Google Scholar
• J. Hua, G. Li, X. Zhao, and Q. Li, “Experimental study on thermal performance of micro pin fin heat sinks with various shapes,” Heat Mass. Transfer, vol. 53, no. 3, pp. 1093–1104, 2016. DOI: 10.1007/s00231-016-1880-8.
   Web of Science ®Google Scholar
• Z. Liu, C. Zhang, H. Zhao, and N. Guan, “Forced convective heat transfer characteristics in micro/minicylinders group at low reynolds number,” Nanoscale Microscale Thermophys. Eng., vol. 16, pp. 165–180, 2012. DOI: 10.1080/15567265.2012.683933.
   Web of Science ®Google Scholar
• R. Roth, K. Cobry, G. Lenk, and P. Woias, “Micro process engineering of freestanding silicon fluidic channels with integrated platinum thermistors for obtaining heat transfer correlations,” 8th Ann. IEEE Int. Conf. Nano/Micro Eng. Mol. Syst. (NEMS 2013), 2013, pp. 879–882.
   Google Scholar
• Z. Kheirandish, H. Shafeie, and O. Abouali, “numerical investigation of heat transfer enhancement in heat sinks with elongated hexagonal fins,” Proc. ASME 2011 9th Int. Conf. Nanochannels Microchannels Minichannels (ICNMM), 2011, pp. 58245 (1–7).
   Google Scholar
• H. Shafeie, O. Abouali, K. Jafarpur, and G. Ahmadi, “Numerical study of heat transfer performance of single-phase heat sinks with micro pin-fin structures,” Appl. Therm. Eng., vol. 58, no. 1–2, pp. 68–76, 2013. DOI: 10.1016/j.applthermaleng.2013.04.008.
   Web of Science ®Google Scholar
• A. Renfer, et al., “Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks,” Int. J. Heat Mass. Transfer, vol. 65, pp. 33–43, 2013. DOI: 10.1016/j.ijheatmasstransfer.2013.05.066.
   Web of Science ®Google Scholar
• N. Guan, T. Luan, G. Jiang, Z. G. Liu, and C. W. Zhang, “Influence of heating load on heat transfer characteristics in micro-pin-fin arrays,” Heat Mass Transf. Und Stoffuebertragung, vol. 52, no. 2, pp. 393–405, 2016. DOI: 10.1007/s00231-015-1565-8.
   Web of Science ®Google Scholar
• V. Yadav, K. Baghel, R. Kumar, and S. T. Kadam, “Numerical investigation of heat transfer in extended surface microchannels,” Int. J. Heat Mass. Transfer, vol. 93, pp. 612–622, 2016. DOI: 10.1016/j.ijheatmasstransfer.2015.10.023.
   Web of Science ®Google Scholar
• K. Y. Heo, K. D. Kihm, and J. S. Lee, “Fabrication and experiment of micro-pin-finned microchannels to study surface roughness effects on convective heat transfer,” J. Micromech. Microeng., vol. 24, pp. 125025 (1–12), 2014. DOI: 10.1088/0960-1317/24/12/125025.
   Web of Science ®Google Scholar
• X. Chen, F. N. Donmezer, S. Kumar, and S. Graham, “A numerical study on comparing the active and passive cooling of AlGaN/GaN HEMTs,” IEEE Trans. Electron Devices, vol. 61, no. 12, pp. 4056–4061, 2014. DOI: 10.1109/TED.2014.2360504.
   Web of Science ®Google Scholar
• A. Reeser, A. Bar-Cohen, and G. Hetsroni, “High quality flow boiling heat transfer and pressure drop in microgap pin fin arrays,” Int. J. Heat Mass. Transfer, vol. 78, pp. 974–985, 2014. DOI: 10.1016/j.ijheatmasstransfer.2014.05.021.
   Web of Science ®Google Scholar
• J. L. Gonzalez-Hernandez, S. G. Kandlikar, and A. Hernandez-Guerrero, “Performance assessment comparison of variable fin density microchannels with offset configurations,” Heat Transf. Eng., vol. 37, no. 16, pp. 1369–1381, 2016. DOI: 10.1080/01457632.2015.1136146.
   Web of Science ®Google Scholar
• J. Marschewski, et al., “Significant heat transfer enhancement in microchannels with herringbone-inspired microstructures,” Int. J. Heat Mass. Transfer, vol. 95, pp. 755–764, 2016. DOI: 10.1016/j.ijheatmasstransfer.2015.12.039.
   Web of Science ®Google Scholar
• S. K. Mohammadian and Y. Zhang, “Analysis of nanofluid effects on thermoelectric cooling by micro-pin-fin heat exchangers,” Appl. Therm. Eng., vol. 70, no. 1, pp. 282–290, 2014. DOI: 10.1016/j.applthermaleng.2014.05.010.
   Web of Science ®Google Scholar
• S. Krishnamurthy and Y. Peles, “Gas-liquid two-phase flow across a bank of micropillars,” Phys. Fluids, vol. 19, no. 4, pp. 043302 (1–14), 2007. DOI: 10.1063/1.2722424.
