Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

References

• Henriksen J., Hienonen R., Imrell T., Leygraf C. and Sjögren L.: ‘Corrosion of electronics (A handbook based on experiences from nordic research project)’, 86; 1991, Swedish Corrosion Institute.
   Google Scholar
• Hienonen R. and Lahtinen R.: ‘Corrosion and climatic effects in electronics’, Vtt Publications, 2007.
   Google Scholar
• Schweigart H.: ‘Humidity and pollution effects on electronic equipment’, CEEES Publication, 2001.
   Google Scholar
• Schimpf C., Feldmann K., Matzner C. and Steinke A.: ‘Failure of electronic devices due to condensation’, Microsyst. Technol., 2009, 15, 123–127.
   Web of Science ®Google Scholar
• Biocca P.: ‘Flux chemistries and thermal profiling considerations in SMT assembly’, National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East), 1999, 2, 971–977.
   Google Scholar
• Hansen K. S., Jellesen M. S., Møller P., Westermann PJS and Ambat R.: ‘Effect of solder flux residues on corrosion of electronics’, Annual reliability and maintainability symposium, 503–509, 2009.
   Google Scholar
• Jellesen M. S., Minzari D., Rathinavelu U., Møller P. and Ambat R.: ‘Corrosion failure due to flux residues in an electronic add-on device’, Eng. Failure Anal., 2010, 17, 1263–1272.
   Web of Science ®Google Scholar
• Zhan S., Azarian M. H., and Pecht M.: ‘Reliability of printed circuit boards processed using no-clean flux technology in temperature – humidity – bias conditions’, IEEE Trans. Device Mater. Reliab., 2008, 8, 426–434.
   Web of Science ®Google Scholar
• Dominkovics C. and Harsányi G.: ‘Effects of flux residues on surface insulation resistance and electrochemical migration’, International Spring Seminar of Electronics Technology, 158–162, 2006.
   Google Scholar
• Tegehall P.-E.: ‘Impact of humidity and contamination on surface insulation resistance and electrochemical migration’, The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects, 227–253, 2011.
   Google Scholar
• Lee K. H., Jukna R., Altpeter J. and Doss K.: ‘Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBA’, Solder. Surf. Mount Technol., 2011, 23, 85–90.
   Web of Science ®Google Scholar
• Sohn J. E. and Ray U.: ‘Weak organic acids and surface insulation resistance’, Circuit World, 1994, 21, 22–26.
   Google Scholar
• Hunt C. and Zou L.: ‘The impact of temperature and humidity conditions on surface insulation resistance values for various fluxes’, Solder. Surf. Mount Technol., 1999, 11, 36–43.
   Web of Science ®Google Scholar
• Schmitt-Thomas K. G. and Schmidt C.: ‘The influence of flux residues on the quality of electronic assemblies’, Solder. Surf. Mount Technol., 1994, 3, 4–7.
   Google Scholar
• Minzari D., Jellesen M. S., Møller P. and Ambat R.: ‘On the electrochemical migration mechanism of tin in electronics’, Corros. Sci., 2011, 53, 3366–3379.
   Web of Science ®Google Scholar
• Minzari D., Grumsen F. B., Jellesen M. S., Møller P. and Ambat R.: ‘Electrochemical migration of tin in electronics and microstructure of the dendrites’, Corros. Sci., 2011, 53, 1659–1669.
   Web of Science ®Google Scholar
• Minzari D.: ‘Investigation of electronic corrosion mechanisms’, 252, PhD thesis, 2010.
   Google Scholar
• Hamann C. H. and Andrew Hamnett W. V.: ‘Electrochemistry’; 2007, Weinheim, Wiley-VCH.
   Google Scholar
• Lj. M. Vračar and D. M. Dražić: ‘Adsorption and corrosion inhibitive properties of some organic molecules on iron electrode in sulfuric acid’, Corros. Sci., 2002, 44, 1669–1680.
   Web of Science ®Google Scholar
• Kern P. and Landolt D.: ‘Adsorption of organic corrosion inhibitors on iron in the active and passive state. A replacement reaction between inhibitor and water studied with the rotating quartz crystal microbalance’, Electroch. Acta, 2002, 47, 589–598.
   Web of Science ®Google Scholar
• Vlaev L. T., Genieva S. D. and Tavlieva M. P.: ‘Concentration dependence of the activation energy of conductivity in aqueous sodium selenite and potassium tellurite’, J. Struct. Chem., 2003, 44, 995–1000.
   Web of Science ®Google Scholar
• Minzari D., Jellesen M. S., Møller P., Wahlberg P. and Ambat R.: ‘Electrochemical migration on electronic chip resistors in chloride environments’, IEEE Trans. Device Mater. Reliab., 2009, 9, 392–402.
   Web of Science ®Google Scholar
• Drogowska M., Brossard L. and Menard H.: ‘Influence of temperature on the electro-dissolution of tin in NaCl aqueous solution at pH4’, J. Appl. Electrochem., 1990, 20, 150–156.
   Web of Science ®Google Scholar
• Hassan H. H. and Fahmy K.: ‘Pitting corrosion of tin by acetate anion in acidic media’, Int. J. Electrochem. Sci., 2008, 3, 29–43.
   Web of Science ®Google Scholar
• Abdel Rehim S. S., Sayyah S. M. and El Deeb M. M.: ‘Corrosion of tin in citric acid solution and the effect of some inorganic anions’, Mater. Chem. Phys., 2003, 80, 696–703.
   Web of Science ®Google Scholar
• Williams T.: ‘The circuit designer’s companion’, EDN Series for Design Engineers, 341; 2005.
   Google Scholar
• Lee Y., Lu W. and Shieu F.: ‘Investigation of thin film end-termination on multilayer ceramic capacitors with base-metal-electrode’, Ceram. Int., 2009, 35, 869–874.
   Web of Science ®Google Scholar
• Krumbein S. J.: ‘Metallic electromigration phenomena’, IEEE Trans. Compon. Hybrids Manuf. Technol., 1987, 11, 5–15.
   Google Scholar
• Lee S., Jung M., Lee H. and Joo Y.: ‘Effect of initial anodic dissolution current on the electrochemical migration phenomenon of Sn solder’, Electr. Compon. Technol. Conf., 2009, 1737–1740.
   Google Scholar