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Materials Research Innovations Volume 15, 2011 - Issue sup1
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Original Article

Thermal fatigue test of electronic packages under temperature cycles

X Q Meng Department of Engineering MechanicsShanghai Jiao Tong University, Shanghai, China
,
J Q Xu Department of Engineering MechanicsShanghai Jiao Tong University, Shanghai, China
,
M L Feng Department of Engineering MechanicsShanghai Jiao Tong University, Shanghai, ChinaCorrespondence[email protected]
&
J H Liu Environmental Technology Lab.Daikin Industries, Ltd, Osaka, Japan
Pages s36-s40 | Received 20 Sep 2010, Accepted 15 Nov 2010, Published online: 12 Nov 2013

References

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