REFERENCES
- Karnick , D. ; Ballas , G. ; Koland , L. ; Secord , M. ; Braman , T. ; Kourepenis , T. Honeywell gun-hard inertial measurement unit (IMU) development . Position Location and Navigation Symposium, PLANS 2004 , 4 , 49 – 55 .
- Brown , T.G. Harsh military environments and microelectromechanical (MEMS) devices . Proc. IEEE Sensors 2003 , 2 , 753 – 760 .
- Marinis , T.F. ; Soucy , J.W. ; Lawrence , J.G. ; Marinis , R.T. ; Pryputniewicz , R.J. Vacuum sealed MEMS package with an optical window . IEEE Electronics Components and Technology Conference (ECTC) , Orlando , FL , 2008 ; IEEE: New York ; pp. 804 – 810 .
- Klempner , A.R. Development of a modular interferometric microscopy system for characterization of MEMS. MS Thesis, Worcester Polytechnic Institute, Worcester, MA, 2006 .
- Marinis , R.T. Development and implementation of automated interferometric microscope system for study of MEMS inertial sensors, Ph.D. Dissertation, Worcester Polytechnic Institute, Worcester, MA, 2009.
- Pryputniewicz , R.J. Quantitative determination of displacements and strains from holograms . In Holographic Interferometry , Vol. 68 of Springer Series in Sciences , P. Rastogi , Ed.; Springer-Verlag : Berlin , 1995 ; pp. 33 – 72 .
- Furlong , C. Hybrid, experimental and computational, approach for the efficient study and optimization of mechanical and electro-mechanical components, Ph.D. Dissertation, Worcester Polytechnic Institute, Worcester, MA, 1999.
- Marinis , T.F. ; Soucy , J.W. Gold bump attachment of MEM sensor die using thermocompression bonding . 53rd Electronic Components & Technology Conference (ECTC) , New Orleans , LA , 2003 ; IEEE: New York ; pp. 385 – 391 .
- Color versions of one or more of the figures in the article can be found online at www.tandfonline. com/uopt.