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Materials Science and Technology Volume 27, 2011 - Issue 11
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Original Article

Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint

Z ZengSchool of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu611731, ChinaCorrespondence[email protected]
,
X B LiSchool of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu611731, China
,
L LiSchool of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu611731, China
&
Z H WangSchool of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu611731, China
Pages 1686-1693 | Received 18 Sep 2010, Accepted 18 Sep 2010, Published online: 12 Nov 2013

References

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