References
- Wurtz A. : Comp. Rendus Acad. Sci. (Paris), 1844, 18, 702–702; 1845, 21, 149–149.
- Breteau P. : Bull. Soc. Chim., 1911, 9, (4), 515–518.
- Roux F. A. : ‘Process of producing metallic deposits’, US Patent 1,207,218, 1916.
- Pall C. and Friederici L. : Ber. Deut. Chem. Ges., 1931, 64, 1766–1776.
- Scholder R. and Heckel H. : Z. Anorg. Allgem. Chem., 1931, 198, (1), 329–351.
- Scholder R. and Haken H. L. : Ber. Deut. Chem. Ges., 1931, 64, (13), 2870–2877.
- Brenner A. and Riddell G. E. : J. Res. Nat. Bur. Stand., 1946, 37, 31–34; Proc. Am. Electroplat. Soc., 1946, 33, 23–29.
- Brenner A. and Riddell G. E. : Plat. Surf. Finish., 1998, 85, 54–56.
- Brenner A. : ‘History of the electroless plating process’, in ‘Symposium on electroless nickel plating’, (ed. Brenner A. ); 1959, Philadelphia, PA, ASTM Special Technical Publication, pp. 1–8.
- Brenner A. : Plat. Surf. Finish., 1984, 71, 24–27.
- Brenner A. and Riddell G. E. : J. Res. Natl Bur. Stand., 1947, 39, 385–395.
- Brenner A. : Met. Finish., 1954, 52, (11), 68–76; 1954, 52, (12), 61–68.
- West H. J. : Met. Finish., 1954, 52, (3), 64–68.
- West H. J. : Met. Finish., 1954, 52, (7), 72–76.
- West H. J. : Met. Finish., 1955, 53, (1), 62–67.
- Maclean J. D. and Karten S. M. : ‘A practical application of electroless nickel plating’, Proc. 41st Annual Convention, 226; 1954, Washington, DC, American Electroplaters’ Society p. 226.
- Gutzeit G. and Mapp E. T. : Corros. Technol., 1956, 3, 331–336; Trans. Inst. Met. Finish., 1956, 33, 383–393.
- Goldenstein A. Rostoker W. and Schossberger F. : J. Electrochem. Soc., 1957, 104, 104–110.
- de Minjer C. H. and Brenner A. : Plating, 1957, 44, 1297–1305.
- Gutzeit G. : Plating, 1959, 46, 1158–1164.
- Knanishu J. : ‘Technical report – Deposition of alloy by chemical reduction, the office of technical services’, US Department of Commerce, http://handle.dtic.mil/100·2/AD273648 (accessed 4 December 1961).
- Gutzeit G. and Landon R. W. : ‘A large scale electroless nickel custom plating shop’, Proc. 41st Annual Conv., 256; 1954, Washington, DC, American Electroplaters’ Society.
- Brenner A. and Riddell G. E. : ‘Nickel plating by chemical reduction’, US Patent 2,532,283, 1950.
- Talmey P. and Crehan W. J. : ‘Process of chemical nickel plating’, US Patent 2,658,839, 1953.
- Gutzeit G. and Krieg A. : ‘Process of chemical nickel plating and bath therefor’, US Patent 2,658,841, 1953.
- Gutzeit G. : ‘Processes of chemical nickel plating and baths therefor’, US Patent 2,694,019, 1954.
- Barrington T. P. and Crehan W. J. : ‘Chemical nickel plating methods and apparatus’, US Patent 2,717,218, 1955.
- Jendrzynski H. J. and Stapleton T. F. : ‘Nickel plating by chemical reduction’, US Patent 2,721,814, 1955.
- Barrington T. P. : ‘Processes of chemical nickel plating’, US patent 2,766,138, 1956.
- Eisenberg P. H. and Raleigh D. O. : ‘Electroless deposition of vanadium alloys’, US Patent 2,828,227, 1958.
- Cahill A. E. and McConnell V. P. : ‘Autocatalytic copper plating process and solution’, US Patent 2,874,072, 1959.
- Miller R. E. : Plat. Surf. Finish., 1987, 74, (12), 52–56.
