Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils

References

• Feger , C. and Feger , C. 1993 . Multichip Module Technologies and Alternatives , Edited by: Doane , D. A. and Franzon , P. D. 311 New York : Van Nostrand Reinhold .
   Google Scholar
• Mittal , K. L. , ed. 1984 . Polyimides: Synthesis, Characterization, and Applications , Vol. s1 and 2 , New York : Plenum Press .
   Google Scholar
• Ghosh , M. K. and Mittal , K. L. , eds. 1996 . Polyimides: Fundamentals and Applications , New York : Marcel Dekker .
   Google Scholar
• Lee , K. W. , Walker , G. F. and Viehbeck , A. 1995 . J. Adhesion Sci. Technol. , 8 : 1125
   Google Scholar
• Child , C. M. , Fieberg , J. E. and Campion , A. 1997 . Surface Sci. , 372 : L254
   Google Scholar
• Ghosh , I. , Konar , J. and Bhowmick , A. 1997 . J. Adhesion Sci. Technol. , 11 : 877
   Web of Science ®Google Scholar
• Vorobyova , T. 1997 . J. Adhesion Sci. Technol. , 11 : 167
   Web of Science ®Google Scholar
• Flitsch , R. and Shih , D. 1997 . J. Adhesion Sci. Technol. , 10 : 1241
   Google Scholar
• Chang , G. , Jung , S. , Lee , Y. , Choi , I. , Whang , C. , Woo , J. and Lee , Y. 1997 . J. Appl. Phys. , 81 : 135
   Google Scholar
• Xue , G. , Shi , G. , Ding , J. , Chang , W. and Chen , R. 1990 . J. Adhesion Sci. Technol. , 4 : 723
   Web of Science ®Google Scholar
• Inagaki , N. , Tasaka , S. and Masumoto , M. 1995 . J. Appl. Polym. Sci. , 56 : 135
   Web of Science ®Google Scholar
• Inagaki , N. , Tasaka , S. and Masumoto , M. 1996 . Macromolecules , 29 : 1642
   Web of Science ®Google Scholar
• Yang , W. T. and Ranby , B. 1996 . J. Appl. Polym. Sci. , 62 : 533
   Web of Science ®Google Scholar
• Yang , W. T. and Ranby , B. 1996 . J. Appl. Polym. Sci. , 62 : 545
   Web of Science ®Google Scholar
• Ranby , B. 1990 . J. Adhesion Sci. Technol. , 9 : 599
   Google Scholar
• Wang , T. , Kang , E. T. , Neoh , K. G. , Fuh , J. Y. H. , Lu , L. and Nee , A. Y. C. 1997 . J. Adhesion Sci. Technol. , 11 : 1211
   Web of Science ®Google Scholar
• Strobel , M. , Lyons , C. S. and Mittal , K. L. , eds. 1994 . Plasma Surface Modification of Polymers: Relevance to Adhesion , Utrecht , , The Netherlands : VSP .
   Google Scholar
• Shi , M. K. , Martinu , L. , Sacher , E. , Selmani , A. , Wertheimer , M. R. and Yelon , A. 1995 . Surface Interface Anal. , 23 : 99
   Web of Science ®Google Scholar
• Inagaki , N. , Tasaka , S. and Kawai , H. 1989 . J. Adhesion Sci. Technol. , 3 : 637
   Web of Science ®Google Scholar
• Shi , M. K. , Selmani , A. , Martinu , L. , Sacher , E. , Wertheimer , M. R. and Yelon , A. 1994 . J. Adhesion Sci. Technol. , 8 : 1129
   Web of Science ®Google Scholar
• Kinbara , A. , Kikuchi , A. , Baba , S. and Abe , T. 1993 . J. Adhesion Sci. Technol. , 7 : 457
   Web of Science ®Google Scholar
• Inagaki , N. 1996 . Plasma Surface Modification and Plasma Polymerization , Lancaster , PA : Technomic Publishing Co .
   Google Scholar
• Feast , W. J. , Munro , H. S. and Richards , R. W. , eds. 1993 . Polymer Surfaces and Interfaces II , Chichester : John Wiley .
   Google Scholar
• Loh , F. C. , Lau , C. B. , Tan , K. L. and Kang , E. T. 1995 . J. Appl. Polym. Sci. , 56 : 1707
   Web of Science ®Google Scholar
• Chan , H. L. , Ho , S. H. , Wang , T. H. , Chan , K. M. , Pan , J. P. , Liang , S. M. and Hung , A. J. 1994 . J. Appl. Polym. Sci. , 51 : 1647
   Google Scholar
• Solomons , T. W. G. 1996 . Organic Chemistry , 6th edn , 952 – 962 . New York : John Wiley .
   Google Scholar
• Xue , G. , Dai , Q. and Jiang , S. 1988 . J. Am. Chem. Soc. , 110 : 2393
   Web of Science ®Google Scholar