   Web of Science ®Google Scholar
• D. S. Schrage, J. T. Hsu, and M. K. Jensen, “Two-phase pressure drop in vertical crossflow across a horizontal tube bundle,” AIChE J., vol. 34, no. 1, pp. 107–115, 1988. DOI: 10.1002/aic.690340112.
   Web of Science ®Google Scholar
• R. W. Lockhart and R. C. Martinelli, “Proposed correlation of data for isothermal two-phase, two-component flow in pipes,” Chem. Eng. Prog., vol. 45, pp. 39–48, 1949.
   Web of Science ®Google Scholar
• A. Koşar, “Two-phase pressure drop across a hydrofoil-based micro pin device using R-123,” Exp. Therm. Fluid Sci., vol. 32, no. 6, pp. 1213–1221, 2008. DOI: 10.1016/j.expthermflusci.2008.02.005.
   Web of Science ®Google Scholar
• A. Koşar, B. R. Schneider, and Y. Peles, “Two-phase flow across a bank of hydrofoil micro pin fins,” 9th AIAA/ASME Joint Thermophys. Heat Transfer Conf., 2006, pp. 3619 (1–11).
   Google Scholar
• S. Krishnamurthy and Y. Peles, “Surface tension effects on adiabatic gas-liquid flow across micro pillars,” Int. J. Multiph. Flow, vol. 35, no. 1, pp. 55–65, 2009. DOI: 10.1016/j.ijmultiphaseflow.2008.08.001.
   Web of Science ®Google Scholar
• F. H. Rahman, J. G. Gebbie, and M. K. Jensen, “An interfacial friction correlation for shell-side vertical two-phase cross-flow past horizontal in-line and staggered tube bundles,” Int. J. Multiph. Flow, vol. 22, no. 4, pp. 753–766, 1996. DOI: 10.1016/0301-9322(96)00015-8.
   Web of Science ®Google Scholar
• W. Qu and A. Siu-Ho, “Measurement and prediction of pressure drop in a two-phase micro-pin-fin heat sink,” Int. J. Heat Mass. Transfer, vol. 52, no. 21–22, pp. 5173–5184, 2009. DOI: 10.1016/j.ijheatmasstransfer.2009.05.007.
   Web of Science ®Google Scholar
• C. A. Konishi, W. Qu, and F. E. Pfefferkorn, “experimental study of water liquid-vapor two-phase pressure drop across an array of staggered micropin-fins,” J. Electron. Packag., vol. 131, no. 6, pp. 021010 (1–8), 2009. DOI: 10.1115/1.3104028.
   Google Scholar
• A. Kosar, M. R. Ozdemir, and M. Keskinoz, “Pressure drop across micro-pin heat sinks under unstable boiling conditions,” Int. J. Therm. Sci., vol. 49, no. 7, pp. 1253–1263, 2010. DOI: 10.1016/j.ijthermalsci.2009.12.018.
   Web of Science ®Google Scholar
• C. Woodcock, et al., “Piranha Pin-Fins (PPF): Voracious boiling heat transfer by vapor venting from microchannels - system calibration and single-phase fluid dynamics,” Thermomechanical Phenom. Electron. Syst. –Proc. Intersoc. Conf., 2014, pp. 282–289.
   Google Scholar
• X. Yu, C. Woodcock, Y. Wang, J. Plawsky, and Y. Peles, “A comparative study of flow boiling in a microchannel with piranha pin fins,” J. Heat Transfer, vol. 138, no. 11, pp.111502 (1–12), 2016. DOI: 10.1115/1.4033743.
   Web of Science ®Google Scholar
• J. Mita and W. Qu, “Pressure drop of water flow across a micro-pin–fin array Part 2: Adiabatic liquid-vapor two-phase flow,” Int. J. Heat Mass. Transfer, vol. 89, pp. 1007–1015, 2015. DOI: 10.1016/j.ijheatmasstransfer.2015.06.005.
   Web of Science ®Google Scholar
• C. A. Konishi and W. Qu, “Toward a generalized correlation for liquid-vapor two-phase frictional pressure drop across staggered micro-pin-fin arrays,” Int. Commun. Heat Mass. Transfer, vol. 75, pp. 253–261, 2016. DOI: 10.1016/j.icheatmasstransfer.2016.04.027.
   Web of Science ®Google Scholar
• D. Bian, Enhanced Flow Boiling Heat Transfer in Microchannels with Structured Surfaces at Varied Mass Flow Rates. Cambridge, MA: MIT, 2015.
   Google Scholar
• A. Koşar and Y. Peles, “Boiling heat transfer in a hydrofoil-based micro pin fin heat sink,” Int. J. Heat Mass. Transfer, vol. 50, no. 5–6, pp. 1018–1034, 2007. DOI: 10.1016/j.ijheatmasstransfer.2006.07.032.