- Metal Hydrides Inc : ‘Metal plating by chemical reduction with borohydrides’, US Patent 2,942,990, 1960.
- Henri R. : ‘Metal plating process’, US Patent 2,965,551, 1960.
- Shipley C. R. : ‘Method of electroless deposition on a substrate and catalyst solution therefor’, US Patent 3,011,920, 1961.
- Nixon C. F. and Rowe R. J. : ‘Nickel chemical reduction plating bath and method of using same’, US Patent 3,024,134, 1962.
- Leopold C. : ‘Electroless plating process’, US Patent 3,178,311, 1965.
- Pont D. U. : ‘Chemical reduction plating process and bath’, US Patent 3,338,726, 1967.
- Schneble F. W.Jr McCormack J. F. and Zeblisky R. J. : ‘Electroless metal deposition’, US Patent 3,635,758, 1972.
- Schneble F. W.Jr McCormack J. F. and Zeblisky R. J. : ‘Improvements in electroless metal plating’, US Patent 3,959,531, 1976.
- Scannell W. G. : ‘Method of treating electroless nickel plating bath’, US Patent 4,038,085, 1977.
- Gulla M. Shipley C. R.Jr and MacKay H. A. : ‘Electroless nickel plating’, US Patent 4,152,164, 1979.
- Narcus H. : ‘Bright electroless plating process and plated articles produced thereby’, US Patent 4,169,171, 1979.
- Graham A. H. Lindsay R. W. and Read H. J. : J. Electrochem. Soc., 1965, 112, (4), 401–413.
- Narcus H. : Plating, 1967, 54, 380–381.
- Randin J.-P. Maire P. A. Saurer E. and Hintermann H. E. : J. Electrochem. Soc., 1967, 114, 442–445.
- Elmore V. and Davis K. C. : J. Electrochem. Soc., 1969, 116, (10), 1455–1458.
- Marti J. L. and Lanza G. P. : Plating, 1969, 56, (4), 377–385.
- Rondin J.-P. and Hintermann H. E. : J. Electrochem. Soc., 1970, 117, 160–167.
- Muski K. : Met. Finish., 1970, 68, (12), 36–40.
- Feldstein N. and Lancsek T. S. : J. Electrochem. Soc., 1971, 118, 869–874.
- Gabrielli C. and Raulin F. : J. Appl. Electrochem., 1971, 1, 167–177.
- Mallory G. O. : Plating, 1971, 58, 319–327.
- D’Amico J. F. de Angelo M. A. Henrickson J. F. Kenney J. T. and Sharp D. J. : J. Electrochem. Soc., 1971, 118, (10), 1695–1699.
- Gobunora K. M. : J. Electrochem. Soc., 1973, 120, (5), 613–618.
- Lelental M. : J. Electrochem. Soc., 1973, 120, (12), 1650–1654.
- Watanabe T. and Tanabe Y. : Mater. Sci. Eng., 1976, 23, 97–100.
- Büchner W. and Niederprünt H. : Pure Appl. Chem., 1977, 49, 733–743.
- Smith S. F. : Met. Finish., 1979, 77, (5), 60–62.
- Pranas B. : ‘Tin–nickel–phosphorus alloy coatings’, US Patent 3,077,285, 1963.
- Brookshire R. R. : ‘Method of gold plating by chemical reduction’, US Patent 2,976,181, 1961.
- Luce B. M. : ‘Electroless plating of gold’, US Patent 3,300,328, 1967.
- Robert D. : ‘Chemical gold plating composition’, US Patent 3,396,042, 1968.
- Haddad M. M. Rich D. W. and Smith M. C. : ‘Electroless gold plating’, IP.com number: IPCOM000073538D, 1970.
- Photocircuits Corp : ‘Autocatalytic gold plating solutions’, US Patent 3,589,916, 1972.
- Engelhard Minerals & Chemicals Corporation : ‘Electroless gold plating process’, US Patent 3,917,885, 1972.
- Okinaka Y. : ‘A typical electroless procedure’, US Patent 3,700,469, 1972.
