Use of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an AC nitrogen glow discharge

J.B. Ma Department of Physics and Center for Materials Science and Engineering, Rochester Institute of Technology, Rochester, NY 14623, USA

J. Dragon Department of Physics and Center for Materials Science and Engineering, Rochester Institute of Technology, Rochester, NY 14623, USA

W. Van Derveer Department of Physics and Center for Materials Science and Engineering, Rochester Institute of Technology, Rochester, NY 14623, USA

A. Entenberg Department of Physics and Center for Materials Science and Engineering, Rochester Institute of Technology, Rochester, NY 14623, USA

V. Lindberg Department of Physics and Center for Materials Science and Engineering, Rochester Institute of Technology, Rochester, NY 14623, USA

M. Anschel IBM Packaging Development Laboratory, Hopewell Jct., NY 12533, USA

D.-Y. Shih IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA

P. Lauro IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA

References