   Web of Science ®Google Scholar
• Y. Katto and Y. Haramura, “Critical heat flux on a uniformly heated horizontal cylinder in an upward cross flow of saturated liquid,” Int. J. Heat Mass. Transfer, vol. 26, no. 8, pp. 1199–1205, 1983. DOI: 10.1016/S0017-9310(83)80174-4.
   Web of Science ®Google Scholar
• S. Krishnamurthy and Y. Peles, “Flow boiling of water in a circular staggered micro-pin fin heat sink,” Int. J. Heat Mass. Transfer, vol. 51, no. 5–6, pp. 1349–1364, 2008. DOI: 10.1016/j.ijheatmasstransfer.2007.11.026.
   Web of Science ®Google Scholar
• S. Krishnamurthy and Y. Peles, “Flow boiling heat transfer on micro pin fins entrenched in a microchannel,” J. Heat Transfer, vol. 132, pp. 041007 (1–10), 2010.
   PubMed Web of Science ®Google Scholar
• S. Krishnamurthy and Y. Peles, “Flow boiling on micropin fins entrenched inside a microchannel - flow patterns and bubble departure diameter and bubble frequency,” J. Heat Transfer, vol. 132, no. 4, pp. 041002 (1–9), 2010. DOI: 10.1115/1.2994718.
   PubMed Web of Science ®Google Scholar
• W. Qu and A. Siu-Ho, “Experimental study of saturated flow boiling heat transfer in an array of staggered micro-pin-fins,” Int. J. Heat Mass. Transfer, vol. 52, no. 7–8, pp. 1853–1863, 2009. DOI: 10.1016/j.ijheatmasstransfer.2008.10.008.
   Web of Science ®Google Scholar
• Y. F. Xue, M. Z. Yuan, and J. J. Wei, “Experimental study of flow boiling heat transfer coefficient of FC-72 over micro-pin-finned surfaces,” Proceedings of the 14th International Heat Transfer Conference, 2010, pp. 22282 (1–8).
   Google Scholar
• W. Lee, G. Son, and H. Y. Yoon, “Direct numerical simulation of flow boiling in a finned microchannel,” Int. Commun. Heat Mass. Transfer, vol. 39, no. 9, pp. 1460–1466, 2012. DOI: 10.1016/j.icheatmasstransfer.2012.08.005.
   Web of Science ®Google Scholar
• W. Lee and G. Son, “Numerical simulation of bubble growth and heat transfer during flow boiling in a surface-modified microchannel,” Heat Transf. Eng., vol. 35, no. 5, pp. 501–507, 2014. DOI: 10.1080/01457632.2013.833050.
   Web of Science ®Google Scholar
• S. A. Isaacs et al., “Two-Phase Flow and Heat Transfer in Pin-Fin Enhanced Micro-Gaps,” 13th IEEE Intersoc. Conf. Thermal Thermomechanical Phenom. Electron. Syst., 2012, pp. 1–6.
   Google Scholar
• A. Ebrahimi, F. Rikhtegar, A. Sabaghan, and E. Roohi, “Heat transfer and entropy generation in a microchannel with longitudinal vortex generators using nanofluids,” Energy, vol. 101, pp. 190–201, 2016. DOI: 10.1016/j.energy.2016.01.102.
   Web of Science ®Google Scholar
• Y. Zhu et al., “Surface structure enhanced microchannel flow boiling,” J. Heat Transfer, vol. 138, no. 9, pp. 91501 (1–13), 2016. DOI: 10.1115/1.4033497.
   Web of Science ®Google Scholar
• P. Asrar et al., “Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins,” 32nd SEMI-THERM Symp., 2016, pp. 86–89.
   Google Scholar
• P. Asrar et al., “Flow boiling of R245fa in a microgap with integrated staggered pin fins,” Proc. 15th InterSoc. Conf. Thermal Thermomechanical Phenom. Electron. Syst. (ITherm), 2016, pp. 1007–1012.
   Google Scholar
• Y. Wang, A. Nayebzadeh, X. Yu, J. H. Shin, and Y. Peles, “Local heat transfer in a microchannel with a pin fin - experimental issues and methods to mitigate,” Int. J. Heat Mass. Transfer, vol. 106, pp. 1191–1204, 2017. DOI: 10.1016/j.ijheatmasstransfer.2016.10.100.
   Web of Science ®Google Scholar
• W. Wan, D. Deng, Q. Huang, T. Zeng, and Y. Huang, “Experimental study and optimization of pin fin shapes in flow boiling of micro pin fin heat sinks,” Appl. Therm. Eng., vol. 114, pp. 436–449, 2017. DOI: 10.1016/j.applthermaleng.2016.11.182.
   Web of Science ®Google Scholar
• C. Falsetti, H. Jafarpoorchekab, M. Magnini, N. Borhani, and J. R. Thome, “Two-phase operational maps, pressure drop, and heat transfer for flow boiling of R236fa in a micro-pin fin evaporator,” Int. J. Heat Mass. Transfer, vol. 107, pp. 805–819, 2017. DOI: 10.1016/j.ijheatmasstransfer.2016.11.038.
   Web of Science ®Google Scholar