- Okinaka Y. : J. Electrochem. Soc., 1973, 120 (6), 739–744.
- Engelhard Minerals & Chemicals Corporation : ‘Electroless gold plating process’, US Patent 3,917,885, 1975.
- Redmond J. P. Andrews D. M. and Guyler K. E. : ‘Gold deposition procedures and substrates upon which gold has been deposited’, US Patent 4,009,297, 1977.
- Franz H. and Vanek J. C. : ‘Electroless gold plating bath’, US Patent 4,091,128, 1978.
- Dunlap W. N. : ‘Control of magnetic properties of deposits from an electroless cobalt solution’, IP.com number: IPCOM000095589D, 1964.
- Kivel J. and Sallo J. S. : J. Electrochem. Soc., 1965, 112, 1201–1203.
- Fisher R. D. : IEEE Trans. Magn., 1966, 2, (4), 681–686.
- Morton V. and Fisher R. D. : J. Electrochem. Soc., 1969, 116, (2), 188–190.
- Pearlstein F. and Weightman R. F. : J. Electrochem. Soc., 1974, 121, 1023–1028.
- Pearlstein F. : ‘Electroless deposition of nickel–phosphorus based alloys’, US Patent 3,485,597, 1969.
- Calligaris E. Callaby R. and Rossello M. : ‘Electroless deposition of nickel, cobalt, copper or iron metal and a bismuth, antimony, lead, tin, titanium, tungsten or chromium salt on a gold, platinum or palladium latent image’, US Patent 3,650,747, 1972.
- Gulla M. : ‘Metal finishing alloy of nickel–copper–phosphorus’, US patent 3,832,168, 1974.
- Richardson Chemical Company: ‘Electroless nickel polyalloy plating baths’, US Patent 4,019,910, 1977.
- Hubbell F. N. : Plat. Surf. Fin., 1978, 65, (12), 58–62.
- Agens M. C. : ‘Process of stabilizing autocatalytic copper plating solutions’, US Patent 2,938,805, 1960.
- Marshall J. H. : ‘Producing metallic deposits’, IP.com number: IPCOM000097434D, 1962 (12/1/1962).
- Brookshire R. R. : ‘Method of copper plating by chemical reduction’, US Patent 3,046,159.
- Agens M. C.Jr : ‘Copper plating process and solutions’, US Patent 3,075,855, 1963.
- John Z. R. : ‘Electroless copper plating’, US Patent 3,095,309, 1963.
- Schneble F. W.Jr McCormack J. F. Zeblisky R. J. Williamson J. D. and Polichette J. : ‘Method for electroless copper plating’, US Patent 3,259,559, 1966.
- Atkinson R. B. : ‘Material and method for electroless deposition of metal’, US Patent 3,310,430, 1967.
- Hall D. W. and Koretzky H. : ‘Electroless deposition of copper’, IP.com number: IPCOM000089920D, 1968.
- Hirohata H. Oita M. and K Honjo : ‘Electroless copper plating process’, US patent 3,532,519, 1970.
- Enthone, Incorporated : ‘Electroless copper plating bath’, US Patent 3,615,736, 1971.
- Schneble F. W.Jr Zeblisky R. J. McCormack J. F. and Williamson J. D. : ‘Electroless copper plating’, US Patent 3,650,777, 1972.
- Underkofler W. L. and Zucconi T. D. : ‘Electroless copper plating’, US Patent 3,844,799, 1974.
- Dutkewych O. B. and Hofman L. A. : ‘Dry replenishment of electroless copper solutions’, US patent 3,770,464, 1973.
- Ohno I. : Surf. Technol., 1976, 4, (6), 515–520.
- Arisato Y. and Koriyama H. : ‘Compositions for chemical copper plating’, US Patent 4,138,267, 1979.
- Shipley C. R.Jr : ‘Method of electroless deposition on a substrate and catalyst solution therefor’, US Patent 3,011,920, 1961.
- DeLong H. K. : ‘Plating on magnesium by electrodeposition and chemical reduction methods’, Proc. 1961 American Electroplaters Society Conv., Boston, MA, USA, June 1961, AES, 16.
- Gutzeit G. : ‘Chemical nickel plating of magnesium and its alloys’, US patent 3,122,578, 1965.
- Hays D. D. : ‘Nickel plating process’, US Patent 3,357,854, 1967.
- Iwasa H. Yokozawa M. and Teramoto I. : J. Electrochem. Soc., 1968, 115, 485–488.
- McBride I. B. M. T. D. B. D. G. and Vlasak G. P. : ‘Activating a nonconductive substrate with sodium borohydride NaBH4, prior to electroless plating’, IP.com number: IPCOM000072570D, 1970.
- Parker K. and Shah H. : J. Electrochem. Soc., 1970, 117, 1091–1094.
- Polichette J. Leech E. J. and Nuzzi F. J. : ‘Sensitized substrates for chemical metallization’, US Patents 3,772,056, 1973.
- Polichette J. and Leech E. J. : ‘Process for the formation of real images and products produced thereby’, US Patent 3,772,078, 1973.
- Haddad M. M. and Schmeckenbecher A. F. : ‘Activation of Catalyst for Electroless Plating on Molybdenum’, IP.com number: IPCOM000086270D, 1976.
- Inaba Y. : ‘Method for electroless plating gold directly on tungsten or molybdenum’, US Patent 3,993,808, 1976.
- G Miller R. and Cavitt R. L. : ‘Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures’, US Patent 4,005,229, 1977.
- Haddad I. B. M. T. D. B. M. M. and Suierveld J. : ‘Depositing crack free heavy electroless nickel Coating’, IP.com number: IPCOM000068520D, 1978.
- Vratny F. : ‘Electroless deposition of nickel on a masked aluminum surface’, US Patent 4,122,215, 1978.
- Baudrand D. W. : Plat. Surf. Finish., 1979, 66 (12), 14–17.
- Mallory G. O. : ‘The fundamental aspects of electroless nickel plating’, in ‘Electroless plating: fundamentals and applications’, 1–55; 1990, Orlando, FL, American Electroplaters and Surface Finishers Society.
- Hersch P. : Trans. Inst. Met. Finish., 1955–1956, 33, 417–422.
- Machu W. and EI-Gendi S. : Metalloberflache, 1959, 13, 97–102.
- de Minjer C. H. : Electrodepos. Surf. Treat., 1975, 3, 261–368.
- Cavallotti P. and Salvago G. : Electrochim. Metall., 1968, 3, (3), 239–266.
- M van der Meeraker J. E. A. : J. Appl. Electrochem., 1981, 11, 395–400.
- Riedel W. : ‘Electroless nickel plating’; 1991, Stevenage, ASM International,
- Paunovic M. : Plating, 1968, 51, 1161–1167.
- Bindra P. and Roldan J. : J. Appl. Electrochem., 1987, 17, 1254–1266.
- Hessami S. and Tobias J. L. : J. Electrochem. Soc., 1989, 136, (12), 3611–3616.
- Gafin A. H. and Orchard S. W. : J. Electrochem. Soc., 1993, 140, (12), 3458–3462.
- Kim Y. S. and Sohn H. J. : J. Electrochem. Soc., 1996, 143, (2), 505–509.
- Stevanovic R. Stevanovic J. and Despic A. : J. Appl. Electrochem., 1999, 29, 747–752.
- Tzeng G. S. : J. Appl. Electrochem., 1996, 26, 969–975.
- Abrantes L. M. and Correia J. P. : J. Electrochem. Soc., 1994, 141, (9), 2356–2360.
- Djokic S. S. : ‘Electroless deposition of metals and alloys’, in ‘Modern aspects of electrochemistry’, (ed. Conway B. E. , White R. E. ), Vol. 35, pp. 51–133; 2002, New York, Kluwer Academic/Plenum.
- Okinaka Y. and Osaka T. : in ‘Electroless deposition processes: fundamentals and applications 3’, p. 55; 1994, New York, VCH.
- Matsubara H. Yonekawa T. Ishino Y. Nishiyama H. Saito N. and Inoue Y. : Electrochim. Acta, 2002, 47, 4011–4018.
- Yarkosky E. F. and Cacciatore P. A. : ‘Method of preparing aluminum memory disks having a smooth metal plated finish’, US Patent 5,141,778, 1992.
- Ernest T. Sorensen R. and Guilinger T. : ‘Effectiveness of nickel plating in inhibiting atmospheric corrosion of copper alloy contacts’, Sandia National Laboratories, Albuquerque, NM, USA, http://www.osti.gov/bridge/servlets/purl/674975-LX14EM/webviewable/ (accessed 18 May 2011).
- Kerr C. Barker D. and Walsh F. C. : Trans. Inst. Met. Finish., 1996, 74, (6), 214–221.
- Kerr C. : ‘Porosity of electroless nickel coatings on mild steel substrates’, PhD thesis, University of Portsmouth, Portsmouth, UK, 1997.
- Reade G. W. Kerr C. Barker D. B. and Walsh F. C. : Trans. Inst. Met. Finish., 1998, 76, (4), 149–156.
- Folkman S. L. and Stevens M. : ‘Characterization of electroless nickel plating on aluminum mirrors’, Proc. SPIE, 2002, 4771, 254–264.
- Mai Q. X. Daniels R. D. and Harpalani H. B. : Thin Solid Films, 1988, 166, 235–247.
- Marshall G. W. Lewis D. B. and Dodds B. E. : Surf. Coat. Technol., 1992, 53, (3), 223–230.
- Parker K. : Plat. Surf. Finish., 1981, 68, (12), 71–76.
- Zhang B. W. Hu W. Y. Zhang Q. L. and Qu X. Y. : Mater. Charact., 1996, 37, 119–122.
- Duncan R. N. and Arney T. L. : Plat. Surf. Finish., 1984, 71, (12), 49–56.
- Yamada T. Yamamoto A. Fujiwara M. and Kunugi Y. : J. Mater. Sci., 1993, 28, (13) 3513–3518.
- Puchi E. S. Staia M. H. Hintermann H. Pertuz A. and Chitty J. A. : Thin Solid Films, 1996, 290–291, 370–375.
- Chitty J. A. Staia M. H. Pertuz A. Hintermann H. and Puchi E. S. : Thin Solid Films, 1997, 308–309, 430–435.
- Berríos J. A. Staia M. H. Hernández E. C. Hintermann H. and Puchi E. S. : Surf. Coat. Technol., 1998, 108–109, 466–472.
- Chitty J. A. Pertuz A. Hintermann H. and Puchi E. S. : J. Mater. Eng. Perform., 1999, 81, 83–86.
- Contreras G. Fajardo C. Berríos J. A. Pertuz A. Chitty J. Hintermann H. and Puchi E. S. : Thin Solid Films, 1999, 355–356, 480–486.
- Gawne D. T. and Ma U. : Wear, 1987, 120, 125–149.
- Parkinson R. : Nickel Dev. Inst. Tech. Ser., 1995. (10081), 1–37.
- Hur K.-H. Jeong J.-H. and Lee D. N. : J. Mater. Sci., 1990, 25, 2573–2584.
- Barker D. : Trans. Inst. Met. Finish., 1993, 71, (3), 121–124.
- Baudrand D. and Bengston J. : Met. Finish., 1995, 93, (9), 55–57.
- Berkh O. Eskin S. and Zahavi J. : Met. Finish., 1996, 94, (3), 35–36.
- Staia M. H. Castillo E. J. Puchi E. S. Lewis B. and Hintermann H. E. : Surf. Coat. Technol., 1996, 86–87, 598–602.
- Apachitei I. Duszczyk J. Katgerman L. and Overkamp P. J. B. : Scr. Metall., 1998, 38, (9), 1347–1353.
- Baudrand D. W. : in ‘Electroless plating’, in ‘ASM handbook’, Vol. 5, ‘Surface engineering’, p. 290; 1994, Materials Park, OH, ASM International.
- Li J. Hu X. G. and Wang D. L. : Plat. Surf. Finish., 1996, 83, 62–67.
- Shawki S. and Hamid Z. A. : Anti-Corros. Meth. Mater., 1997, 44, (3), 178–185.
- Bozzini B. Martini C. Cavallotti P. L. and Lanzoni E. : Wear, 1999, 225–229, 806–813.
- Fernández M. Martínez-Duart J. M. and Albell J. M. : Electrochim. Acta, 1986, 31, (1), 55–60.
- Osaka T. Usuda M. Koiwa I. and Sawai H. : Jpn J. Appl. Phys., 1988, 27, 1885–1891.
- Khan M. R. and Nicholson E. L. : JMMM, 1986, 54–57, (3), 1654–1656.
- Hur K.-H. Jeong J.-H. and Lee D. N. : J. Mater. Sci., 1991, 26, 2037–2044.
- Liu Z. H. Chen H. M. Yang C. and He Y. S. : J. Phys.: Condens. Matter, 1991, 3, 9007–9013.
- Duncan R. N. : Plat. Surf. Finish., 1986, 73, (7), 52–57.
- Levina L. A. Zhogov A. A. Grigor’ev V. S. D’yakov V. G. and Vashin G. Z. : Chem. Petrol. Eng., 1989, 25 (4), 215–219.
- Tomlinson W. J. and Carroll M. W. : J. Mater. Sci., 1990, 25, 4972–4976.
- Doong J. C. Duh J. G. Tsai S. Y. Wang J. H. and Chiou B. S. : Surf. Coat. Technol., 1993, 58, (3), 157–161.
- Zhang B. W. Hu W. Y. Qu X. Y. Zhang Q. L. Zhang H. and Tan Z. S. : Trans. Inst. Met. Finish., 1996, 74 (2), 69–71.
- Balaraju J. N. and Seshadri S. K. : J. Mater. Sci. Lett., 1998, 17, (15), 1297–1299.
- Shoeib M. A. Mokhtar S. M. and Abd El-Ghaffar M. A. : Met. Finish., 1998, 96, (11), 58–59.
- Moonir-Vaghefi S. M. Saatchi A. and Hejazi J. : Met. Finish., 1998, 95 (11), 46–52.
- Hussain M. S. and Such T. E. : Surf. Technol., 1981, 13, 119–124.
- ASM International : ‘ASM handbook’, Vol. 5; 1991, Materials Park, OH, ASM International.
- Shoeib M. A. Mokhtar S. M. and Abd El-Ghaffar M. A. : Met. Finish., 1998, 96, (11), 58–59.
- Yang K. P. and Chen K. M. : Mater. Protect., 1993, 26, (5), 16–18.
- Baudrand D. W. : Plat. Surf. Finish., 1981, 68, (1), 57–60.
- Riedel W. : ‘Electroless nickel plating’, pp. 106–109; 1991, Stevenage, Finishing Publications Ltd & ASM International.
- Zhang B. W. Zhang H. and Tan Z. S. : ‘Comparison of the solderability properties of electroless plating Ni–B, Ni–P and Ni–P–B alloys’, Proc. 1st China Electroless Plating Conf., Nanjing, China, April 1992, Chinese Corrosion and Protection Society, pp. 127–132.
- Zhang B. W. Zhang H. Tan Z. S. and Zhang H. T. : Shanghai Met., 1992, 14, (4), 44–47.
- Hu W. Y. Wang L. L. Wu L. J. Zhang B. W. and Guan H. R. : Trans. Inst. Met. Finish., 1994, 72, (4), 141–145.
- Xie H. W. and Zhang B. W. : Met. Finish., 2001, 99, (1), 40–48.
- Yi X. C. : ‘Electroless gold plating for high density packages’, Proc. Electronic Components and Technology Conf., Atlanta, GA, USA, May 1991, IEEE, pp. 26–29.
- Lee C.-Y. and Lin K.-L. : Jpn J. Appl. Phys., 1994, 33, 4708–4713.
- Lin K.-L. and Jang J.-M. : Mater. Chem. Phys., 1994, 38, (1), 33–41.
- Watanabe H. Abe S. and Honma H. : J. Appl. Electrochem., 1998, 28, 525–529.